We describe rapid prototyping of a micro-channel branching network into silicon wafer with a femtosecond pulsed fiber laser. The branching network is designed as a blood oxygenator. This network bifurcates according to Murray’s Law over 9 generations with depths ranging from 50µm to 320µm, and satisfies the necessity of equal path lengths. In development of such micro-fluidic structures, Minimal thermal damage and associated debris of femtosecond pulses provides better machined quality and resolution than IR nanosecond pulses. In combination with a galvanometric scanning system, overall fabrication speed is increased using a high repetition rate femtosecond laser. Influences of operating parameters, such as the pulse energy, the focal position, the scan speed, and the number of scan passes, on the depth and the surface roughness of micro-channels are investigated. Based on the result, combinations of laser parameters are selected to realize designed branching networks.
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ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 20–23, 2008
Temecula, California, USA
ISBN:
978-0-912035-12-3
PROCEEDINGS PAPER
Laser micromachining of microchannel branching networks into silicon with a femtosecond fiber laser
DongHyuck Kam;
DongHyuck Kam
1
Center for Lasers and Plasmas in Advanced Manufacturing, University of Michigan at Ann Arbor
, Michigan, 48109, USA
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Lawrence Shah;
Lawrence Shah
2
IMRA America, Inc
, USA, Ann Arbor, Michigan, 48105, USA
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Jyoti Mazumder
Jyoti Mazumder
1
Center for Lasers and Plasmas in Advanced Manufacturing, University of Michigan at Ann Arbor
, Michigan, 48109, USA
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Published Online:
October 01 2008
Citation
DongHyuck Kam, Lawrence Shah, Jyoti Mazumder; October 20–23, 2008. "Laser micromachining of microchannel branching networks into silicon with a femtosecond fiber laser." Proceedings of the ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Temecula, California, USA. (pp. M506). ASME. https://doi.org/10.2351/1.5061386
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