Micro shockwave adjustment is a process mechanism which can be used for highly precise actuator adjustment with bending angle accuracies exceeding 0.1 µrad in different materials. The specific interaction between focussed ultrashort laser pulse and irradiated material allows inducing this process mechanism by ablation with high pulse energy. Within this paper, an analysis based on models of ultrashort laser pulse-material interaction is presented and compared to experimental results. Actuators based on capacitive distance sensing are used to discuss the long-term stability of this process mechanism. Furthermore virtually free-form mirrors fabricated by micro shockwave bending are presented as another possible application of this process mechanism besides micro adjustment.
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ICALEO 2009: 28th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
November 2–5, 2009
Orlando, Florida, USA
ISBN:
978-0-912035-59-8
PROCEEDINGS PAPER
Analysis and application of micro shockwave adjustment using ultrashort laser pulses Available to Purchase
Peter Bechtold;
Peter Bechtold
1
Chair of Photonic Technologies, Friedrich-Alexander-University
Erlangen-Nuremburg Paul-Gordan-Str. 3, 91052 Erlangen, Germany
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Stephan Roth;
Stephan Roth
2
Bayerisches Laserzentrum GmbH
, Konrad-Zuse-Str. 2-6, 91052 Erlangen, Germany
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Michael Schmidt
Michael Schmidt
1
Chair of Photonic Technologies, Friedrich-Alexander-University
Erlangen-Nuremburg Paul-Gordan-Str. 3, 91052 Erlangen, Germany
2
Bayerisches Laserzentrum GmbH
, Konrad-Zuse-Str. 2-6, 91052 Erlangen, Germany
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Published Online:
November 01 2009
Citation
Peter Bechtold, Stephan Roth, Michael Schmidt; November 2–5, 2009. "Analysis and application of micro shockwave adjustment using ultrashort laser pulses." Proceedings of the ICALEO 2009: 28th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2009: 28th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Orlando, Florida, USA. (pp. pp. 1124-1133). ASME. https://doi.org/10.2351/1.5061462
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