The paper discusses the fundamental interaction between laser light and crystalline silicon within a broad range of laser parameters, especially the pulse duration, with relevance for cutting and drilling. For laser processing of silicon the absorption at the laser wavelength and the sensitivity of the material to thermal stresses are dominant. Using laser sources with wavelengths near the indirect band-gap and with rising temperatures the optical behaviour of silicon changes significantly. A comparison of processing with different pulse durations at the same wavelength from ultra-short picosecond pulses up to microsecond pulses is presented. The material removal processes such as melt ejection and vaporization are studied. The influence of the laser radiation wavelength on the processing is briefly discussed. The relevance of this work for some applications, like wafer dicing in the electronics industry and photovoltaic applications will be discussed as well.
Skip Nav Destination
ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 20–23, 2008
Temecula, California, USA
ISBN:
978-0-912035-12-3
PROCEEDINGS PAPER
Influence of laser wavelength and pulse duration on processing of crystalline silicon
Oliver Haupt;
Oliver Haupt
Laser Zentrum Hannover (LZH)
, Hollerithallee 8, D-30419, Hannover, Germany
Search for other works by this author on:
Aart Schoonderbeek;
Aart Schoonderbeek
Laser Zentrum Hannover (LZH)
, Hollerithallee 8, D-30419, Hannover, Germany
Search for other works by this author on:
Lars Richter;
Lars Richter
Laser Zentrum Hannover (LZH)
, Hollerithallee 8, D-30419, Hannover, Germany
Search for other works by this author on:
Rainer Kling;
Rainer Kling
Laser Zentrum Hannover (LZH)
, Hollerithallee 8, D-30419, Hannover, Germany
Search for other works by this author on:
Andreas Ostendorf
Andreas Ostendorf
Laser Zentrum Hannover (LZH)
, Hollerithallee 8, D-30419, Hannover, Germany
Search for other works by this author on:
Published Online:
October 01 2008
Citation
Oliver Haupt, Aart Schoonderbeek, Lars Richter, Rainer Kling, Andreas Ostendorf; October 20–23, 2008. "Influence of laser wavelength and pulse duration on processing of crystalline silicon." Proceedings of the ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Temecula, California, USA. (pp. M504). ASME. https://doi.org/10.2351/1.5061384
Download citation file:
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.