Recent advances in precision machining of various materials with the laser microjet^®

Laser micromachining employs ultra short pulsed or UV lasers to overcome problems of thermal damage and debris formation. However, the main obstacles in using these types of laser are notably, low ablation rates and high running costs. This paper describes some recent advances made in the precision machining of industrial materials, using the unique capabilities of the Synova Laser Microjet^® technology. Tests carried out with the water jet-guided laser, for industrial customers show superior results in terms of high precision cutting quality, combined with high speed, as well as negligible heat damage, or contamination problems. The tests, prove this technology is highly suited for materials that are otherwise, difficult to process, or that yield poor results with today’s conventional methods. The results presented are for precision dicing and cutting of 900μm moulded wafer and mould compound, cutting optical elements from 250μm silicon wafer and cutting and grinding of 700-830μm silicon wafer, all for the semiconductor industry, cutting 200μm brass watch hands, cutting of 200μm Nitinol for medicinal stents, cutting 5mm stainless steel tubing for medicinal use in endoscopy and cutting of up to 8mm PCD/WC or CBN/WC materials for the machine tool industry.