A selective direct patterning process of multilayer using deep UV laser

A traditional pattern making processes by exposure process require PR coating, exposure, develop, etching and PR strip. This causes high equipment cost, running cost and environment pollution. A laser selective direct patterning can be the good alternatives for those typical processes to overcome the above issues. The patterns on a small mask are projected onto a substrate by the almost homogenized beam of deep UV laser. This process can ablate only the selected layers clearly by the required depth. The experimental investigations are discussed for obtaining the optimal process condition to ablate selectively the multiple layers in this paper.