The improvement of pattern resolution for microsystems fabrication is certainly a proven method for increasing of micro and nanostructure density. Our novel laser technology applications could be applied for thin metal or alloy films on polymer substrates, which could be structured directly with the laser direct patterning process. The system concept is introduced and patterning results are discussed. Furthermore possible applications are described. So is possible to manufacture ultrafine conductive or reflective structures down to 15µm in an economical and environmentally friendly way. Increasing demand on the accuracy of microsystems and sensors require microstructures with lines and spaces of down of approximately 5-100µm. The processing model by UV laser ablation shown for direct patterning of metal or alloy films on polymer substrates. The processing flowchart and economic efficiency of laser patterning have been detailed presented on the paper. The results of experiments by analysis of answers of a variety of metal layers on different substrates with all the technical features of processing are specified. As particular applications of laser direct patterning we will present on the paper the new approach which was been developed too for prototyping of MCM-Lsd for two different processing as the gap cutting and line cutting process.

1.
D.
Ulieru
: “
Final report project INCOPERNICUS ERBIC IC 15 CT 96-0737-PROSLAB 2001
”, pp.
100
130
.
2.
D.
Ulieru
: “
Comparative analysis of silicon wafer micromachining versus nonconventional technology Micromachining and Microfabrication” Symposion
21/24 oct
.
2001
San Francisco
3.
E.
Manea
,
I.
Cernica
,
M.
Lupu
,
C.
Podaru
Optimization of deep wet etching borosilicate glass substrates technological process
2003 Int’l Semiconductor Conference (CAS 2003), Proceedings IEEE
28Sep./2Oct
.
2003
,
Sinaia, Romania
4.
G.
Moagăr-Poladia
,
D.
Ulieru
,
C.
Sandu
,
M.
Bulinski
,
A.
Dinescu
,
M.
Dănila
,
R.
Gavrilă
: “
Microengraving of a potassium dihydrogen phosphate crystal by laser ablation technique
MEMS, MOEMS and Micromachining Session Photonics Europe
26-30 April 2004
Strasburg, France
5.
I.
Apostol
,
D.
Ulieru
,
R.
Dabu
,
C.
Ungureanu
,
L.
Rusen
, “
Laser cleaning in the process of electronic device production
”;
ALT ’01 International Conference on Advanced Laser Technologies Proc. Of SPIE
Vol.
4762
, pp.
235
238
, (
2002
)
6.
D.
Ulieru
: “
Laser patterining and vias generation of printed circuits boards MEM’s LSI
”,
International Interconnect Technology Conference
5-7 June
San Francisco
7.
I.
Cernica
,
E.
Manea
,
D.
Ulieru
: “
Some aspects of substrates microconfiguration for MCM’s applications using laser technologies
”,
Int’l Semiconductor Conference CAS
2003
, pp.
163
166
Proceedings IEEE
28Sep./2Oct. 2003
,
Sinaia, Romania
.
8.
A.
Ciuciumis
,
Antoaneta
Folea
,
Dorel
Radu
Unconventional processing technique for ceramic materials
”,
Annual Conference for Semiconductors (CAS)
,
Septembrie 2003
,
Sinaia, Romania
.
This content is only available via PDF.
You do not currently have access to this content.