Using ps laser pulses with high pulse repetition rates, novel fusion welding technique of Si/glass material combination has been developed, which can overcome the most problems encountered in existing anodic bonding, providing excellent joint strength and throughput. Our technique allows welding of Si/glass without pre-and post-heating at high spatial resolution down to 10µm at maximum joint strength of 80MPa, and is shown to provide much better performance than ns laser pulses based on the analysis of laser-matter interaction. No defects are found by cutting using standard blade dicer and accelerated life test (500 cycles: -40˚C∼85˚C) of the laser-welded joint, demonstrating the welding technique has excellent performance for applications to wafer-level packaging and hermetic sealing.
REFERENCES
1.
G.
Wallis
and D.
Pomerantz
: “Field assisted glass-metal sealing
,” J. Appl. Phys
., 40
, 3946
–3949
(1969
).2.
M.
Esashi
: “Encapsulated micro mechanical sensors,
” Microsyst. Technol
. 1
, 2
–9
(1994
).3.
B.
Ziaie
, J.
Von Arx
, M.
Dokmeci
, and K.
Najafi
, “A hermetic glass–silicon micropackages with high-density on-chip feedthroughs for sensors and actuators
,” J. Microelectromech. Syst
. 5
, 166
–179
(1996
)4.
Y. T.
Cheng
, L.
Lin
, “Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging
,” J. Microelectromech. Syst
., 9
, 3
–8
(2000
).5.
U.M.
Mescheder
, M.
Alavi
, K.
Hiltmann
, Ch.
Lietzau
, Ch.
Nachtigall
and H.
Sandmaier
, “Local laser bonding for low temperature budget
,” Sens. Actuator A 97/98
, 422
–427
(2002
).6.
C.L.
Arnold
, A.
Heisterkamp
, W.
Ertmer
, and H.
Lubatschowski
, “Computational model for nonlinear plasma formation in high NA micromachining of transparent materials and biological cells
,” Sens. Actuator A
120
, 550
–561
(2005
).7.
M.J.
Wild
, A.
Gillner
, and R.
Poprawe
, “Locally selective bonding of silicon and glass with laser,
” Sens. Actuator A
93
, 63
–69
(2001
).8.
F.
Sari
, M.
Rupf
, A.
Gillner1
, R.
Poprawe
, “Advances in selective Laser Radiation Bonding of Silicon and Glass for Microsystems
,” Proc. 3rd WLT-Conference on Laser in Manufacturing 2005
, Munich
(2005
).9.
C.
Luo
, and L.
Lin
, “The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask
”, Sens. Actuator A 97/98
, 398
–404
(2002
).10.
Jong-Seung
Park
, and A.A.
Tseng
, “Transmission laser bonding of glass with silicon wafer
”, Proc. 2004 JUSFA Japan US Symposium on Flexible Automation
, Denver
(2004
).11.
K. M.
Davis
, K.
Miura
, N.
Sugimoto
, and K.
Hirao
, “Writing waveguides in glass with a femtosecond laser
,” Opt. Lett
. 21
, 1729
–1731
(1996
).12.
D.
Homoelle
, S.
Wielandy
, A. L.
Gaeta
, N. F.
Borrelli
, and C.
Smith
, “Infrared photosensitivity in silica glasses exposed to femtosecond laser pulses
,” Opt. Lett
. 24
, 1311
–1313
(1999
)4
13.
T.
Tamaki
, W.
Watanabe
, J.
Nishii
, and K.
Itoh
, “Welding of transparent materials using femtosecond laser pulses
,” Jpn. J. Appl. Phys
. 44
, 687
–L689
(2005
).14.
I.
Miyamoto
, A.
Horn
, and J.
Gottmann
, “Local melting of glass material and its application to direct fusion welding by ps-laser pulses
,” J. Laser Micro/Nanoengineering
2
, 7
–14
(2007
).15.
I.
Miyamoto
, A.
Horn
, J.
Gottmann
, D.
Wortmann
, and F.
Yoshino
, “Fusion welding of glass using femtosecond laser pulses with high-repetition rates
,” J. Laser Micro/Nanoengineering
, 2
, 57
–63
(2007
).16.
T.
Tamaki
, W.
Watanabe
, and K.
Itoh
, “Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm
”, Opt. Express
, 14
, 10469
–10476
(2006
).17.
A.
Horn
, I.
Mingareev
, A.
Werth
, Martin
Kachel
and U.
Brenk
, “Investigations on ultrafast welding of glass-glass and glass-silicon
”, Appl. Phys. A: Materials Science and Precsssing
, 93
, 171
–175
(2008
).18.
I.
Miyamoto
, K.
Cvecek
, and M.
Schmidt
, “Evaluation of nonlinear absorptivity in internal modification of bulk glass by ultrashort laser pulses
,” Opt. Express
19
, 10714
–10727
(2011
).19.
K.
Sugioka
, M.
Iida
, H.
Takai
and K.
Midorikawa
: “Efficient microwelding of glass by double-pulse irradiation of ultrafact laser beam
”, Proc. LPM2011 – 12th Int. Symp. Laser Precision Microfabrication
(2011
)20.
T.
Yoshino
, M.
Matsumoto
, Y.
Ozeki
and K.
Itoh
, “Energy-dependence of temperature dynamics in femtosecond laser microprocessing investigated by time-resolved micro-Raman spectroscopy
”, Proc. LPM 2011 – 12th Int. Symp. Laser Precision Microfabrication
(2011
)21.
K.
Cvecek
, I.
Miyamoto
, J.
Strauss
, M.
Wolf
, T.
Frick
, and M.
Schmidt
, “Sample preparation method for glass welding by ultrashort laser pulses yields higher seam strength
”, Appl. Opt
. 50
, 1941
–1944
(2011
).22.
S.
Richter
, S.
Doring
, A.
Tunnermann
, S.
Nolte
, “Bonding of glass with femtosecond laser pulses at high repetition rates
”, J, Opt. A: Pure Appl. Opt
., 3
, 85
–88
(2001
).23.
I.
Miyamoto
, K.
Cvecek
, and M.
Schmidt
, “Characteristics of laser absorption and welding in FOTURAN glass by ultrashort laser pulses
,” Opt. Express
19
, 22961
–22973
(2011
).24.
W.
Watanabe
, S.
Onda
, T.
Tamaki
, and K.
Itoh
, J.
Nishii
: “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses
”, Appl. Phys. Lett
., 89
, 021106
(2006
)25.
G.E.
Jellison
Jr., and D.H.
Lowndes
, “Optical absorption coefficient of silion at 1.152µ at elevated temperatures
”, Appl. Phys. Lett
., 41
, 594
–596
(1982
).26.
V.
Greco
, F.
Marchesini
, and G.
Molesini
, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates
,” J. Opt. A, Pure Appl. Opt
. 3
, 85
–88
(2001
).
This content is only available via PDF.
© 2012 Laser Institute of America.
2012
Laser Institute of America
You do not currently have access to this content.