Diode laser beam of 20 W is applied to bend forming of thin metal plates. Bending characteristics are discussed on the basis of the experimental results for various bending conditions such as laser power, beam diameter, plate thickness, position of laser irradiation and so forth; furthermore, several kinds of metals are adopted as targets, i.e., AISI 304, iron, copper, molybdenum, nickel and aluminum. The bending angles strongly depend on the kind of materials; in particular, materials with low thermal conductivity bends with large angles. This seems to be caused by the high temperature rise due to low thermal diffusion. AISI 304 plates bend both away from and toward the beam under the same experimental conditions. The beam diameter has a strong effect on the bending direction; in case of forming of AISI 304 plate of 0.1 mm thickness, it bends away from the beam with higher possibility with larger diameter beam.
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ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication
October 14–17, 2002
Scottsdale, Arizona, USA
ISBN:
978-0-912035-72-7
PROCEEDINGS PAPER
Forming characteristics of thin metal plate with diode laser beam
Toshiyuki Miyazaki;
Toshiyuki Miyazaki
Chiba Institute of Technology
, Tsudanuma, Narashino, Chiba 275-0016 JAPAN
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Tadashi Misu;
Tadashi Misu
Chiba Institute of Technology
, Tsudanuma, Narashino, Chiba 275-0016 JAPAN
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Shunro Yoshioka;
Shunro Yoshioka
Chiba Institute of Technology
, Tsudanuma, Narashino, Chiba 275-0016 JAPAN
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Tsuyoshi Tokunaga;
Tsuyoshi Tokunaga
*
Polytechnic University
, Hashimotodai, Sagamihara, Kanagawa 229-1196 JAPAN
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Masatoshi Saito
Masatoshi Saito
**
Miyachi Technos Corporation
, Futatsuzuka, Noda, Chiba 278-0016 JAPAN
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Published Online:
October 01 2002
Citation
Toshiyuki Miyazaki, Tadashi Misu, Shunro Yoshioka, Tsuyoshi Tokunaga, Masatoshi Saito; October 14–17, 2002. "Forming characteristics of thin metal plate with diode laser beam." Proceedings of the ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication. ICALEO 2002: 21st International Congress on Laser Materials Processing and Laser Microfabrication. Scottsdale, Arizona, USA. (pp. 155937). ASME. https://doi.org/10.2351/1.5065602
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