Laser cutting is the most widely implemented application of lasers in industry. The many advantages of this process stimulate users in industry to try this technique to cut anything they may need. Some of these materials are different kinds of wood, which are being cut with excellent results and productivity. The radiation of CO2 lasers is highly absorbed by cellulose of woods, so the main cutting mechanism is chemical degradation of this organic constituent by the laser radiation. Wood is also substituted in many applications for some cheaper composites derived from wood residues. Some of the most widely used are the well-know particleboard and medium density fiberboard (MDF), using aminoplastics or phenolic resins as binder of the wood chips. Phenolic resins are also the main constituent of a new kind of composite which is formed as a board, substituting wood in highly aggressive environments. But laser cutting of wood and phenolic resin panels involves a serious healthy hazard since their combustion and decomposition may produce aerosols (fumes, smokes and mists) and organic vapors which can be toxic and carcinogenic. Unfortunately, information about decomposition byproducts of these resins under laser irradiation is not available in order to accomplish with safety codes. In the present work we study laser cutting of particleboard and phenolic resin panels, evaluating the health hazard of the byproducts according to the United States Occupational Safety and Health Administration.
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ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
September 26–30, 2010
Anaheim, California, USA
ISBN:
978-0-912035-61-1
PROCEEDINGS PAPER
Laser cutting of phenolic resin panels: Identification of potential hazards
Félix Quintero;
Félix Quintero
Applied Physics Dept., University of Vigo
, Lagoas-Marcosende, 36310-Vigo, Spain
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Antonio Riveiro;
Antonio Riveiro
Applied Physics Dept., University of Vigo
, Lagoas-Marcosende, 36310-Vigo, Spain
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Fernando Lusquiños;
Fernando Lusquiños
Applied Physics Dept., University of Vigo
, Lagoas-Marcosende, 36310-Vigo, Spain
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Rafael Comesaña;
Rafael Comesaña
Applied Physics Dept., University of Vigo
, Lagoas-Marcosende, 36310-Vigo, Spain
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Juan Pou
Juan Pou
Applied Physics Dept., University of Vigo
, Lagoas-Marcosende, 36310-Vigo, Spain
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Published Online:
September 01 2010
Citation
Félix Quintero, Antonio Riveiro, Fernando Lusquiños, Rafael Comesaña, Juan Pou; September 26–30, 2010. "Laser cutting of phenolic resin panels: Identification of potential hazards." Proceedings of the ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Anaheim, California, USA. (pp. pp. 347-353). ASME. https://doi.org/10.2351/1.5062049
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