Micro-holes of 100 to 300 μm diameters have been drilled on plates of cemented tungsten carbide of 0.5 to 1mm thick using ultrashort laser pulses. Laser was scanned by a galvano-scanner with scan speed of 0.035 to 15 mm/s and focused by lens with 80 mm focal length. Effects of scan speed, focus position and polarization of the laser, linear vs. circular, were examined. It is found that the polarization of the laser has profound effects on the shape of the drilled hole: circularly polarized laser results in more straight, less tapered holes than the linearly polarized one in shorter times. Position of the focus relative to the sample surface affects to the hole shape, too. Periodic surface structures with 260 to 300 nm periods are formed on the side of drilled holes regardless the polarization of the laser.
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ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
September 26–30, 2010
Anaheim, California, USA
ISBN:
978-0-912035-61-1
PROCEEDINGS PAPER
Micro-hole drilling on cemented tungsten carbide by ultrashort laser pulses Available to Purchase
Khai Pham Xuan;
Khai Pham Xuan
Department of Mechanical Engineering, Nagaoka University of Technology 1603-1
, Kamitomioka, Nagaoka, Niigata 940-2188, Japan
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Kazuya Saginawa;
Kazuya Saginawa
Department of Mechanical Engineering, Nagaoka University of Technology 1603-1
, Kamitomioka, Nagaoka, Niigata 940-2188, Japan
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Rie Tanabe;
Rie Tanabe
Department of Mechanical Engineering, Nagaoka University of Technology 1603-1
, Kamitomioka, Nagaoka, Niigata 940-2188, Japan
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Yoshiro Ito
Yoshiro Ito
Department of Mechanical Engineering, Nagaoka University of Technology 1603-1
, Kamitomioka, Nagaoka, Niigata 940-2188, Japan
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Published Online:
September 01 2010
Citation
Khai Pham Xuan, Kazuya Saginawa, Rie Tanabe, Yoshiro Ito; September 26–30, 2010. "Micro-hole drilling on cemented tungsten carbide by ultrashort laser pulses." Proceedings of the ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Anaheim, California, USA. (pp. pp. 1270-1275). ASME. https://doi.org/10.2351/1.5061970
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