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Journal Articles

Bilayer metal etch mask strategy for deep diamond etching

Yixiong Zheng, Matthias Muehle, Junyu Lai, John D. Albrecht, Jung-Hun Seo
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 40, 022210 (2022)
https://doi.org/10.1116/6.0001424
Published: March 2022
View article titled, Bilayer metal etch mask strategy for deep diamond etching
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Journal Articles

Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks

Sofya Torosyan, Armen Kteyan, Valeriy Sukharev, Jun-Ho Choy, Farid N. Najm
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 39, 013203 (2021)
https://doi.org/10.1116/6.0000617
Published: December 2020
View article titled, Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks
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Journal Articles

Double replication for characterizing cracks in surface-hardened polydimethylsiloxane

Miriam Leifels, Andre Mayer, Hella-Christin Scheer
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 37, 061805 (2019)
https://doi.org/10.1116/1.5119691
Published: October 2019
View article titled, Double replication for characterizing cracks in surface-hardened polydimethylsiloxane
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Journal Articles

In situ femtosecond pulse laser ablation for large volume 3D analysis in scanning electron microscope systems

Steven Jeffrey Randolph, Jorge Filevich, Aurelien Botman, Renae Gannon, Chad Rue, Marcus Straw
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 36, 06JB01 (2018)
https://doi.org/10.1116/1.5047806
Published: September 2018
View article titled, <em>In situ</em> femtosecond pulse laser ablation for large volume 3D analysis in scanning electron microscope systems
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Journal Articles

Source imperfection impacts on optical proximity correction

Lawrence S. Melvin, III, Artak Isoyan, Chander Sawh, Jensheng Huang
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 34, 06K703 (2016)
https://doi.org/10.1116/1.4967926
Published: November 2016
View article titled, Source imperfection impacts on optical proximity correction
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Journal Articles

In situ atomic force microscopy imaging of structural changes in metal nanowires during feedback-controlled electromigration

Mamiko Yagi, Takanari Saito, Jun-ichi Shirakashi
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 33, 051806 (2015)
https://doi.org/10.1116/1.4929444
Published: August 2015
View article titled, <em>In situ</em> atomic force microscopy imaging of structural changes in metal nanowires during feedback-controlled electromigration
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Journal Articles

TiN thin film resistors for monolithic microwave integrated circuits

Anna Malmros, Mattias Südow, Kristoffer Andersson, Niklas Rorsman
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 28, 912–915 (2010)
https://doi.org/10.1116/1.3475532
Published: August 2010
View article titled, TiN thin film resistors for monolithic microwave integrated circuits
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Journal Articles

Femtosecond laser machining: A new technique to fabricate carbon nanotube based emitters

Nguyen Tuan Hong, In Hyung Baek, Fabian Rotermund, Ken Ha Koh, Soonil Lee
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 28, C2B38–C2B42 (2010)
https://doi.org/10.1116/1.3333515
Published: March 2010
View article titled, Femtosecond laser machining: A new technique to fabricate carbon nanotube based emitters
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Journal Articles

Progressive degradation of Ti N ∕ Si O N and Ti N ∕ Hf O 2 gate stack triple gate SOI nFinFETs subjected to electrical stress

J. M. Rafí, E. Simoen, A. Mercha, N. Collaert, F. Campabadal, C. Claeys
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 27, 453–458 (2009)
https://doi.org/10.1116/1.3025883
Published: February 2009
View article titled, Progressive degradation of Ti N ∕ Si O N and Ti N ∕ Hf O 2 gate stack triple gate SOI nFinFETs subjected to electrical stress
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Journal Articles

Simulation study on stress and deformation of polymeric patterns during the demolding process in thermal imprint lithography

Zhichao Song, Junseo Choi, Byoung Hee You, Jaejong Lee, Sunggook Park
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 26, 598–605 (2008)
https://doi.org/10.1116/1.2890693
Published: March 2008
View article titled, Simulation study on stress and deformation of polymeric patterns during the demolding process in thermal imprint lithography
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Journal Articles

