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Journal Articles

Predicting bond line thickness of polymeric thermal interface materials based on the rheological properties

Open Access
Jianfeng Fan, Zhenqiang Ye, Xiaoliang Zeng, Jian-Bin Xu, Linlin Ren, Rong Sun, Ching-Ping Wong
Journal: Journal of Applied Physics
J. Appl. Phys. 136, 025301 (2024)
https://doi.org/10.1063/5.0209314
Published: July 2024
View article titled, Predicting bond line thickness of polymeric thermal interface materials based on the rheological properties
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Journal Articles

Notch sensitivity of polymer-based thermal interface materials

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Linfeng Cai, Dongyi He, Xu Peng, Jianfeng Fan, Shengchang Ding, Xiangliang Zeng, Rong Sun, Linlin Ren, Cheng Zhong, Jibao Lu, Xiaoliang Zeng
Journal: Journal of Applied Physics
J. Appl. Phys. 132, 245111 (2022)
https://doi.org/10.1063/5.0120832
Published: December 2022
View article titled, Notch sensitivity of polymer-based thermal interface materials
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Includes: Supplementary data
Journal Articles

Three-dimensional patterned distribution of thermal conductivity in the volume for effective thermal concentration

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Fahao Qin, Lanlan Wang, Weitao Jiang, Yajun Zhang, Hongzhong Liu
Journal: Journal of Applied Physics
J. Appl. Phys. 129, 055102 (2021)
https://doi.org/10.1063/5.0030241
Published: February 2021
View article titled, Three-dimensional patterned distribution of thermal conductivity in the volume for effective thermal concentration
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Journal Articles

Negative differential thermal resistance effect in a macroscopic homojunction

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Yu Yang, Dengke Ma, Yunshan Zhao, Lifa Zhang
Journal: Journal of Applied Physics
J. Appl. Phys. 127, 195301 (2020)
https://doi.org/10.1063/5.0004284
Published: May 2020
View article titled, Negative differential thermal resistance effect in a macroscopic homojunction
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Journal Articles

Thermal boundary conductance between high thermal conductivity boron arsenide and silicon

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Zhiyong Wei, Ze Yang, Ming Liu, Honglei Wu, Yunfei Chen, Fan Yang
Journal: Journal of Applied Physics
J. Appl. Phys. 127, 055105 (2020)
https://doi.org/10.1063/1.5139669
Published: February 2020
View article titled, Thermal boundary conductance between high thermal conductivity boron arsenide and silicon
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Journal Articles

A molecular dynamics study of heat transfer over an ultra-thin liquid film with surfactant between solid surfaces

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Yuting Guo, Donatas Surblys, Yoshiaki Kawagoe, Hiroki Matsubara, Taku Ohara
Journal: Journal of Applied Physics
J. Appl. Phys. 126, 185302 (2019)
https://doi.org/10.1063/1.5123583
Published: November 2019
View article titled, A molecular dynamics study of heat transfer over an ultra-thin liquid film with surfactant between solid surfaces
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Journal Articles

Camouflage thermotics: A cavity without disturbing heat signatures outside

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Liujun Xu, Ruizhe Wang, Jiping Huang
Journal: Journal of Applied Physics
J. Appl. Phys. 123, 245111 (2018)
https://doi.org/10.1063/1.5034183
Published: June 2018
View article titled, Camouflage thermotics: A cavity without disturbing heat signatures outside
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Journal Articles

The critical particle size for enhancing thermal conductivity in metal nanoparticle-polymer composites

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Zexi Lu, Yan Wang, Xiulin Ruan
Journal: Journal of Applied Physics
J. Appl. Phys. 123, 074302 (2018)
https://doi.org/10.1063/1.5014987
Published: February 2018
View article titled, The critical particle size for enhancing thermal conductivity in metal nanoparticle-polymer composites
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Journal Articles

Onsite synthesis of thermally percolated nanocomposite for thermal interface material

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Masanao Obori, Satoshi Nita, Asuka Miura, Junichiro Shiomi
Journal: Journal of Applied Physics
J. Appl. Phys. 119, 055103 (2016)
https://doi.org/10.1063/1.4941275
Published: February 2016
View article titled, Onsite synthesis of thermally percolated nanocomposite for thermal interface material
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Journal Articles

Thermal transport across graphene and single layer hexagonal boron nitride

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Jingchao Zhang, Yang Hong, Yanan Yue
Journal: Journal of Applied Physics
J. Appl. Phys. 117, 134307 (2015)
https://doi.org/10.1063/1.4916985
Published: April 2015
View article titled, Thermal transport across graphene and single layer hexagonal boron nitride
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Journal Articles

