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1-20 of 224 Search Results for
gan
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.15 Band diagrams of (a) valence band and (b) conduction band in the GaN/InGaN p–i–n structure. Carrier wavefunctions are not centrosymmetric due to polarization. E p and E n are the first bound states in the valence and conduction bands, respectively. (c) Induced sheet charge at the interfaces of QW due to polarization. More about this image found in Band diagrams of (a) valence band and (b) conduction band in the GaN/InGaN ...
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.20 Band diagrams of the AlGaN/GaN heterostructure for HEMT. Strained AlGaN is grown pseudomorphically on relaxed GaN. A positive polarization charge ( + σ ) is induced at the interface, which attracts electrons and forms 2DEG. More about this image found in Band diagrams of the AlGaN/GaN heterostructure for HEMT. Strained AlGaN is ...
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.18 Schematic of typical Ga-faced HEMT device structure. A nucleation layer is grown on the substrate for accommodating lattice mismatch. 2DEG is formed at the interface of the AlGaN/GaN interface on the GaN side. Thin GaN is formed at the top to make better contact. More about this image found in Schematic of typical Ga-faced HEMT device structure. A nucleation layer is ...
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.19 Illustration for spontaneous and piezoelectric polarization-induced sheet charge at the AlGaN/GaN interface for Ga-faced and N-faced growth direction. More about this image found in Illustration for spontaneous and piezoelectric polarization-induced sheet c...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_003
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
... altering the composition significantly. On the contrary, III-nitride, i.e., GaN-based materials, retain direct bandgap throughout the broad wavelength spectrum, thus making them ideal for lighting applications. By increasing the indium composition in InGaN, the peak emission wavelength can be broadly...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
0
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
...References References Amano , H. , Akasaki , I. , Hiramatsu , K. , Koide , N. , and Sawaki , N. , “ Effects of the buffer layer in metalorganic vapour phase epitaxy of GaN on sapphire substrate ,” Thin Solid Films 163 , 415 – 420 ( 1988 ). 10.1016/0040-6090(88)90458-0...
Images
in Future Prospect of β-Ga2O3: Materials, Devices and Circuit Applications
> Ultrawide Bandgap β-Ga2O3 SemiconductorTheory and Applications
Published: February 2023
FIG. 13.2 State-of-the-art SiC, GaN and Ga2O3 Schottky Barrier Diode (SBD) performance. Specific on-resistance Ron,sp and Vf normalized to area are plotted for each semiconductor. The dashed lines represent the Ron,sp vs breakdown voltage theoretical limit for each material ( Bhatnagar et al., 1992 ; Takatsuka et al., 2018 ; Lin et al., 2019 ; Lynch et al., 2019 ; Xiao et al., 2020 , 2021 ; Roy et al., 2021 ; Dong et al., 2022 ; Kumar et al., 2022 ; and Zhang et al., 2022 ). More about this image found in State-of-the-art SiC, GaN and Ga2O3 Schottky Barrier ...
Images
in Recent Progress in Cantilever-Based Sensors: An Overview of Application and Fabrication Techniques
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 3.5 Sketch of the two-layered microcantilever made of an elastic substrate and coated ultrathin film performing (a) flexural and (b) torsional oscillations. Reprinted with permission from Stachiv and Gan, Coatings 9 (8), 486 (2019). Copyright 2019 MDPI. More about this image found in Sketch of the two-layered microcantilever made of an elastic substrate and ...
Images
in Impact of Strain on the Electronic and Optoelectronic Properties of III-Nitride Semiconductor Heterostructures
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 3.14 Structure of typical III-nitride LEDs. Device operation depends on the lateral current injection. The buffer layer is grown on a substrate at low temperatures to accommodate high lattice mismatch. (a) InGaN MQW-based LEDs for blue/green/yellow LEDs. AlGaN-based electron blocking layer is used to prevent injected electrons from escaping the active region. (b) AlGaN MQW-based UV LEDs. p-GaN is grown on p-AlGaN to prevent oxidation of aluminum. More about this image found in Structure of typical III-nitride LEDs. Device operation depends on the late...
Images
in Future Prospect of β-Ga2O3: Materials, Devices and Circuit Applications
> Ultrawide Bandgap β-Ga2O3 SemiconductorTheory and Applications
Published: February 2023
FIG. 13.8 RON × QG vs VBK comparison of GaN SOA ( Wong et al., 2017a ), GaN COTS ( EPC, 2021 and Transphorm Inc., 2022 ), BGO switch ( Chabak et al., 2020 and Dryden et al., 2022 ) and estimated BGO devices. More about this image found in RON × Q...
