As a high efficiency laser oxygen thick section cutting technology, the Laser Oxygen Thick Section Cutting (LOTSC) was introduced to compare with the conventional laser oxygen cutting. This paper presents a large number of results of mild steels from 10mm to 30mm cut by LOTSC using disk laser, which involves the effects of standoff distance, laser power and gas pressure. The cutting speed can be reduced with decrease of gas pressure and increase of standoff distance. The maximum cutting speed of LOTSC increased with the laser power, while the optimum and minimum cutting speed decreased with it. The discussion of cut quality is mainly based on the kerf, taper and perpendiculairty. Both the taper and perpendicualirty can be reduced at low gas pressure, high cutting speed and high standoff distance.
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ICALEO 2012: 31st International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
September 23–27, 2012
Anaheim, California, USA
ISBN:
978-0-912035-96-3
PROCEEDINGS PAPER
High efficiency laser oxygen thick section cutting of mild steels using disk laser Available to Purchase
Tao Zhang;
Tao Zhang
1
Institute of Scientific and Technical Information of China, Ministry of Science and Technology
, Beijing, 100038, P.R.China
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Martin Sparkes;
Martin Sparkes
2
Institute for Manufacturing, Department of Engineering, University of Cambridge
, Cambridge, CB3 0FS, UK
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Markus Gross;
Markus Gross
2
Institute for Manufacturing, Department of Engineering, University of Cambridge
, Cambridge, CB3 0FS, UK
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Bill O’Neill
Bill O’Neill
2
Institute for Manufacturing, Department of Engineering, University of Cambridge
, Cambridge, CB3 0FS, UK
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Published Online:
September 01 2012
Citation
Tao Zhang, Martin Sparkes, Markus Gross, Bill O’Neill; September 23–27, 2012. "High efficiency laser oxygen thick section cutting of mild steels using disk laser." Proceedings of the ICALEO 2012: 31st International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2012: 31st International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Anaheim, California, USA. (pp. pp. 1334-1342). ASME. https://doi.org/10.2351/1.5062433
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