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CHIPS: Future of Semiconductor Processing and Devices

Semiconductor devices, packaged individually or arranged monolithically into chips, are at the heart of information processing, storage, and communication in modern society and are used everywhere in every electronic and optoelectronic device. This special collection covers the future of semiconductor materials, devices, and processing, a topic that finds itself at the forefront of research and news with the passing of the United States CHIPS and Science Act of 2022 and the global rise of interest in quantum computing.

Guest Editors:
Eric A. Joseph, IBM
Catherine Labelle, Intel
Luciana Meli, IBM
Gottlieb S. Oehrlein, University of Maryland

Image Credit: David B. Graves, Catherine B. Labelle, Mark J. Kushner, Eray S. Aydil, Vincent M. Donnelly, Jane P. Chang, Peter Mayer, Lawrence Overzet, Steven Shannon, Shahid Rauf, and David N. Ruzic, JVST B 42 (4), 10.1116/6.0003531, (2024)

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Review Articles
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Atomic layer deposition of YSZ electrolytes for solid-state battery development: Beyond lithium Available to Purchase
Joel Molina-Reyes; Adriana M. Cuellar-Juarez; Jorge L. Vazquez-Arce; Hugo Tiznado-Vazquez
https://doi.org/10.1116/6.0004291
Electronic and Optoelectronic Materials, Devices and Processing
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Exploring SiC CVD growth parameters compatible with remote epitaxy Free
Daniel J. Pennachio; Jenifer R. Hajzus; Rachael L. Myers-Ward
https://doi.org/10.1116/6.0004106
Letters
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Nanocalorimetry for plasma metrology relevant to semiconductor fabrication Available to Purchase
J. Trey Diulus; Carles Corbella; Feng Yi; David LaVan; Berc Kalanyan; Mark McLean; Lakshmi Ravi Narayan; William A. Osborn; James E. Maslar; Andrei Kolmakov
https://doi.org/10.1116/6.0004294
Lithography
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Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications Open Access
A. S. Stodolna; T. W. Mechielsen; P. van der Walle; C. Meekes; H. Lensen
https://doi.org/10.1116/6.0003701
Microelectronic and Nanoelectronic Devices
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Cu1−xAlx films as alternatives to copper for advanced interconnect metallization Available to Purchase
Jean-Philippe Soulié; Kiroubanand Sankaran; Geoffrey Pourtois; Johan Swerts; Zsolt Tőkei; Christoph Adelmann
https://doi.org/10.1116/6.0003634
Roadmaps
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Future of plasma etching for microelectronics: Challenges and opportunities Open Access
Gottlieb S. Oehrlein; Stephan M. Brandstadter; Robert L. Bruce; Jane P. Chang; Jessica C. DeMott; Vincent M. Donnelly; Rémi Dussart; Andreas Fischer; Richard A. Gottscho; Satoshi Hamaguchi; Masanobu Honda; Masaru Hori; Kenji Ishikawa; Steven G. Jaloviar; Keren J. Kanarik; Kazuhiro Karahashi; Akiteru Ko; Hiten Kothari; Nobuyuki Kuboi; Mark J. Kushner; Thorsten Lill; Pingshan Luan; Ali Mesbah; Eric Miller; Shoubhanik Nath; Yoshinobu Ohya; Mitsuhiro Omura; Chanhoon Park; John Poulose; Shahid Rauf; Makoto Sekine; Taylor G. Smith; Nathan Stafford; Theo Standaert; Peter L. G. Ventzek
https://doi.org/10.1116/6.0003579
Electronic and Optoelectronic Materials, Devices and Processing
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Science challenges and research opportunities for plasma applications in microelectronics Available to Purchase
David B. Graves; Catherine B. Labelle; Mark J. Kushner; Eray S. Aydil; Vincent M. Donnelly; Jane P. Chang; Peter Mayer; Lawrence Overzet; Steven Shannon; Shahid Rauf; David N. Ruzic
https://doi.org/10.1116/6.0003531
Electronic and Optoelectronic Materials, Devices and Processing
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In situ plasma pin-up clean process for backside bevel polymer removal, defect reduction, and queue time relaxation Available to Purchase
Benjamin B. Ye; Ganquan Song; Jeff J. Ye
https://doi.org/10.1116/6.0003300
Electronic and Optoelectronic Materials, Devices and Processing
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Exploring oxide-nitride-oxide scalloping behavior with small gap structure and chemical analysis after fluorocarbon or hydrofluorocarbon plasma processing Available to Purchase
Sang-Jin Chung; Pingshan Luan; Minjoon Park; Andrew Metz; Gottlieb S. Oehrlein
https://doi.org/10.1116/6.0002868

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