Many industrial processes have now been demonstrated using high power diode lasers. The ease of use and the high wallplug efficiencies associated with diode lasers are balanced against the current limit on the brightness available; this also compromises their cutting and welding efficiency. For welding with diode lasers, enhanced absorption due to keyholing has only so far been achieved in the laboratory and this has been achieved at the cost of very short working distances. Similarly, the capital cost of current systems are too high to compensate for the shortcomings in brightness. In this work a novel, cost effective high power laser has been developed and some initial characterization and processing is described. This laser is aimed at achieving incremental increases in brightness and reducing system costs to the point at which these new sources may effectively compete with conventional lasers.
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ICALEO 2000: Proceedings of the Laser Applications in the Automotive Industry Conference
October 2–5, 2000
Dearborn, Michigan, USA
ISBN:
978-0-912035-62-8
PROCEEDINGS PAPER
Preliminary processing with a novel high average power direct diode laser (HPDDL)
A. P. Hoult;
A. P. Hoult
Coherent Semiconductor Group
, Santa Clara, California, USA
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A. M. Ozkan;
A. M. Ozkan
Coherent Semiconductor Group
, Santa Clara, California, USA
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R. S. Ong
R. S. Ong
Coherent Semiconductor Group
, Santa Clara, California, USA
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Published Online:
October 01 2000
Citation
A. P. Hoult, A. M. Ozkan, R. S. Ong; October 2–5, 2000. "Preliminary processing with a novel high average power direct diode laser (HPDDL)." Proceedings of the ICALEO 2000: Proceedings of the Laser Applications in the Automotive Industry Conference. ICALEO 2000: Proceedings of the Laser Materials Processing Conference. Dearborn, Michigan, USA. (pp. pp. A1-A10). ASME. https://doi.org/10.2351/1.5059396
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