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Journal Articles

Impact of thermal crosstalk on dependent failure rates of multilayer ceramic capacitors undergoing lifetime testing

Pedram Yousefian, Daniel C. Shoemaker, Javier Mena-Garcia, Michael Norrell, Jeff Long, Sukwon Choi, Clive A. Randall

J. Appl. Phys. 137, 034104 (2025)

https://doi.org/10.1063/5.0245201

Published: January 2025

View article titled, Impact of thermal crosstalk on dependent failure rates of multilayer ceramic capacitors undergoing lifetime testing

Journal Articles

Electric-field-induced surface modification in TlGaSe₂ layered semiconductor: Capacitive effect caused by electromigration of native defects

Emir Suad Olcay, Ayşe Sönmez, Esra Okumuş, Leyla Çolakerol Arslan, Savaş Berber, MirHasan Yu. Seyidov

J. Appl. Phys. 135, 204303 (2024)

https://doi.org/10.1063/5.0200151

Published: May 2024

View article titled, Electric-field-induced surface modification in TlGaSe2 layered semiconductor: Capacitive effect caused by electromigration of native defects

Journal Articles

Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams

Akira Uedono, Takeshi Nogami, Oleg Gluschenkov, Yasir Sulehria, Junjun Liu, Toshiyuki Tabata, Lu Lu, Katsuhiro Mitsuda, Ian Brown, Yasutoshi Okuno

J. Appl. Phys. 134, 135103 (2023)

https://doi.org/10.1063/5.0166145

Published: October 2023

View article titled, Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams

Journal Articles

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

A. S. Saleh, K. Croes, H. Ceric, I. De Wolf, H. Zahedmanesh

J. Appl. Phys. 134, 135102 (2023)

https://doi.org/10.1063/5.0165949

Published: October 2023

View article titled, A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

Includes: Supplementary data

Journal Articles

Electric field induced migration of native point defects in Ga₂O₃ devices

Micah S. Haseman, Daram N. Ramdin, Wenshen Li, Kazuki Nomoto, Debdeep Jena, Huili Grace Xing, Leonard J. Brillson

J. Appl. Phys. 133, 035701 (2023)

https://doi.org/10.1063/5.0124543

Published: January 2023

View article titled, Electric field induced migration of native point defects in Ga2O3 devices

Includes: Supplementary data

Journal Articles

Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model

A. S. Saleh, H. Ceric, H. Zahednamesh

J. Appl. Phys. 129, 125102 (2021)

https://doi.org/10.1063/5.0039953

Published: March 2021

View article titled, Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model

Includes: Supplementary data

Journal Articles

Effect of conductivity on the electromigration-induced morphological evolution of islands with high symmetries of surface diffusional anisotropy

Jay Santoki, Arnab Mukherjee, Daniel Schneider, Britta Nestler

J. Appl. Phys. 129, 025110 (2021)

https://doi.org/10.1063/5.0033228

Published: January 2021

View article titled, Effect of conductivity on the electromigration-induced morphological evolution of islands with high symmetries of surface diffusional anisotropy

Journal Articles

Breakdown transients in high-k multilayered MOS stacks: Role of the oxide–oxide thermal boundary resistance

S. Boyeras Baldomá, S. M. Pazos, F. L. Aguirre, F. R. Palumbo

J. Appl. Phys. 128, 034103 (2020)

https://doi.org/10.1063/5.0012918

Published: July 2020

View article titled, Breakdown transients in high-k multilayered MOS stacks: Role of the oxide–oxide thermal boundary resistance

Journal Articles

Phase-field simulations of electromigration-induced defects in interconnects with non-columnar grain microstructure

William Farmer, Kumar Ankit

J. Appl. Phys. 127, 175301 (2020)

https://doi.org/10.1063/1.5145104

Published: May 2020

View article titled, Phase-field simulations of electromigration-induced defects in interconnects with non-columnar grain microstructure

Journal Articles

Cathodoluminescence study of electric field induced migration of defects in single crystal m-plane ZnO

Jedsada Manyam, Cuong Ton-That, Matthew R. Phillips

J. Appl. Phys. 127, 085705 (2020)

https://doi.org/10.1063/1.5134555

Published: February 2020

View article titled, Cathodoluminescence study of electric field induced migration of defects in single crystal m-plane ZnO

Journal Articles

Numerical simulation and optimization of metallic network for highly efficient transparent conductive films

Zijing Zeng, Changhong Wang, Jinwei Gao

J. Appl. Phys. 127, 065104 (2020)

https://doi.org/10.1063/1.5141162

Published: February 2020

View article titled, Numerical simulation and optimization of metallic network for highly efficient transparent conductive films

