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Book Chapter
Series: AIPP Books, Professional
Published: March 2023
10.1063/9780735425477_005
EISBN: 978-0-7354-2547-7
ISBN: 978-0-7354-2544-6
...van Kampen, P. and De Cock, M., “Students’ understandings of electricity and magnetism,” in The International Handbook of Physics Education Research: Learning Physics, edited by M. F. Taşar and P. R. L. Heron (AIP Publishing, Melville, New York, 2023), pp. 5-1–5-24. Introduction Writing...
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Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_010
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
...Bhat, A. P. and Ramadurai, R., “Strain engineering in 2-2 multilayered magneto-electric (ME) nanocomposites,“ in Strain Engineering in Functional Materials and Devices, edited by R. Ramadurai and S. Bhattacharyya (AIP Publishing, Melville, New York, 2023), pp. 10-1–10-20. Introduction...
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Book Chapter
Series: AIPP Books, Principles
Published: May 2022
10.1063/9780735422339_006
EISBN: 978-0-7354-2233-9
ISBN: 978-0-7354-2230-8
... electricity consumers in distribution networks brings substantial advantages while introducing several technical, economic, and operational challenges to the power system ( EIA—Electricity Data ). This would respond to the performance of the power system by exploiting demand response (DR) and/or distributed...
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(a) Schematic illustration of in situ electrical biasing TEM (Sato et al., 2011, 2012). DF-TEM image of PMN–PT and corresponding schematic drawing of domain structure (b) without an electric field, (c) under an electric field of 24.4 kV/cm, and (d) after removing the electric field (Sato et al., 2011). a, b, and c denote three different MDs, and the stripes indicate lamellar-like NDs.
Published: March 2023
FIG. 5.20 (a) Schematic illustration of in situ electrical biasing TEM ( Sato et al., 2011 , 2012 ). DF-TEM image of PMN–PT and corresponding schematic drawing of domain structure (b) without an electric field, (c) under an electric field of 24.4 kV/cm, and (d) after removing More about this image found in (a) Schematic illustration of in situ electrical biasing T...
Book Chapter
Series: AIPP Books, Professional
Published: March 2023
10.1063/9780735425514_020
EISBN: 978-0-7354-2551-4
ISBN: 978-0-7354-2548-4
... on kinematics. In 2004, Forster looked at questions with a graphical component on Tertiary Entrance Examinations in Western Australia (Foster, 2004). The questions related to topics other than mechanics, such as “Sound wave”, “Electric power,” “Structures and material,” and one on “movement. In summary...
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(a) ADF-STEM images and (b) lattice parameter (c) maps under 0 kV/cm and ±13.8 kV/cm. (c) Relationship between Δa and electric field and (d) relationship between Δc and electric field (Sato et al., 2020). Δa and Δc correspond to the difference in the lattice parameters a and c from their average at 0 kV/cm, respectively.
Published: March 2023
FIG. 5.21 (a) ADF-STEM images and (b) lattice parameter (c) maps under 0 kV/cm and ±13.8 kV/cm. (c) Relationship between Δa and electric field and (d) relationship between Δc and electric field ( Sato et al., 2020 ). Δa and Δc correspond More about this image found in (a) ADF-STEM images and (b) lattice parameter (c) maps und...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_003
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
... strain around the hetero-interface ( Lucovsky, 2001 ). This may have huge implications on the properties of the devices that primarily rely on the quality (electrical and structural) of their hetero-interface. Another source of strain within a material is the external pressure (hydrostatic strain...
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(a) Relationship of bandgap and critical breakdown electric field for direct and indirect semiconductors (Kaplar et al., 2016). (b) Theoretical limits of on-resistance and breakdown field of the semiconductors showing their predicted contours of BFOM (Tsao et al., 2017). Note that the theoretical BFOM contours assume that the dopant is completely ionized, which is often not the case in real WBG and UWBG semiconductors. Hence, a modified BFOM is used to evaluate the true material case accounting incomplete dopant ionization and background compensation effects that is shown later in Fig. 1.6.
