Further progress in micro-technology depends on the ability to create features of micron and sub-micron dimension. Photo-lithography, ablation, photo-polymerization are the processes, which are hard to imagine without an use of lasers. For micromachining of transparent and other material two diverse techniques are applied: deep-UV nanosecond and infrared ultrafast (femtosecond) pulse lasers. Excimer lasers are good sources of UV light, but require mask projection for processing. Usage of hazardous gases and a short maintenance period are their disadvantages. Ablation with femtosecond (fs) pulses takes place almost without thermal influence, but fs-lasers with a chirped pulse amplification system are complicated equipment for industrial applications. That is the reason, why their usage is limited to scientific laboratories.
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ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication
October 14–17, 2002
Scottsdale, Arizona, USA
ISBN:
978-0-912035-72-7
PROCEEDINGS PAPER
UV (ultraviolet) ps (picosecond)-laser with high peak power for micromachining Available to Purchase
Saulius Jacinavičius;
Saulius Jacinavičius
Ekspla Ltd
Savanoriu Av. 231, LT-2028 Vilnius, Lithuania
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Gediminas Račiukaitis
Gediminas Račiukaitis
Ekspla Ltd
Savanoriu Av. 231, LT-2028 Vilnius, Lithuania
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Published Online:
October 01 2002
Citation
Saulius Jacinavičius, Gediminas Račiukaitis; October 14–17, 2002. "UV (ultraviolet) ps (picosecond)-laser with high peak power for micromachining." Proceedings of the ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication. ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication. Scottsdale, Arizona, USA. (pp. 156947). ASME. https://doi.org/10.2351/1.5065610
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