Nanoscale structuring is a promising area in which the easiest and effective processing methods are being developed. Based on the advantage of lasers, associated with improved self-assembly technique, it is very effective to fabricate nanoscale structures, such as 3-D photonic bandgap structures, using laser-assisted imprinting method, even on the materials with high hardness and high melting point, such as silicon. This new approach to fabricate 3-D photonic bandgap structures on silicon will be presented. Self-assembly technique was used to deposit multi-layer of silica microparticles with a size of 0.81 µm. A pulsed KrF excimer laser (23ns, 248 nm) was applied as the imprinting energy source.
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