Journal Articles

Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

Zhi Jin, Yu-An Shen, Siliang He, Shiqi Zhou, Y. C. Chan, Hiroshi Nishikawa

J. Appl. Phys. 126, 185109 (2019)

https://doi.org/10.1063/1.5124716

Published: November 2019

View article titled, Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

Journal Articles

Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model

Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tőkei, Kristof Croes

J. Appl. Phys. 126, 055102 (2019)

https://doi.org/10.1063/1.5093769

Published: August 2019

View article titled, Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model

Journal Articles

Electromigration-induced leakage current enhancement and its anisotropy in single crystal TiO 2

Daniel Long, Nicole Creange, Ali Moballegh, Elizabeth C. Dickey

J. Appl. Phys. 125, 184101 (2019)

https://doi.org/10.1063/1.5090402

Published: May 2019

View article titled, Electromigration-induced leakage current enhancement and its anisotropy in single crystal TiO 2

Journal Articles

Phase stabilization of a relativistic backward wave oscillator by controlling the cathode characteristics for a slowly rising voltage pulse

Renzhen Xiao, Yuqun Deng, Yanchao Shi, Dewen Yang

J. Appl. Phys. 125, 173302 (2019)

https://doi.org/10.1063/1.5093031

Published: May 2019

View article titled, Phase stabilization of a relativistic backward wave oscillator by controlling the cathode characteristics for a slowly rising voltage pulse

Journal Articles

Electrical and thermal effects on electromechanical performance of stretchable thin gold films on PDMS substrates for stretchable electronics

Yang Zhao, Mei Yu, Zhiyuan Liu, Zhe Yu

J. Appl. Phys. 125, 165305 (2019)

https://doi.org/10.1063/1.5079435

Published: April 2019

View article titled, Electrical and thermal effects on electromechanical performance of stretchable thin gold films on PDMS substrates for stretchable electronics

Journal Articles

Erratum: “Capillarity and electromigration effects on asperity contact evolution in microelectromechanical systems switches,” [J. Appl. Phys. 100, 054502 (2006)]

Ji Hee Kim, David J. Srolovitz, Pil-Ryung Cha, Jong-Kyu Yoon

J. Appl. Phys. 124, 179901 (2018)

https://doi.org/10.1063/1.5064756

Published: November 2018

View article titled, Erratum: “Capillarity and electromigration effects on asperity contact evolution in microelectromechanical systems switches,” [J. Appl. Phys. 100, 054502 (2006)]

Journal Articles

Memory effects in the ion conductor Rb₂Ti₂O₅

Rémi Federicci, Stéphane Holé, Vincent Démery, Brigitte Leridon

J. Appl. Phys. 124, 152104 (2018)

https://doi.org/10.1063/1.5036841

Published: September 2018

View article titled, Memory effects in the ion conductor Rb2Ti2O5

Journal Articles

Optimization of electrical treatment strategy for surface roughness reduction in conducting thin films

Lin Du, Dimitrios Maroudas

J. Appl. Phys. 124, 125302 (2018)

https://doi.org/10.1063/1.5047405

Published: September 2018

View article titled, Optimization of electrical treatment strategy for surface roughness reduction in conducting thin films

Journal Articles

The charge-discharge characteristics and diffusion mechanism of Ti-Si-Al thin film anode using an electrically induced crystallization process

Yen-Ting Chen, Fei-Yi Hung, Truan-Sheng Lui

J. Appl. Phys. 123, 145303 (2018)

https://doi.org/10.1063/1.5016474

Published: April 2018

View article titled, The charge-discharge characteristics and diffusion mechanism of Ti-Si-Al thin film anode using an electrically induced crystallization process

NARROW

Topics

Impact of thermal crosstalk on dependent failure rates of multilayer ceramic capacitors undergoing lifetime testing

Electric-field-induced surface modification in TlGaSe₂ layered semiconductor: Capacitive effect caused by electromigration of native defects

Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

Electric field induced migration of native point defects in Ga₂O₃ devices

Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model

Effect of conductivity on the electromigration-induced morphological evolution of islands with high symmetries of surface diffusional anisotropy

Breakdown transients in high-k multilayered MOS stacks: Role of the oxide–oxide thermal boundary resistance

Phase-field simulations of electromigration-induced defects in interconnects with non-columnar grain microstructure

Cathodoluminescence study of electric field induced migration of defects in single crystal m-plane ZnO

Numerical simulation and optimization of metallic network for highly efficient transparent conductive films

Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model

Electromigration-induced leakage current enhancement and its anisotropy in single crystal TiO 2

Phase stabilization of a relativistic backward wave oscillator by controlling the cathode characteristics for a slowly rising voltage pulse

Electrical and thermal effects on electromechanical performance of stretchable thin gold films on PDMS substrates for stretchable electronics

Erratum: “Capillarity and electromigration effects on asperity contact evolution in microelectromechanical systems switches,” [J. Appl. Phys. 100, 054502 (2006)]

Memory effects in the ion conductor Rb₂Ti₂O₅

Optimization of electrical treatment strategy for surface roughness reduction in conducting thin films

The charge-discharge characteristics and diffusion mechanism of Ti-Si-Al thin film anode using an electrically induced crystallization process

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