Laser micro-drilling or machining of high aspect ratio features often encountered reducing material removal rate (MRR) with increasing laser power or drill time. The laser ablated material appeared to have difficulties in ejecting out of the deep holes, being blocked by the debris and side walls in the holes. We found that the reduction in MRR also happens to many materials when micro-machining low aspect ratio surface profiles. This paper describes the surface microstructure formation phenomena and its effects on the ablation rate during laser machining of SiC. It was found that four stages of SiC surface modifications were produced, namely melting, ablation, formation of spherical-shaped nodules, and build up of white flake substances. The four regimes were formed depending only on the laser fluence irrespective of the beam power, travel speed and track overlapping density. The results also showed that MRR was highly affected by the formation of different micro-structures on the surface, and that high laser fluence might lead to low MRR.
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ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
September 26–30, 2010
Anaheim, California, USA
ISBN:
978-0-912035-61-1
PROCEEDINGS PAPER
Effects of laser fluence on the micro-structure formation and material removal rate in ablation of silicon carbide
G. C. Lim;
G. C. Lim
Singapore Institute of Manufacturing Technology (SIMTech)
71 Nanyang Drive, Singapore
638075
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Mark A. C. Tan;
Mark A. C. Tan
Singapore Institute of Manufacturing Technology (SIMTech)
71 Nanyang Drive, Singapore
638075
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C. W. Tan;
C. W. Tan
Singapore Institute of Manufacturing Technology (SIMTech)
71 Nanyang Drive, Singapore
638075
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H. Y. Zhong
H. Y. Zhong
Singapore Institute of Manufacturing Technology (SIMTech)
71 Nanyang Drive, Singapore
638075
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Published Online:
September 01 2010
Citation
G. C. Lim, Mark A. C. Tan, C. W. Tan, H. Y. Zhong; September 26–30, 2010. "Effects of laser fluence on the micro-structure formation and material removal rate in ablation of silicon carbide." Proceedings of the ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Anaheim, California, USA. (pp. pp. 799-805). ASME. https://doi.org/10.2351/1.5062118
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