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Proceedings Papers

Proceedings Volume Cover
ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 23–27, 2011
Orlando, Florida, USA
ISBN:
978-0-912035-94-9
ICALEO 2011: 30th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing

CLOSING PLENARY SESSION

Joint Session (LMP & LMF): Strategies, Limits and Challenges for Advanced Laser Processing

LASER MATERIALS PROCESSING CONFERENCE

LMP 1: Laser Cutting

LMP 2: Process Monitoring & Control I

ICALEO 2011; 104-109https://doi.org/10.2351/1.5062179
ICALEO 2011; 110-117https://doi.org/10.2351/1.5062188
ICALEO 2011; 118-124https://doi.org/10.2351/1.5062200
ICALEO 2011; 125-128https://doi.org/10.2351/1.5062213

LMP 3: Welding I

ICALEO 2011; 129-137https://doi.org/10.2351/1.5062220
ICALEO 2011; 138-140https://doi.org/10.2351/1.5062226
ICALEO 2011; 141-146https://doi.org/10.2351/1.5062227
ICALEO 2011; 147-149https://doi.org/10.2351/1.5062228
ICALEO 2011; 150-158https://doi.org/10.2351/1.5062229
ICALEO 2011; 159-168https://doi.org/10.2351/1.5062230
ICALEO 2011; 169-178https://doi.org/10.2351/1.5062231

LMP 4: Process Monitoring & Control II

ICALEO 2011; 179-186https://doi.org/10.2351/1.5062233
ICALEO 2011; 187-195https://doi.org/10.2351/1.5062234
ICALEO 2011; 196-204https://doi.org/10.2351/1.5062235
ICALEO 2011; 205-210https://doi.org/10.2351/1.5062237
ICALEO 2011; 211-220https://doi.org/10.2351/1.5062238
ICALEO 2011; 221-226https://doi.org/10.2351/1.5062239
ICALEO 2011; 227-233https://doi.org/10.2351/1.5062240
ICALEO 2011; 234-239https://doi.org/10.2351/1.5062241

LMP 5: Laser Metal Deposition (LMD): Applications & Systems

ICALEO 2011; 240-249https://doi.org/10.2351/1.5062242
ICALEO 2011; 250-256https://doi.org/10.2351/1.5062243
ICALEO 2011; 257-266https://doi.org/10.2351/1.5062244
ICALEO 2011; 267-274https://doi.org/10.2351/1.5062246
ICALEO 2011; 275-282https://doi.org/10.2351/1.5062247
ICALEO 2011; 283-294https://doi.org/10.2351/1.5062248
ICALEO 2011; 295-300https://doi.org/10.2351/1.5062249
ICALEO 2011; 301-307https://doi.org/10.2351/1.5062250

LMP 6: Processing of Dissimilar Materials

ICALEO 2011; 308-314https://doi.org/10.2351/1.5062251
ICALEO 2011; 315-324https://doi.org/10.2351/1.5062252
ICALEO 2011; 325-332https://doi.org/10.2351/1.5062253
ICALEO 2011; 333-342https://doi.org/10.2351/1.5062254
ICALEO 2011; 343-349https://doi.org/10.2351/1.5062255
ICALEO 2011; 350-356https://doi.org/10.2351/1.5062257

LMP 7: Modelling & Simulation

ICALEO 2011; 357-360https://doi.org/10.2351/1.5062258
ICALEO 2011; 361-368https://doi.org/10.2351/1.5062259
ICALEO 2011; 369-377https://doi.org/10.2351/1.5062260
ICALEO 2011; 378-386https://doi.org/10.2351/1.5062261
ICALEO 2011; 387-394https://doi.org/10.2351/1.5062262

LMP 8: Welding II

ICALEO 2011; 395-402https://doi.org/10.2351/1.5062263
ICALEO 2011; 403-408https://doi.org/10.2351/1.5062264
ICALEO 2011; 409-417https://doi.org/10.2351/1.5062265
ICALEO 2011; 418-426https://doi.org/10.2351/1.5062270
ICALEO 2011; 427-434https://doi.org/10.2351/1.5062273

