A laser induced shock cleaning technology as a new dry cleaning methodology has been applied to remove the chemical-mechanical polishing (CMP) slurries from silicon wafer surfaces. After CMP process using the slurries, the slurry particles should be removed from the surface in order to avoid the circuit failure and enhance the yield. The well-distributed remaining silica particles were attempted to remove from the surface by using laser induced plasma shock waves. In order to evaluate the cleaning performance quantitatively, the number of particles on the wafer surfaces were measured by surface scanner before and after cleaning. It was found that most of the silica particles on the wafer surface were removed after the treatment of laser induced shock waves. The average removal efficiency of the particles was 99 % over. It was found that cleaning performance is strongly dependent on a gap distance between laser focus and the surface and a suitable control of the gap is crucial for the successful removal of the particles.
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ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication
October 14–17, 2002
Scottsdale, Arizona, USA
ISBN:
978-0-912035-72-7
PROCEEDINGS PAPER
Laser induced shock cleaning of silicon wafers Available to Purchase
J. M. Lee;
J. M. Lee
*
Laser Engineering Group, IMT Co.
Ltd
., P.O. Box 25, Yongin, Kyunggi-Do, 449-860, Korea
,
E-mail: [email protected]
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S. H. Cho;
S. H. Cho
*
Laser Engineering Group, IMT Co.
Ltd
., P.O. Box 25, Yongin, Kyunggi-Do, 449-860, Korea
,
E-mail: [email protected]
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J. G. Park;
J. G. Park
**
Dept. of Metallurgy & Materials Engineering,
Hanyang University
, Kyungg-Do, 425-791, Korea
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S. H. Lee;
S. H. Lee
**
Dept. of Metallurgy & Materials Engineering,
Hanyang University
, Kyungg-Do, 425-791, Korea
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Y. J. Kang;
Y. J. Kang
**
Dept. of Metallurgy & Materials Engineering,
Hanyang University
, Kyungg-Do, 425-791, Korea
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Y. P. Han;
Y. P. Han
***
Semiconductor R&D division, Samsung
Electronics Co. Ltd
., Kunggi-Do, 449-711, Korea
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S. Y. Kim
S. Y. Kim
***
Semiconductor R&D division, Samsung
Electronics Co. Ltd
., Kunggi-Do, 449-711, Korea
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Published Online:
October 01 2002
Citation
J. M. Lee, S. H. Cho, J. G. Park, S. H. Lee, Y. J. Kang, Y. P. Han, S. Y. Kim; October 14–17, 2002. "Laser induced shock cleaning of silicon wafers." Proceedings of the ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication. ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication. Scottsdale, Arizona, USA. (pp. 164616). ASME. https://doi.org/10.2351/1.5066164
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