With the trend to ever smaller features the use of UV-wavelength for micromachining and micro-structuring applications in microelectronics-and semiconductor industry is steadily increasing. The use of excimer laser in combination with optimized UV-beam delivery systems presents the direct path to micromachining with highest resolution. Recent advances in excimer laser technology have greatly reduced the maintenance effort by extension of the gas lifetime and laser tube lifetime. With these new performance levels of advanced excimer laser and highly efficient UV-beam delivery systems, the excimer laser presents the cost effective solution for various applications in this industries. In this paper an update on excimer laser technology and on improved performance is given.
Skip Nav Destination
ICALEO 2005: 24th International Congress on Laser Materials Processing and Laser Microfabrication
October 31–November 3, 2005
Miami, Florida, USA
ISBN:
978-0-912035-82-6
PROCEEDINGS PAPER
UV-micromachining by excimer laser Available to Purchase
Rainer Paetzel;
Rainer Paetzel
1
Lambda Physik
, Hans-Boeckler-Strasse 12, 37079 Goettingen, Germany
Search for other works by this author on:
Thorsten Geuking;
Thorsten Geuking
1
Lambda Physik
, Hans-Boeckler-Strasse 12, 37079 Goettingen, Germany
Search for other works by this author on:
Jan Brune;
Jan Brune
1
Lambda Physik
, Hans-Boeckler-Strasse 12, 37079 Goettingen, Germany
Search for other works by this author on:
Helmut Schillinger
Helmut Schillinger
2
TuiLaser AG
, Zielstattstrasse 32, 81379 Munich, Germany
Search for other works by this author on:
Published Online:
October 01 2005
Citation
Rainer Paetzel, Thorsten Geuking, Jan Brune, Helmut Schillinger; October 31–November 3, 2005. "UV-micromachining by excimer laser." Proceedings of the ICALEO 2005: 24th International Congress on Laser Materials Processing and Laser Microfabrication. ICALEO 2005: 24th International Congress on Laser Materials Processing and Laser Microfabrication. Miami, Florida, USA. (pp. M202). ASME. https://doi.org/10.2351/1.5060531
Download citation file:
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.