LMP 9: Laser Surface Modification I

ICALEO 2011; 435-441https://doi.org/10.2351/1.5062274
ICALEO 2011; 442-450https://doi.org/10.2351/1.5062275
ICALEO 2011; 451-456https://doi.org/10.2351/1.5062276
ICALEO 2011; 457-462https://doi.org/10.2351/1.5062277
ICALEO 2011; 463-472https://doi.org/10.2351/1.5062278

LMP 10: Laser Drilling

ICALEO 2011; 473-477https://doi.org/10.2351/1.5062279
ICALEO 2011; 478-481https://doi.org/10.2351/1.5062280
ICALEO 2011; 482-488https://doi.org/10.2351/1.5062281

LMP 11: Laser Surface Modification II

ICALEO 2011; 489-495https://doi.org/10.2351/1.5062282
ICALEO 2011; 496-502https://doi.org/10.2351/1.5062283
ICALEO 2011; 503-510https://doi.org/10.2351/1.5062284

LMP 12: Laser Processing of CFRP

ICALEO 2011; 511-515https://doi.org/10.2351/1.5062286
ICALEO 2011; 516-522https://doi.org/10.2351/1.5062287
ICALEO 2011; 523-528https://doi.org/10.2351/1.5062288

LMP 13: Welding III

ICALEO 2011; 529-535https://doi.org/10.2351/1.5062289
ICALEO 2011; 536-546https://doi.org/10.2351/1.5062290
ICALEO 2011; 547-551https://doi.org/10.2351/1.5062291
ICALEO 2011; 552-559https://doi.org/10.2351/1.5062292

LMP 14: Laser Metal Deposition (LMD): Process I

ICALEO 2011; 560-566https://doi.org/10.2351/1.5062293
ICALEO 2011; 567-576https://doi.org/10.2351/1.5062294
ICALEO 2011; 577-586https://doi.org/10.2351/1.5062295

LMP 15: Hybrid & Combination Processes

ICALEO 2011; 587-591https://doi.org/10.2351/1.5062296
ICALEO 2011; 592-598https://doi.org/10.2351/1.5062297
ICALEO 2011; 599-605https://doi.org/10.2351/1.5062298
ICALEO 2011; 606-611https://doi.org/10.2351/1.5062299
ICALEO 2011; 612-620https://doi.org/10.2351/1.5062301

LMP 16: Welding IV

ICALEO 2011; 621-629https://doi.org/10.2351/1.5062302
ICALEO 2011; 630-636https://doi.org/10.2351/1.5062303
ICALEO 2011; 637-645https://doi.org/10.2351/1.5062304
ICALEO 2011; 646-651https://doi.org/10.2351/1.5062305
ICALEO 2011; 652-660https://doi.org/10.2351/1.5062306
ICALEO 2011; 661-668https://doi.org/10.2351/1.5062307
ICALEO 2011; 669-678https://doi.org/10.2351/1.5062308

LMP 17: Laser Metal Deposition (LMD): Process II

ICALEO 2011; 679-682https://doi.org/10.2351/1.5062309
ICALEO 2011; 683-686https://doi.org/10.2351/1.5062310
ICALEO 2011; 687-694https://doi.org/10.2351/1.5062311
ICALEO 2011; 695-704https://doi.org/10.2351/1.5062312
ICALEO 2011; 705-710https://doi.org/10.2351/1.5062314
ICALEO 2011; 711-714https://doi.org/10.2351/1.5062315
ICALEO 2011; 715-724https://doi.org/10.2351/1.5062316
ICALEO 2011; 725-728https://doi.org/10.2351/1.5062318

LMP 18: High Brightness Laser Challenges

ICALEO 2011; 729-734https://doi.org/10.2351/1.5062319
ICALEO 2011; 735-740https://doi.org/10.2351/1.5062320
ICALEO 2011; 741-748https://doi.org/10.2351/1.5062321
ICALEO 2011; 749-755https://doi.org/10.2351/1.5062322
ICALEO 2011; 756-760https://doi.org/10.2351/1.5062323
ICALEO 2011; 761-764https://doi.org/10.2351/1.5062324

