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Journal Articles

On the use of pulsed DC bias for etching high aspect ratio features

Editor’s Pick
Xingyi Shi, Samaneh Sadighi, Shahid Rauf, Han Luo, Jun-Chieh Wang, Jason Kenney, Jean-Paul Booth, Daniil Marinov, Mickaël Foucher, Nishant Sirse
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 43, 013001 (2025)
https://doi.org/10.1116/6.0003943
Published: December 2024
View article titled, On the use of pulsed DC bias for etching high aspect ratio features
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Journal Articles

Silicon-air nanofilm based on the ⟨110⟩ projection of a diamond lattice to enhance radiative cooling

David Kortge, Jie Zhu, Mary Vaughan, Sheng-Wen Huang, Peter Bermel
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063110 (2024)
https://doi.org/10.1116/6.0003985
Published: November 2024
View article titled, Silicon-air nanofilm based on the ⟨110⟩ projection of a diamond lattice to enhance radiative cooling
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Journal Articles

Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride

Editor’s Pick
Thorsten Lill, Mingmei Wang, Dongjun Wu, Youn-Jin Oh, Tae Won Kim, Mark Wilcoxson, Harmeet Singh, Vahid Ghodsi, Steven M. George, Yuri Barsukov, Igor Kaganovich
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063006 (2024)
https://doi.org/10.1116/6.0004019
Published: November 2024
View article titled, Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride
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Journal Articles

Dynamic global model of Cl2/Ar plasmas: Applicability to atomic layer etching processes

Editor’s Pick
T. Rasoanarivo, C. Mannequin, F. Roqueta, M. Boufnichel, A. Rhallabi
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063003 (2024)
https://doi.org/10.1116/6.0003932
Published: November 2024
View article titled, Dynamic global model of Cl<sub>2</sub>/Ar plasmas: Applicability to atomic layer etching processes
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Journal Articles

Fabrication-related impurity study of thin superconducting Al films using x-ray absorption spectroscopy

Editor’s Pick
Ghadendra B. Bhandari, Thomas R. Stevenson, Emily M. Barrentine, Larry A. Hess, Mikel B. Holcomb
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063404 (2024)
https://doi.org/10.1116/6.0003949
Published: October 2024
View article titled, Fabrication-related impurity study of thin superconducting Al films using x-ray absorption spectroscopy
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Journal Articles

Isotropic atomic layer etching of MgO-doped lithium niobate using sequential exposures of H2 and SF6/Ar plasmas

Editor’s Pick
Ivy I. Chen, Jennifer Solgaard, Ryoto Sekine, Azmain A. Hossain, Anthony Ardizzi, David S. Catherall, Alireza Marandi, James R. Renzas, Frank Greer, Austin J. Minnich
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 062603 (2024)
https://doi.org/10.1116/6.0003962
Published: October 2024
View article titled, Isotropic atomic layer etching of MgO-doped lithium niobate using sequential exposures of H<sub>2</sub> and SF<sub>6</sub>/Ar plasmas
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Journal Articles

Fabrication of thick Cr masks for reactive ion substrate etching by electron beam lithography and lift-off techniques

Deyong Wang, Peter Kjær Kristensen, Manohar Chirumamilla, Kjeld Pedersen
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063105 (2024)
https://doi.org/10.1116/6.0003965
Published: October 2024
View article titled, Fabrication of thick Cr masks for reactive ion substrate etching by electron beam lithography and lift-off techniques
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Journal Articles

Effect of a DC gradient magnetic field on electron density in a weakly magnetized inductively coupled plasma

You He, Yi-Lang Jiang, Myoung-Jae Lee, Min-Seok Kim, Beom-Jun Seo, Ju-Ho Kim, Chin-Wook Chung
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063002 (2024)
https://doi.org/10.1116/6.0003851
Published: October 2024
View article titled, Effect of a DC gradient magnetic field on electron density in a weakly magnetized inductively coupled plasma
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Journal Articles

Removing defects from sputter damage on InGaP surfaces using thermal atomic layer etching

Editor’s Pick
Ross Edel, Ezra Alexander, Taewook Nam, Andrew S. Cavanagh, Troy Van Voorhis, Steven M. George
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 062602 (2024)
https://doi.org/10.1116/6.0003899
Published: October 2024
View article titled, Removing defects from sputter damage on InGaP surfaces using thermal atomic layer etching
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Journal Articles

Optical emission spectroscopy as a method for evaluating the change in Si etching structures profile in ICP SF6/C4F8 plasma: Microstructures

Artem A. Osipov, Alina E. Fumina, Anastasia B. Speshilova, Ekaterina V. Endiiarova, Armenak A. Osipov, Sergey E. Alexandrov
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063001 (2024)
https://doi.org/10.1116/6.0003809
Published: September 2024
View article titled, Optical emission spectroscopy as a method for evaluating the change in Si etching structures profile in ICP SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub> plasma: Microstructures
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Journal Articles

