Debris-free laser dicing for multi-layered mems

We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of multi-layered MEMS as well as improves yields [1]. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Nd:YVO₄ laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO₂ laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide for the separation. The diced lines completely followed the pre-fabricated internal transformation.