LASER MICROPROCESSING CONFERENCE

LMF 1: Drilling & Micromachining I

ICALEO 2011; 765-772https://doi.org/10.2351/1.5062325
ICALEO 2011; 773-782https://doi.org/10.2351/1.5062326
ICALEO 2011; 783-791https://doi.org/10.2351/1.5062327
ICALEO 2011; 792-797https://doi.org/10.2351/1.5062328
ICALEO 2011; 798-807https://doi.org/10.2351/1.5062329

LMF 2: Microjoining

ICALEO 2011; 808-816https://doi.org/10.2351/1.5062330
ICALEO 2011; 817-824https://doi.org/10.2351/1.5062332
ICALEO 2011; 825-832https://doi.org/10.2351/1.5062333
ICALEO 2011; 833-838https://doi.org/10.2351/1.5062334
ICALEO 2011; 839-845https://doi.org/10.2351/1.5062335

LMF 3: Photovoltaics

ICALEO 2011; 846-850https://doi.org/10.2351/1.5062336
ICALEO 2011; 851-855https://doi.org/10.2351/1.5062337
ICALEO 2011; 856-861https://doi.org/10.2351/1.5062338
ICALEO 2011; 862-868https://doi.org/10.2351/1.5062340
ICALEO 2011; 869-874https://doi.org/10.2351/1.5062341

LMF 4: Laser Sources for Microprocessing

ICALEO 2011; 875-881https://doi.org/10.2351/1.5062342
ICALEO 2011; 882-886https://doi.org/10.2351/1.5062343

LMF 5: Drilling and Micromachining II

ICALEO 2011; 887-894https://doi.org/10.2351/1.5062344
ICALEO 2011; 895-899https://doi.org/10.2351/1.5062345
ICALEO 2011; 900-905https://doi.org/10.2351/1.5062346
ICALEO 2011; 906-913https://doi.org/10.2351/1.5062347
ICALEO 2011; 914-916https://doi.org/10.2351/1.5062348

LMF 6: Laser Optics and Applications

ICALEO 2011; 917-925https://doi.org/10.2351/1.5062349
ICALEO 2011; 926-932https://doi.org/10.2351/1.5062350
ICALEO 2011; 933-940https://doi.org/10.2351/1.5062351
ICALEO 2011; 941-947https://doi.org/10.2351/1.5062352
ICALEO 2011; 948-953https://doi.org/10.2351/1.5062353
ICALEO 2011; 954-961https://doi.org/10.2351/1.5062354

LMF 7: Monitoring Detection and Adjustment

ICALEO 2011; 962-965https://doi.org/10.2351/1.5062356
ICALEO 2011; 966-971https://doi.org/10.2351/1.5062357
ICALEO 2011; 972-981https://doi.org/10.2351/1.5062358
ICALEO 2011; 982-986https://doi.org/10.2351/1.5062359
ICALEO 2011; 987-992https://doi.org/10.2351/1.5062360
ICALEO 2011; 993-999https://doi.org/10.2351/1.5062361

LMF 8: Laser Microdeposition Processes

ICALEO 2011; 1000-1004https://doi.org/10.2351/1.5062170
ICALEO 2011; 1005-1009https://doi.org/10.2351/1.5062171
ICALEO 2011; 1010-1015https://doi.org/10.2351/1.5062172

LMF 9: Thin Film Processing

ICALEO 2011; 1016-1021https://doi.org/10.2351/1.5062173
ICALEO 2011; 1022-1027https://doi.org/10.2351/1.5062174
ICALEO 2011; 1028-1037https://doi.org/10.2351/1.5062175
ICALEO 2011; 1038-1044https://doi.org/10.2351/1.5062176

