Since 60’s laser drilling is an industrial application to drill sub-millimeter holes in metallic target. However, it is still not easy to drill hole in targets which have complex geometry of internal cavity. The difficulty is to not impact the opposable wall of the cavity. This paper deals with the study of hole transmission in function of peak power and target thickness. Holes are drilled with a millisecond laser source in percussion regime. For this study the metallic targets thickness drilled is from 1 to 20 mm. The transmission is measured with the help of a photodiode. Results reveal that very simple equations describe the laser transmission through a breaking through hole and a drilling threshold is estimated. The laser transmission is constant until a drilled depth depending on peak power. The transmission decreases because laser make reflexions on hole whole.
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ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 20–23, 2008
Temecula, California, USA
ISBN:
978-0-912035-12-3
PROCEEDINGS PAPER
Laser transmission through a hole
Matthieu Schneider;
Matthieu Schneider
(1)
Laboratoire pour l’Application des Lasers de Puissance (UPR CNRS 1578)
16 bis Avenue Prieur de la Côte d’Or 94114 Arcueil France
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Laurent Berthe;
Laurent Berthe
(1)
Laboratoire pour l’Application des Lasers de Puissance (UPR CNRS 1578)
16 bis Avenue Prieur de la Côte d’Or 94114 Arcueil France
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Maryse Muller;
Maryse Muller
(1)
Laboratoire pour l’Application des Lasers de Puissance (UPR CNRS 1578)
16 bis Avenue Prieur de la Côte d’Or 94114 Arcueil France
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Rémy Fabbro
Rémy Fabbro
(1)
Laboratoire pour l’Application des Lasers de Puissance (UPR CNRS 1578)
16 bis Avenue Prieur de la Côte d’Or 94114 Arcueil France
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Published Online:
October 01 2008
Citation
Matthieu Schneider, Laurent Berthe, Maryse Muller, Rémy Fabbro; October 20–23, 2008. "Laser transmission through a hole." Proceedings of the ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Temecula, California, USA. (pp. P109). ASME. https://doi.org/10.2351/1.5061425
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