Laser-based grout removal processes have been investigated by using high power diode lasers (HPDL) [1-5]. Previous studies revealed, that the predominant cause of the material removal are thermally induced chemical reactions occurring within the material during the process.

In this work, a 6.5×11 mm2 rectangular laser beam (cw HPDL, λ=808 nm and 940 nm, 1:1 ratio, maximum output power=1.5 kW) operating at a power of 400 W and traversing at a speed of 10 mm/s with O2 assist gas of, was found to give a removal of standard tile grout without damaging tiles. The temperature profiles within the material and the resultant geometry of the removal area as a result of interaction was verified by a thermal analysis using the finite differential numerical model described elsewhere [6]. Furthermore, a Class 1 portable hand-held device was designed following ISO safety standards.

Topics
Lasers, Thermal analysis, Numerical methods
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2004
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