Published: February 2023
FIG. 1.4 (a) Relationship of bandgap and critical breakdown electric field for direct and indirect semiconductors ( Kaplar et al., 2016 ). (b) Theoretical limits of on-resistance and breakdown field of the semiconductors showing their predicted contours of BFOM ( Tsao et al More about this image found in (a) Relationship of bandgap and critical breakdown electric field for direc...
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(a) Triangular electric field profile in a Schottky diode (Baliga, 2009). (b) WBG and UWBG devices require less depletion width (and hence device size) to withstand the same breakdown voltage due to their high breakdown field.
Published: February 2023
FIG. 1.5 (a) Triangular electric field profile in a Schottky diode ( Baliga, 2009 ). (b) WBG and UWBG devices require less depletion width (and hence device size) to withstand the same breakdown voltage due to their high breakdown field. More about this image found in (a) Triangular electric field profile in a Schottky diode ( Baliga, 2009 )....
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Device schematic and surface electric field (Esurf) along the vertical cutline (Ey) at the center of the anode contact for β-Ga2O3 (a) Regular Schottky diode and (b) Trench Schottky barrier diode (Li et al., 2021). (c) Reverse bias characteristics for a trench SBD with trench depth, dtr = 1.55 µm and conventional SBD showing lower leakage current density and higher breakdown voltage achieved by trench SBD (Li et al., 2021).
Published: February 2023
FIG. 1.17 Device schematic and surface electric field (Esurf) along the vertical cutline (Ey) at the center of the anode contact for β-Ga2O3 (a) Regular Schottky diode and (b) Trench Schottky barrier diode ( Li et al., 2021 More about this image found in Device schematic and surface electric field (Esurf...
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(a) Simulated electric field profile of the Trench Schottky barrier diode at breakdown voltage of 2.89 kV. (b) The electric field profile along cutline-1 shows that the peak field of 5.6 MV/cm appears at trench corners. (c) Electric field profile along the fin center (cutline 2) shows that the high electric field appears at the trench depth, dtr = 1.1 µm, whereas the near Schottky contact regions experience a reduced surface electric field of Esurf = 0.7 MV/cm. Cutline 3 along the trench center also shows the maximum electric field located at the trench depth (Li et al., 2021).
Published: February 2023
FIG. 1.18 (a) Simulated electric field profile of the Trench Schottky barrier diode at breakdown voltage of 2.89 kV. (b) The electric field profile along cutline-1 shows that the peak field of 5.6 MV/cm appears at trench corners. (c) Electric field profile along the fin center (cutline 2) shows More about this image found in (a) Simulated electric field profile of the Trench Schottky barrier diode a...
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Calculated practical maximum surface electric fields (Esurf) in β-Ga2O3 SBDs, defined at a maximum reverse leakage current (JR,max) of 1 or 100 mA/cm2 at 25 °C. Experimental data from the literature are also shown (solid for JR,max = 1 mA/cm2 and hollow for JR,max = 100 mA/cm2).
Published: February 2023
FIG. 8.19 Calculated practical maximum surface electric fields (Esurf) in β-Ga2O3 SBDs, defined at a maximum reverse leakage current (JR,max) of 1 or 100 mA/cm2 at 25 °C. Experimental data from the literature are also shown More about this image found in Calculated practical maximum surface electric fields (E...
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Simulated electric-field profiles in a β-Ga2O3 trench SBD along a vertical cutline at the center of a fin channel [see Fig. 8.23(a)] under a reverse bias of −1375 V by varying (a) Wfin and (b) dtr.
Published: February 2023
FIG. 8.24 Simulated electric-field profiles in a β-Ga2O3 trench SBD along a vertical cutline at the center of a fin channel [see Fig. 8.23(a) ] under a reverse bias of −1375 V by varying (a) Wfin and (b) d More about this image found in Simulated electric-field profiles in a β-Ga2O3 trench...