Process stability of SiO2 atomic layer etching in C4F6/Ar chemistry

Editor’s Pick
Antoine Ronco, F. Boulard, B. Pelissier, N. Posseme
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 062601 (2024)
https://doi.org/10.1116/6.0003822
Published: September 2024
View article titled, Process stability of SiO<sub>2</sub> atomic layer etching in C<sub>4</sub>F<sub>6</sub>/Ar chemistry
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Journal Articles

Examination of nonideal film growth in batch atomic layer deposition for plasma-resistant coatings

Lanxin Guo, Yixian Wang, Zifan Pang, Xin Han, Yafeng Wang, Lipei Peng, Xin Gao, Chunlei Pei, Tuo Wang, Jinlong Gong
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 062401 (2024)
https://doi.org/10.1116/6.0003777
Published: September 2024
View article titled, Examination of nonideal film growth in batch atomic layer deposition for plasma-resistant coatings
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Journal Articles

Atomic layer etching of SiO2 using sequential exposures of Al(CH3)3 and H2/SF6 plasma

Editor’s Pick
David S. Catherall, Azmain A. Hossain, Anthony J. Ardizzi, Austin J. Minnich
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 052605 (2024)
https://doi.org/10.1116/6.0003793
Published: September 2024
View article titled, Atomic layer etching of SiO<sub>2</sub> using sequential exposures of Al(CH<sub>3</sub>)<sub>3</sub> and H<sub>2</sub>/SF<sub>6</sub> plasma
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Journal Articles

Ultrathin ZrO2 thickness control on TiO2/ZrO2 core/shell nanoparticles using ZrO2 atomic layer deposition and etching

Janine D. Sempel, Marja-Leena Kaariainen, Troy A. Colleran, Alejo M. Lifschitz, Steven M. George
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 052604 (2024)
https://doi.org/10.1116/6.0003781
Published: August 2024
View article titled, Ultrathin ZrO<sub>2</sub> thickness control on TiO<sub>2</sub>/ZrO<sub>2</sub> core/shell nanoparticles using ZrO<sub>2</sub> atomic layer deposition and etching
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Journal Articles

Etch-stop mechanisms in plasma-enhanced atomic layer etching of silicon nitride: A molecular dynamics study

Jomar U. Tercero, Michiro Isobe, Kazuhiro Karahashi, Magdaleno R. Vasquez, Jr., Satoshi Hamaguchi
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 052603 (2024)
https://doi.org/10.1116/6.0003750
Published: August 2024
View article titled, Etch-stop mechanisms in plasma-enhanced atomic layer etching of silicon nitride: A molecular dynamics study
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Journal Articles

Impact of sputtering and redeposition on the morphological profile evolution during ion-beam etching of blazed gratings

Ze-Xuan Liu, Xing-Yu Li, Quan-Zhi Zhang, Julian Schulze, Ruo-Bing Zhang, You-Nian Wang
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 053006 (2024)
https://doi.org/10.1116/6.0003745
Published: July 2024
View article titled, Impact of sputtering and redeposition on the morphological profile evolution during ion-beam etching of blazed gratings
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Journal Articles

Revealing the controlling mechanisms of atomic layer etching for high-k dielectrics in conventional inductively coupled plasma etching tool

Vitaly Kuzmenko, Alexander Melnikov, Alexandr Isaev, Andrey Miakonkikh
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 052602 (2024)
https://doi.org/10.1116/6.0003717
Published: July 2024
View article titled, Revealing the controlling mechanisms of atomic layer etching for high-k dielectrics in conventional inductively coupled plasma etching tool
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Journal Articles

Dry and wet etching of single-crystal AlN

Editor’s Pick
Hsiao-Hsuan Wan, Chao-Ching Chiang, Jian-Sian Li, Nahid Sultan Al-Mamun, Aman Haque, Fan Ren, Stephen J. Pearton
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 052601 (2024)
https://doi.org/10.1116/6.0003744
Published: July 2024
View article titled, Dry and wet etching of single-crystal AlN
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Journal Articles

Reactor wall effects in Si–Cl2–Ar atomic layer etching

Joseph R. Vella, Mahmoud A. I. Elgarhy, Qinzhen Hao, Vincent M. Donnelly, David B. Graves
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 042604 (2024)
https://doi.org/10.1116/6.0003651
Published: June 2024
View article titled, Reactor wall effects in Si–Cl<sub>2</sub>–Ar atomic layer etching
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Journal Articles

Mechanism study of H2-plasma assisted Si3N4 layered etch

Editor’s Pick
Ying Rui, Sumeet Pandey, Chenmeng Hsie, Lan Li
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 042603 (2024)
https://doi.org/10.1116/6.0003653
Published: June 2024
View article titled, Mechanism study of H<sub>2</sub>-plasma assisted Si<sub>3</sub>N<sub>4</sub> layered etch
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