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1-20 of 909 Search Results for
thin
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_008
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
...Gururajan, M. P. and Kumar, S., “Elastic stress driven instabilities in thin films and their assemblies,” in Strain Engineering in Functional Materials and Devices, edited by R. Ramadurai and S. Bhattacharyya (AIP Publishing, Melville, New York, 2023), pp. 8-1–8-26. Introduction Thin...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.6 Microstructural evolution in a thin film system with isotropic elasticity, the far-field composition is 0.05 leading to growth along with film break-up. From the top left, the microstructures correspond to (non-dimensional) time units: t = 114 600, t = 122 800, t = 133 800 and t = 205 800, respectively. These times indicate that the growth slows down the break-up dynamics compared to the previous case of (near) static break-up. More about this image found in Microstructural evolution in a thin film system with isotropic elasticity, ...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.7 Microstructural evolution in a thin film system with isotropic elasticity and two films in the simulation cell; the far-field composition is 0.01. From the top left, the microstructures correspond to (non-dimensional) time units: t = 78 800, t = 84 800, t = 100 800 and t = 251 000, respectively. Note that relatively, the break-up is faster for two films as compared to the case of a single film in the simulation cell. More about this image found in Microstructural evolution in a thin film system with isotropic elasticity a...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.8 Microstructural evolution in a thin film system with isotropic elasticity and two films in the simulation cell, the far-field composition is 0.05 leading to growth along with film break-up. From top left, the microstructures correspond to (non-dimensional) time units: t = 110 800, t = 122 800, t = 143 400, and t = 270 800, respectively. These times indicate that the growth slows down the break-up dynamics compared to the previous case of (near) static break-up. More about this image found in Microstructural evolution in a thin film system with isotropic elasticity a...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.9 Microstructural evolution in a thin film system with A Z = 1 3 . From top left, the microstructures correspond to (non-dimensional) time units: t = 9600, t = 11 400, t = 23 600 and t = 489 400, respectively. More about this image found in Microstructural evolution in a thin film system with A Z = 1 3 ...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.10 Microstructural evolution in a thin film system with AZ = 1. From top left, in the clockwise direction, the microstructures correspond to (non-dimensional) time units: t = 2600, t = 3000, t = 4000, and t = 11 700, respectively. More about this image found in Microstructural evolution in a thin film system with AZ...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.11 Microstructural evolution in a thin film system with A Z = 1 3 in 3D. From top left, in the clockwise direction, the microstructures correspond to (non-dimensional) time units: t = 100, t = 500, t = 1000, and t = 11 700 for the left and right columns, respectively. More about this image found in Microstructural evolution in a thin film system with A Z = 1 3 ...
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.1 Several processes governing the thin-film growth are depicted schematically. More about this image found in Several processes governing the thin-film growth are depicted schematically...
Images
in Phase-Field Modeling of Ferroic Domains in Strained Structures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 6.1 Schematic of an epitaxially grown thin film on a substrate. More about this image found in Schematic of an epitaxially grown thin film on a substrate.
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.1 Photographs of buckling of thick (symmetric) and thin (anti-symmetric) notebooks under compressive stresses. More about this image found in Photographs of buckling of thick (symmetric) and thin (anti-symmetric) note...
Images
in Elastic Stress Driven Instabilities in Thin Films and their Assemblies
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 8.5 Microstructural evolution in a thin film system with isotropic elasticity and two films in the simulation cell; the far-field composition is 0.01. From top left, the microstructures correspond to (non-dimensional) time units: t = 105 200, t = 109 600, t = 112 200, and t = 142 200, respectively. More about this image found in Microstructural evolution in a thin film system with isotropic elasticity a...
Images
in Recent Progress in Cantilever-Based Sensors: An Overview of Application and Fabrication Techniques
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 3.7 ALD-based thin layer growth process. Reprinted with permission Kim et al., Thin Solid Films 517 , 2563–2580 (2009). Copyright 2009 Elsevier. More about this image found in ALD-based thin layer growth process. Reprinted with permission Kim
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.13 (a) Substrate and film with lattice parameters a s and a 0 , respectively, where a s < a 0 . (b) Pseudomorphic growth with compressive strain. (c) Misfit dislocation of thin-film growth beyond critical thickness. More about this image found in (a) Substrate and film with lattice parameters a s and a 0...
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.18 Schematic of typical Ga-faced HEMT device structure. A nucleation layer is grown on the substrate for accommodating lattice mismatch. 2DEG is formed at the interface of the AlGaN/GaN interface on the GaN side. Thin GaN is formed at the top to make better contact. More about this image found in Schematic of typical Ga-faced HEMT device structure. A nucleation layer is ...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_frontmatter
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
... analysis are supported by the chapters pertaining to thin film fabrication and nanocomposites. Strain Engineering in Functional Materials and Devices: Provides extensive coverage of multifaceted aspects of strain engineering in functional materials Delivers fundamental understanding...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_index
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
... are supported by the chapters pertaining to thin film fabrication and nanocomposites. Strain Engineering in Functional Materials and Devices: Provides extensive coverage of multifaceted aspects of strain engineering in functional materials Delivers fundamental understanding of strain tuning...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
0
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
... dimension and size scaling of domains in thin films of multiferroic BiFeO3 ,” Phys. Rev. Lett. 100 , 027602 ( 2008 ). 10.1103/PhysRevLett.100.027602 Chen , L. Q. , “ Phase-field method of phase transitions/domain structures in ferroelectric thin films: A review ,” J. Am. Ceram...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
0
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
...References References Ashby , M. F. , Shercliff , H. , and Cebon , D. , Materials: Engineering, Science, Processing and Design ( Butterworth-Heinemann , 2018 ). Birkholz , M. , Thin Film Analysis by X-ray Scattering ( John Wiley & Sons , 2006...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
0
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
.... Mod. Phys. 71 , 1125 – 1171 ( 1999 ). 10.1103/RevModPhys.71.1125 16 Gao , H. and Nix , W. D. , “ Surface roughening of heteroepitaxial thin films ,” Annu. Rev. Mater. Sci. 29 , 173 – 209 ( 1999 ). 10.1146/annurev.matsci.29.1.173 17 Stangl , J. , Holý , V...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
0
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
...-6463/aac29b David , A. , Boullay , P. , Mangalam , R. V. K. , Barrier , N. , and Prellier , W. , “ Microstructure of epitaxial strained BiCrO3 thin films ,” Appl. Phys. Lett. 96 , 221904 ( 2010 ). 10.1063/1.3435486 Erdem , D. , Bingham , N. S...
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