Micro-via drilling technologies have been implemented in printed circuit board manufacturing industry for high density interconnects and integrated circuit packaging applications and are challenged with ever-tighter requirement in quality, throughput and cost efficiency. This paper reports the current status and progress of the micro-vias drilling applications in this field with solid-state harmonic UV laser drill systems, with emphasis on such issues as UV laser interactions with different materials, quality control and throughput improvement.

Topics
Integrated circuits, Printed circuit board, Quality assurance, Lasers
1.
Owen
,
M.
,
New laser technology for drilling through and blind microvias in copper clad reinforced circuit boards
,
Proceedings of IPC Technical Conference
,
San Diego
,
April 30-May 4, 1995
; pp.
P19-1-1
–
P19-1-10
.
2.
Cable
,
A.
,
New laser processes and wavelengths for drilling through hole and blind vias in a wide range of circuit board materials
,
Proceedings of IPC Technical Conference
,
San Jose
,
March 3-4, 1996
; pp.
S18-5-1
–
S18-5-9
.
3.
Owen
,
M.
,
Eliminating X-Ray alignment, desmear, and electroless copper process steps using UV YAG laser drilled microvias
,
Proceedings of IPC Technical Conference
,
San Jose
,
April 30-May 4, 1997
; pp.
S15-1-1
–
S15-1-6
.
4.
Raman
,
S.
 and
Schreiner
,
A. F.
,
UV laser drilling of multiplayer blind vias
,
Proceedings of IPC Technical Conference
,
Long Beach
,
April 26-30, 1998
; pp.
S17-1-1
–
S17-1-7
.
5.
Dunsky
,
C.
,
Matsumoto
,
H.
 and
Simenson
,
G.
,
High speed microvia formation with UV solid state lasers
,
Riken Review
, No.
43
, January
2002
, pp.
80
–
87
.
Google Scholar
 
6.
Srinivasan
,
R.
 and
Braren
,
B.
,
Ultraviolet laser ablation of organic polymers
,
Chem. Rev.
, vol.
89
,
1989
; pp.
1303
–
1316
.
https://doi.org/10.1021/cr00096a003
Google Scholar
Crossref
Search ADS
 
7.
Govorkov
,
S.V.
,
Slobodtchikov
,
E.V.
,
Wiessner
,
A.O.
 and
Basting
,
D.
,
High throughput micromachining of steel and ceramics with solid state UV laser
,
Proceedings of SPIE: High Power Laser Ablation III
, vol.
4605
,
August 2000
; pp.
790
–
800
.
Crossref
Search ADS
 
8.
Dunsky
,
C.
,
Matsumoto
,
H.
 and
Larson
,
B.
,
High quality microvia formation with imaged UV YAG lasers
,
Proceedings of IPC Technical Conference
,
San Diego
,
April 4-6, 2000
; pp.
S15-5-1
–
S15-5-14
.
9.
Nonhof
,
C. J.
,
Materials processing with Nd-lasers
,
Electrochemical Publications Limited
,
1988
; pp.
165
–
166
; pp.168.
Google Scholar
 
This content is only available via PDF.
© 2003 Laser Institute of America.
2003
Laser Institute of America
You do not currently have access to this content.