Skip to Main Content
Skip Nav Destination

Revisit to the finite element modeling of electromigration for narrow interconnects

J. Appl. Phys. 102, 033705 (2007)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Quan Sun
  • Yebo Lu
  • Chengli Tang
  • Haijun Song
  • Chao Li
  • Chuncheng Zuo
Materials 12, 3288 (2019)
  • Udit Narula
  • Cher Ming Tan
  • Eng Soon Tok
Advanced Materials Interfaces (2018) 5 (13)
  • Qian Lin
  • Haifeng Wu
  • Shan-ji Chen
  • Guoqing Jia
  • Wei Jiang
  • Chao Chen
International Journal of Electronics 105, 794 (2018)
  • Qian Lin
  • Haipeng Fu
  • Weicong Na
  • Feifei He
  • Xi Li
  • Qianfu Cheng
  • Yuanyuan Zhu
International Journal of RF and Microwave Computer-Aided Engineering 26, 481 (2016)
  • Qian Lin
  • Haipeng Fu
  • Feifei He
  • Qianfu Cheng
Journal of Electronic Testing 32, 481 (2016)
  • Zhong Guan
  • Malgorzata Marek-Sadowska
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 1.
  • Yuan Xiang Zhang
  • Jun Wu
  • Ying Yu Ji
Key Engineering Materials (2013) 546: 6.
  • Cher Ming Tan
  • Wei Li
  • Zhenghao Gan
Microelectronics Reliability 52, 1539 (2012)
  • K.S. McGarrity
  • B. Gao
  • J.M. Thijssen
Computational Materials Science 50, 3043 (2011)
  • Lihua Liang
  • Yuanxiang Zhang
  • Yong Liu
Journal of Electronic Packaging (2011) 133 (3)
  • C.M. Fu
  • C.M. Tan
  • S.H. Wu
  • H.B. Yao
Microelectronics Reliability 50, 1332 (2010)
  • JianPing Jing
  • Lihua Liang
  • Guang Meng
Journal of Electronic Packaging (2010) 132 (1)
  • Y.C. Tan
  • C.M. Tan
  • X.W. Zhang
  • T.C. Chai
  • D.Q. Yu
Microelectronics Reliability 50, 1336 (2010)
  • Yuejin Hou
  • Cher Ming Tan
Semiconductor Science and Technology 23, 075023 (2008)
Close Modal

or Create an Account

Close Modal
Close Modal