Laser microprocessing is key to the development and manufacture of advanced silicon photovoltaics. In this paper a picosecond laser is used to pattern and mark the surface of both textured and non-textured passivated silicon photovoltaics as well as unpassivated silicon wafers. The laser is a master oscillator fiber power amplifier that provides 30 picosecond pulses at 532 nm with pulse energy up to 5 micro-Joules. We evaluate and compare techniques for marking and patterning crystalline-silicon substrates utilizing a conventional Gaussian beam and a flat-top spatially-shaped square beam. We show that SiO2 and SiN passivation layers on both textured and non-textured crystalline-silicon photovoltaics can be removed in arbitrary patterns. We demonstrate that not only can the passivation layers be removed, but the surface of either passivated or unpassivated silicon substrates can be marked in a continuum of shades of gray and in arbitrary patterns. These results demonstrate the promising capability for advanced patterning and marking of photovoltaic devices and for marking of silicon wafers with picosecond fiber lasers.
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ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 23–27, 2011
Orlando, Florida, USA
ISBN:
978-0-912035-94-9
PROCEEDINGS PAPER
Patterning and marking of textured and untextured silicon solar cells using a 532 nm picosecond fiber laser Available to Purchase
Tim D. Gerke;
Tim D. Gerke
1
Fianium Inc.
, 858 W. Park St., Eugene, OR 97401, USA
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Brian Baird
Brian Baird
2
Summit Photonics
, 5829 Jean Road, Lake Oswego, OR 97035, USA
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Published Online:
October 01 2011
Citation
Tim D. Gerke, Brian Baird; October 23–27, 2011. "Patterning and marking of textured and untextured silicon solar cells using a 532 nm picosecond fiber laser." Proceedings of the ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Orlando, Florida, USA. (pp. pp. 862-868). ASME. https://doi.org/10.2351/1.5062340
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