Microvias drilling in polymer-copper-polymer multilayer substrate for high density electronic packaging applications is studied in this paper. Frequency doubled Nd:YAG laser (532 nm) is used for the simulation and experiment. Numerical thermal model is built to simulate the drilling process. Volumetric heating and laser self defocusing due to drilling front profile are considered in the model. Due to the low absorption coefficient of the polymer material for the green laser, the polymer-copper interface absorbs a great portion of the laser energy. Thus the drilling mechanism involves thermal phase change, chemical decomposition, and possibly explosion due to rapid thermal expansion and vaporization inside the polymer material. Experimental results show that the material is removed explosively due to high internal pressures.
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ICALEO 2007: 26th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 29–November 1, 2007
Orlando, Florida, USA
ISBN:
978-0-912035-88-8
PROCEEDINGS PAPER
Microvia drilling with a green laser Available to Purchase
Chong Zhang;
Chong Zhang
1
Center for Research and Education in Optics and Lasers (CREOL), Department of Mechanical, Materials and Aerospace Engineering, University of Central Florida
, Orlando, Florida 32816-2700, USA
, E-mail: [email protected]
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Nathaniel R. Quick;
Nathaniel R. Quick
2
AppliCote Associates, LLC
, 1445 Dolgner Place, Ste. 23, Sanford, FL 32771, USA
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Aravinda Kar
Aravinda Kar
1
Center for Research and Education in Optics and Lasers (CREOL), Department of Mechanical, Materials and Aerospace Engineering, University of Central Florida
, Orlando, Florida 32816-2700, USA
, E-mail: [email protected]
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Published Online:
October 01 2007
Citation
Chong Zhang, Nathaniel R. Quick, Aravinda Kar; October 29–November 1, 2007. "Microvia drilling with a green laser." Proceedings of the ICALEO 2007: 26th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2007: 26th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Orlando, Florida, USA. (pp. M1006). ASME. https://doi.org/10.2351/1.5061108
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