Disparate quasiballistic heat conduction regimes from periodic heat sources on a substrate

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Lingping Zeng, Gang Chen
Journal: Journal of Applied Physics
J. Appl. Phys. 116, 064307 (2014)
https://doi.org/10.1063/1.4893299
Published: August 2014
View article titled, Disparate quasiballistic heat conduction regimes from periodic heat sources on a substrate
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Journal Articles

Enhancement of interfacial thermal transport by carbon nanotube-graphene junction

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Hua Bao, Cheng Shao, Shirui Luo, Ming Hu
Journal: Journal of Applied Physics
J. Appl. Phys. 115, 053524 (2014)
https://doi.org/10.1063/1.4864221
Published: February 2014
View article titled, Enhancement of interfacial thermal transport by carbon nanotube-graphene junction
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Journal Articles

Carrier interactions and porosity initiated reversal of temperature dependence of thermal conduction in nanoscale tin films

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Pankaj B. Kaul, Vikas Prakash
Journal: Journal of Applied Physics
J. Appl. Phys. 115, 023520 (2014)
https://doi.org/10.1063/1.4859735
Published: January 2014
View article titled, Carrier interactions and porosity initiated reversal of temperature dependence of thermal conduction in nanoscale tin films
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Journal Articles

Interfacial thermal conductance limit and thermal rectification across vertical carbon nanotube/graphene nanoribbon-silicon interfaces

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Ajit K. Vallabhaneni, Bo Qiu, Jiuning Hu, Yong P. Chen, Ajit K. Roy, Xiulin Ruan
Journal: Journal of Applied Physics
J. Appl. Phys. 113, 064311 (2013)
https://doi.org/10.1063/1.4790367
Published: February 2013
View article titled, Interfacial thermal conductance limit and thermal rectification across vertical carbon nanotube/graphene nanoribbon-silicon interfaces
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Journal Articles

Field-structured, multilayered platelets enable high performance, dielectric thermal composites

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James E. Martin, Kyle J. Solis, David Rademacher, Vladimir Raksha
Journal: Journal of Applied Physics
J. Appl. Phys. 112, 054306 (2012)
https://doi.org/10.1063/1.4747833
Published: September 2012
View article titled, Field-structured, multilayered platelets enable high performance, dielectric thermal composites
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Journal Articles

Field-structured magnetic platelets as a route to improved thermal interface materials

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Kyle J. Solis, James E. Martin
Journal: Journal of Applied Physics
J. Appl. Phys. 111, 073507 (2012)
https://doi.org/10.1063/1.3699013
Published: April 2012
View article titled, Field-structured magnetic platelets as a route to improved thermal interface materials
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Journal Articles

Experimental study on substrate with hierarchical nested channels for thermal interface resistance control

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Xiaobing Luo, Huai Zheng, Minglu Liu, Sheng Liu
Journal: Journal of Applied Physics
J. Appl. Phys. 109, 103503 (2011)
https://doi.org/10.1063/1.3586252
Published: May 2011
View article titled, Experimental study on substrate with hierarchical nested channels for thermal interface resistance control
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Journal Articles

Molecular dynamics simulation of thermal energy transport in polydimethylsiloxane

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Tengfei Luo, Keivan Esfarjani, Junichiro Shiomi, Asegun Henry, Gang Chen
Journal: Journal of Applied Physics
J. Appl. Phys. 109, 074321 (2011)
https://doi.org/10.1063/1.3569862
Published: April 2011
View article titled, Molecular dynamics simulation of thermal energy transport in polydimethylsiloxane
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Journal Articles

Growth of large-area graphene films from metal-carbon melts

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Shaahin Amini, Javier Garay, Guanxiong Liu, Alexander A. Balandin, Reza Abbaschian
Journal: Journal of Applied Physics
J. Appl. Phys. 108, 094321 (2010)
https://doi.org/10.1063/1.3498815
Published: November 2010
View article titled, Growth of large-area graphene films from metal-carbon melts
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Journal Articles

Silver nanowire array-polymer composite as thermal interface material

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Ju Xu, Alessio Munari, Eric Dalton, Alan Mathewson, Kafil M. Razeeb
Journal: Journal of Applied Physics
J. Appl. Phys. 106, 124310 (2009)
https://doi.org/10.1063/1.3271149
Published: December 2009
View article titled, Silver nanowire array-polymer composite as thermal interface material
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