On the interaction of the particles of tantalum with a substrate of copper in the cold spray bonding process

Cold gas spraying is a relatively new deposition process in which coatings can be produced without significant heating of the sprayed powder. In contrast to the well-known thermal spray processes such as spray flame and plasma, in cold spray there is no melting of particles prior to impact on the substrate. The adhesion in this process is due solely to the kinetic energy upon the impact. The adhesion usually occurs for particles between 5 and 100 µm diameter sprayed at supersonic velocities, typically between 300 and 1500 m/s [1]. Experimental investigations show that successful bonding is achieved only above a critical velocity that depends on the temperature and physical properties of the sprayed material. For the study of Particle/substrate interaction in the cold-spray bonding process, an experimental simulation of the particlesubstrate reactions at the particle impingement was developed. This simulation is based on laser shock experiments. We used a system of cameras to visualize the state of the interface tantalum/copper in different times.