With the trend to ever smaller features the use of UV-wavelength for micromachining and micro-structuring applications in microelectronics-and semiconductor industry is steadily increasing. The use of excimer laser in combination with optimized UV-beam delivery systems presents the direct path to micromachining with highest resolution. Recent advances in excimer laser technology have greatly reduced the maintenance effort by extension of the gas lifetime and laser tube lifetime. With these new performance levels of advanced excimer laser and highly efficient UV-beam delivery systems, the excimer laser presents the cost effective solution for various applications in this industries. In this paper an update on excimer laser technology and on improved performance is given.

1.
Material Removal Rates of Biocompatible Polymers During Laser Ablation
Simon
Zhou
,
Marvin
Kilgo
,
Tamarack Scientific Co.
,
Anaheim, Ca, USA
2.
B.
Keiper
,
R.
Ebert
,
R.
Böhme
,
H.
Exner
;
Proceedings of SPIE
5116
,
20
27
(
2003
)
3.
P.R.
Herman
et al,
OSA TOPS, Conf. Lasers and Electro-Optics Tech. Digest
574
(
2001
)
4.
Dirk
Basting
,
Gerd
Marowsky
;
Excimer Laser Technology
,
Spinger
ISBN 3-540-20056-8
This content is only available via PDF.
You do not currently have access to this content.