Images
in Emerging Trends in MEMS/NEMS Based Technologies for Gas Sensing Applications
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 8.4 (a) Schematic of a self-leveling capacitive VOC sensor. (b) SEM image of the self-leveling sensor (i) 450 µm long device with PDMS polymer and (ii) magnified image of the suspended top electrode of the device with etch holes (i) Reproduced with permission from Likhite et al., Sens. Actuators B Chem. 311 , 127817 (2020). Copyright 2020 Elsevier. (c) SEM images of AlGaN/GaN heterostructure based dual channel MC heater design [(i) and (ii)] SEM images of a monolithic tip dual channel MC heater. The sensor and heater channels are visible in (ii). (iii) and (iv) Split tip dual channel MC heater with sensor and heater channels marked in (iv). Reproduced with permission from Jahangir and Koley, Sci. Rep. 6 , 28735 (2016). Copyright 2020 Author(s), licensed under a Creative Commons Attribution 3.0 Unported License. (d) Graphene membrane resonators (i) angled SEM image of suspended graphene membranes over fabricated trenches in SiO2. (ii) Angled SEM of an array of graphene membranes. (iii) Optical image of a large array of graphene membranes. Reprinted with permission from van der Zande et al., Nano Lett. 10 (12), 4869–4873 ( 2010 ). Copyright 2010 American Chemical Society. More about this image found in (a) Schematic of a self-leveling capacitive VOC sensor. (b) SEM image of th...
Book
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
Images
Published: February 2023
FIG. 1.7 Deep levels in AlxGa1-xN as a function of Al composition showing shallow to deep level transition of donor levels as the material transforms from WBG GaN to UWBG AlxGa1-xN ( Kamyczek et al., 2012 ). More about this image found in Deep levels in AlxGa1-xN as a function of Al composit...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_frontmatter
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
.... Following the theoretical chapter, one of the technologically important semiconductor materials such as GaN and the role of strain on its electronic properties are discussed. The initial part of the chapter discusses the strain pertaining to the thin film growth and its impact on the properties of group IV...
Images
Published: February 2023
FIG. 1.22 Experimentally obtained maximum operating temperature vs maximum reverse breakdown voltage of Schottky diodes showing β-Ga2O3 devices can reach high-temperature and high-breakdown operation with simpler designs compared to SiC and GaN ( Wang et al., 2019 ). More about this image found in Experimentally obtained maximum operating temperature vs maximum reverse br...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_008
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
... Si3N4 based piezoresistive MC array with integrated poly-Si piezoresistor to detect explosive vapors where the inbuilt residual stress of MC was controlled by the realization of asymmetrical structure. Other than Si-based materials, recently Gallium Nitride (GaN) based materials have also been explored...
Book Chapter
Series: AIPP Books, Principles
Published: February 2023
10.1063/9780735425033_013
EISBN: 978-0-7354-2503-3
ISBN: 978-0-7354-2500-2
... Conversion Power switch devices have traditionally leveraged the silicon processing and device physics infrastructure in place that has continued to push Moore's law to near its limit for the last several decades. As novel wider bandgap semiconductors have been commercialized (i.e., SiC MOSFETs, GaN...
Book Chapter
Series: AIPP Books, Principles
Published: February 2023
0
EISBN: 978-0-7354-2503-3
ISBN: 978-0-7354-2500-2
...-D unipolar limit of GaN and SiC ,” IEEE Electron Device Lett. 43 ( 5 ), 765 – 768 ( 2022 ). 10.1109/LED.2022.3160366 Dryden , D. M. , “ Scaled T-gate β-Ga2O3 MESFETs with 2.45 kV breakdown and high switching figure of merit ,” IEEE Electron Device Lett. 43...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_003
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
... of the cantilever beams ( Stachiv and Gan, 2019 ). FIG. 3.5 Sketch of the two-layered microcantilever made of an elastic substrate and coated ultrathin film performing (a) flexural and (b) torsional oscillations. Reprinted with permission from Stachiv and Gan, Coatings 9 (8), 486 (2019). Copyright 2019 MDPI...
Book Chapter
Series: AIPP Books, Principles
Published: February 2023
10.1063/9780735425033_001
EISBN: 978-0-7354-2503-3
ISBN: 978-0-7354-2500-2
... VB while keeping the RON−SP as low as possible. To achieve these goals, WBG semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) have advanced over the past years besides silicon. GaN and SiC have significantly wider bandgap...
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