Finding ways to scribe Mo back conductor plays an important role in the fabrication and assembly of CIGS thin film solar cells. Using a femtosecond (fs) laser, we selectively removed the Mo thin films of 800 ∼850 nm thick on flexible Polyamide (PI) substrates. In particular, we studied the effect of laser fluence and laser scanning speed on the ablation quality. The single pulse ablation thresholds at various pulse durations were determined. Clean removal of the Mo layer was observed when laser fluence was above the threshold of 0.08-0.1 J/cm2. Furthermore, the morphologies and structure of the grooves were characterized using scanning electron microscope (SEM) and KLA Tencor P-16 Profiler. The femtosecond laser provides a unique scheme to ablate the metal layer on flexible substrates for the fabrication of thin film solar cells.
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ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 23–27, 2011
Orlando, Florida, USA
ISBN:
978-0-912035-94-9
PROCEEDINGS PAPER
Femtosecond laser patterning of Mo thin film on flexible substrate for CIGS solar cells
Qiumei Bian;
Qiumei Bian
1
Industrial and Manufacturing Systems Engineering
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Xiaoming Yu;
Xiaoming Yu
1
Industrial and Manufacturing Systems Engineering
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Baozhen Zhao;
Baozhen Zhao
2
Department of Physics, Kansas State University
, Manhattan, KS 66506, USA
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Zenghu Chang;
Zenghu Chang
2
Department of Physics, Kansas State University
, Manhattan, KS 66506, USA
3
The College of Optics & Photonics, University of Central Florida Orlando
, FL 32816
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Shuting Lei
Shuting Lei
1
Industrial and Manufacturing Systems Engineering
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Published Online:
October 01 2011
Citation
Qiumei Bian, Xiaoming Yu, Baozhen Zhao, Zenghu Chang, Shuting Lei; October 23–27, 2011. "Femtosecond laser patterning of Mo thin film on flexible substrate for CIGS solar cells." Proceedings of the ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Orlando, Florida, USA. (pp. pp. 869-874). ASME. https://doi.org/10.2351/1.5062341
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