LMF 10: Micromachining of Transparent Materials

ICALEO 2011; 1045-1048https://doi.org/10.2351/1.5062177
ICALEO 2011; 1049-1054https://doi.org/10.2351/1.5062178
ICALEO 2011; 1055-1059https://doi.org/10.2351/1.5062180
ICALEO 2011; 1060-1066https://doi.org/10.2351/1.5062181

LMF 11: Wavelength Optimization

ICALEO 2011; 1067-1074https://doi.org/10.2351/1.5062182
ICALEO 2011; 1075-1081https://doi.org/10.2351/1.5062183
ICALEO 2011; 1082-1087https://doi.org/10.2351/1.5062184
ICALEO 2011; 1088-1094https://doi.org/10.2351/1.5062185

LMF 12: Surface Modification

ICALEO 2011; 1095-1104https://doi.org/10.2351/1.5062186
ICALEO 2011; 1105-1110https://doi.org/10.2351/1.5062187
ICALEO 2011; 1111-1120https://doi.org/10.2351/1.5062189
ICALEO 2011; 1121-1125https://doi.org/10.2351/1.5062190
ICALEO 2011; 1126-1130https://doi.org/10.2351/1.5062191
ICALEO 2011; 1131-1136https://doi.org/10.2351/1.5062192

LMF 13: Medical Devices and Biomedical Applications

ICALEO 2011; 1137-1142https://doi.org/10.2351/1.5062193
ICALEO 2011; 1143-1151https://doi.org/10.2351/1.5062194
ICALEO 2011; 1152-1160https://doi.org/10.2351/1.5062195
ICALEO 2011; 1161-1167https://doi.org/10.2351/1.5062196
ICALEO 2011; 1168-1177https://doi.org/10.2351/1.5062197
ICALEO 2011; 1178-1181https://doi.org/10.2351/1.5062198

NANOMANUFACTURING CONFERENCE

Nano 1: Femtosecond Laser Nano-Processing

ICALEO 2011; 1182-1191https://doi.org/10.2351/1.5062199
ICALEO 2011; 1192-1199https://doi.org/10.2351/1.5062201
ICALEO 2011; 1200-1205https://doi.org/10.2351/1.5062202

Nano 2: Two-Photon Laser Nanolithography

ICALEO 2011; 1206-1210https://doi.org/10.2351/1.5062203
ICALEO 2011; 1211-1216https://doi.org/10.2351/1.5062204
ICALEO 2011; 1217-1221https://doi.org/10.2351/1.5062205

Nano 3: Laser-Material Interaction at Nanoscale

ICALEO 2011; 1222-1226https://doi.org/10.2351/1.5062206
ICALEO 2011; 1227-1232https://doi.org/10.2351/1.5062207
ICALEO 2011; 1233-1240https://doi.org/10.2351/1.5062208
ICALEO 2011; 1241-1246https://doi.org/10.2351/1.5062209

POSTER PRESENTATION GALLERY

ICALEO 2011; 1247-1250https://doi.org/10.2351/1.5062210
ICALEO 2011; 1251-1255https://doi.org/10.2351/1.5062211
ICALEO 2011; 1256-1260https://doi.org/10.2351/1.5062212
ICALEO 2011; 1261-1266https://doi.org/10.2351/1.5062214
ICALEO 2011; 1267-1271https://doi.org/10.2351/1.5062215
ICALEO 2011; 1272-1279https://doi.org/10.2351/1.5062216
ICALEO 2011; 1280-1286https://doi.org/10.2351/1.5062217
ICALEO 2011; 1287-1293https://doi.org/10.2351/1.5062218
ICALEO 2011; 1294-1300https://doi.org/10.2351/1.5062219
ICALEO 2011; 1301-1308https://doi.org/10.2351/1.5062221
ICALEO 2011; 1309-1314https://doi.org/10.2351/1.5062222
ICALEO 2011; 1315-1321https://doi.org/10.2351/1.5062223
ICALEO 2011; 1322-1325https://doi.org/10.2351/1.5062224
ICALEO 2011; 1326-1329https://doi.org/10.2351/1.5062225
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