Analysis of the early stages of stress-induced notch growth

Minoru Aoyagi
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 25, 355–360 (2007)
https://doi.org/10.1116/1.2699898
Published: February 2007
View article titled, Analysis of the early stages of stress-induced notch growth
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Journal Articles

Change in electrical resistance caused by stress-induced migration

Minoru Aoyagi
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 24, 250–254 (2006)
https://doi.org/10.1116/1.2162579
Published: January 2006
View article titled, Change in electrical resistance caused by stress-induced migration
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Journal Articles

Possible role of oxygen impurities in degradation of n c - Ti N ∕ a - Si 3 N 4 nanocomposites

Stan Veprek, Pavla Karvankova, Maritza G. J. Veprek-Heijman
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 23, L17–L21 (2005)
https://doi.org/10.1116/1.2131086
Published: November 2005
View article titled, Possible role of oxygen impurities in degradation of n c - Ti N ∕ a - Si 3 N 4 nanocomposites
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Journal Articles

Bias-temperature stress analysis of Cu ∕ ultrathin   Ta ∕ SiO 2 ∕ Si interconnect structure

Boon Kiat Lim, Hun Sub Park, Lian Kon Chin, Sun Woong Woo, Alex K. H. See, Chim-Seng Seet, Tae-Jong Lee, Nikolai L. Yakovlev
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 22, 2286–2290 (2004)
https://doi.org/10.1116/1.1781186
Published: October 2004
View article titled, Bias-temperature stress analysis of Cu ∕ ultrathin   Ta ∕ SiO 2 ∕ Si interconnect structure
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Journal Articles

Texture and electromigration performance in damascene interconnects formed by reflow sputtered Cu film

Kazuhide Abe, Yusuke Harada, Masaki Yoshimaru, Hiroshi Onoda
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 22, 721–728 (2004)
https://doi.org/10.1116/1.1676618
Published: March 2004
View article titled, Texture and electromigration performance in damascene interconnects formed by reflow sputtered Cu film
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Journal Articles

Effects of Ti insertion between Cu and TiN layers on reliability in Cu/Ti/TiN/Ti layered damascene interconnects

Kazuhide Abe, Hiroshi Onoda
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 21, 1161–1168 (2003)
https://doi.org/10.1116/1.1576401
Published: May 2003
View article titled, Effects of Ti insertion between Cu and TiN layers on reliability in Cu/Ti/TiN/Ti layered damascene interconnects
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Journal Articles

Degradation measurements using fully processed test transistors in high density plasma reactors for failure analysis

Ravisangar Muniandy, Ron Boylan, Roland Chin, Nick Bell, Robert Sankman
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 15, 1913–1918 (1997)
https://doi.org/10.1116/1.589578
Published: November 1997
View article titled, Degradation measurements using fully processed test transistors in high density plasma reactors for failure analysis
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Journal Articles

Coherence of large gratings and electron‐beam fabrication techniques for atom‐wave interferometry

Michael J. Rooks, Richard C. Tiberio, Michael Chapman, Troy Hammond, Edward Smith, Alan Lenef, Richard Rubenstein, David Pritchard, Scott Adams
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 13, 2745–2751 (1995)
https://doi.org/10.1116/1.588258
Published: November 1995
View article titled, Coherence of large gratings and electron‐beam fabrication techniques for atom‐wave interferometry
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Journal Articles

Analysis of electromigration‐induced failures in high‐temperature sputtered Al‐alloy metallization

Hiroshi Onoda, Keiichi Hashimoto, Kenshin Touchi
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 13, 1546–1555 (1995)
https://doi.org/10.1116/1.588185
Published: July 1995
View article titled, Analysis of electromigration‐induced failures in high‐temperature sputtered Al‐alloy metallization
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Journal Articles

Effect of Mo oxide layer on electromigration resistance of Al–Si–Cu/Mo bilayered interconnections

Shin‐ichi Fukada, Motoo Suwa
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 11, 319–325 (1993)
https://doi.org/10.1116/1.586677
Published: March 1993
View article titled, Effect of Mo oxide layer on electromigration resistance of Al–Si–Cu/Mo bilayered interconnections
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