Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology | Citedby Results | Journal of Applied Physics | AIP Publishing

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Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology

J. Appl. Phys. 96, 7596–7602 (2004)

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