Advanced solid-state lasers rely on diode laser pump sources. In particular, for industrial customers, cost and reliability of the laser systems are of upmost importance. Improved diode laser pumps significantly contribute to this. To fulfill all customer requirements, not only output power, but the complete diode laser assembly must be optimized. Diode laser bars are the most cost-effective solution, because of their integration on the chip level as compared to single-emitter diode lasers. Packaging and cooling technologies must be integrated with chip design for optimum overall performance.
We demonstrate diode laser operation at 200 W and 60 °C junction temperature when mounted to a micro-channel heat sink. As we use stable AuSn hard-solder long-term operation even in fast power modulation mode is ensured. In cases when established micro-channel coolers are not accepted, these diode laser can operate at a derated output of 150 W on passive heat sinks.