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1-20 of 224 Search Results for
deflect
Images
Published: March 2023
FIG. 2.4 Deflection of a cantilever beam under its own weight. More about this image found in Deflection of a cantilever beam under its own weight.
Images
Published: March 2023
FIG. 6.14 Simulated deflection of (a) asymmetric and (b) symmetric lancet as a function of inbuilt stress ( Bansal et al., 2015 and Bansal et al., 2016a , 2016b). More about this image found in Simulated deflection of (a) asymmetric and (b) symmetric lancet as a functi...
Images
Published: March 2023
FIG. 6.15 Deflection of the Ohmic switch at (a) high and (b) low temperatures. More about this image found in Deflection of the Ohmic switch at (a) high and (b) low temperatures.
Images
Published: March 2023
FIG. 6.16 Ohmic switch tip deflection with temperature. More about this image found in Ohmic switch tip deflection with temperature.
Images
Published: March 2023
FIG. 6.19 Top and tiled optical views of the cantilever structure along with tip deflection ( Bansal et al., 2019 ). More about this image found in Top and tiled optical views of the cantilever structure along with tip defl...
Images
in Strain Engineering of Metal Insulator Transition in VO2
> Strain Engineering in Functional Materials and Devices
Published: March 2023
FIG. 4.12 (a) Comparative displacement amplitude to length ratio; (b) microactuators showing closing of fingers at 65 °C and opening at 80 °C ( Liu et al., 2012 ); (c) SEM image of fabricated VO2/Si cantilever (inset shows its corresponding TEM image); and (d) thermally triggered cantilever deflection across the phase transition from monoclinic to rutile phase ( Viswanath and Ramanathan, 2013 ). More about this image found in (a) Comparative displacement amplitude to length ratio; (b) microactuators ...
Images
in Mechanics of Materials Considerations in MEMS-Based Medical Devices
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 5.1 Schematic of a MEMS pressure sensor. On the left, we show the top view of the sensor, where we can see the configuration of the four piezoresistors in the Wheatstone bridge circuit. On the right, we show the cross-sectional view of the sensor and the deflection of the sensor diaphragm under an external pressure field ( Sheela et al.) . More about this image found in Schematic of a MEMS pressure sensor. On the left, we show the top view of t...
Images
in Recent Progress in Cantilever-Based Sensors: An Overview of Application and Fabrication Techniques
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 3.9 Paper-based piezoresistive force sensor. (a) Schematic diagram of a paper-based force sensor using a carbon resistor (shown in black) as the sensing component, contact pads shown in silver ink (shown in blue) with perforation of fold lines made by a laser cutter; (b) folded sensor; and (c) force–deflection curve of unfolded and folded cantilever. Reprinted with permission from Liu et al., Lab Chip 11 (13), 2189 (2011). Copyright 2011 Royal Society of Chemistry. More about this image found in Paper-based piezoresistive force sensor. (a) Schematic diagram of a paper-b...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_003
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
... in fabrication technologies, both conventional VLSI/CMOS technology-based as well as emerging additive manufacturing-based techniques. Methods of Detection Principle of detection The microcantilever-based sensors are subjected to nanometer scale deflection, due to biomolecular interaction. The biomolecules...
Images
in Emerging Trends in MEMS/NEMS Based Technologies for Gas Sensing Applications
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 8.1 (a) Different operating modes of MC. Two principles: (i) microbalance-modification of resonance frequency (dynamic mode) and (ii) surface stress sensor-modification of deflection (static mode). Reprinted with permission from Dufour and Fadel, Sens. Actuators B Chem. 91 (1–3), 353–361 (2003). Copyright 2003 Elsevier. (b) Illustration of (i) bulk and (ii) surface micromachining processing steps forming suspended MCs. In bulk micromachining, the MC structure is directly etched into the wafer, which acts as the sacrificial layer, while in the surface micromachining, the wafer acts as the support and the sacrificial layer, typically SiO2, is fabricated directly on the wafer. Reprinted with permission from Waggoner and Craighead, Lab Chip 7 (10), 1238 ( 2007 ). Copyright 2007 Royal Society of Chemistry. More about this image found in (a) Different operating modes of MC. Two principles: (i) microbalance-modif...
Images
in Optical MEMS (Microspheres and Ring Resonators): Overview of Recent Progress
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 7.18 (a) Micromachined interferometric accelerometer showing the two optical beams, one from the diffraction grating and second from the mirror, which will interfere at the photodetector. (b) SiN nanobeam pair acting as “zipper” photonic crystal optomechanical cavity for accelerometry ( Krause et al., 2012 ). (c) Microdisk coupled to cantilever acting as a force sensor ( Doolin et al., 2014 ). The cantilever can deflect in both out-of-plane and in-plane mechanical modes. This results in the modulation of the disk's optical resonance frequency and is read out optically using a coupled fiber. (d) Split beam nano-cavity torque sensor ( Wu et al., 2014 ) showing the three degrees of freedom. One is out-of-plane rotation of the suspended mirror about the torsion beam, the second is in-plane bending about the torsion beam, and the third is out-of-plane bending of the cantilever mirror. More about this image found in (a) Micromachined interferometric accelerometer showing the two optical bea...
Images
in Emerging Trends in MEMS/NEMS Based Technologies for Gas Sensing Applications
> MEMS Applications in Electronics and Engineering
Published: March 2023
FIG. 8.2 (a) Scanning electron microscopy (SEM) images of the porous AAO cantilevers used for moisture sensing at different magnifications: (i) AAO cantilevers with a layer of gold coating of 30-nm thickness, (ii) enlarged SEM image of (i) reprinted with permission from Lee et al., Sens. Actuators B Chem. 137 (2), 561–565 (2009). Copyright 2009 Elsevier. (b) Fabrication of high surface area carbon nanotube (CNT)/carbon composite MC and measurement procedure comprises of (i) photolithographic patterning of a 4-nm iron (Fe) catalyst film, (ii) vertical growth of CNT forest from Fe catalyst, (iii) infiltration of the CNT forest and subsequent release from the substrate, and (iv) mounting of the fabricated device between a clamp and a piezoelectric element. Optical deflection measurement is then carried out using laser reflection (with permission to use under creative common license ( Noyce et al., 2019 ) published by the royal society of chemistry. More about this image found in (a) Scanning electron microscopy (SEM) images of the porous AAO cantilevers...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735425590_004
EISBN: 978-0-7354-2559-0
ISBN: 978-0-7354-2556-9
...) and applying pressure at the free end. On applying stress, one end deflects from its position, while the generated stress accumulates near the clamped region. On the other hand, the back-part and front parts of the nanobeam face compressive and tensile strains, respectively. The compression from the back...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_008
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
... signals (deflection or shift in resonance frequency) to meaningful outputs. Figures 8.1(a, i) and 8.1(a, ii) illustrate the different operating modes of the MC for gas sensing applications. FIG. 8.1 (a) Different operating modes of MC. Two principles: (i) microbalance-modification of resonance...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_002
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
... devices. Starting from pressure transducers to accelerometers, it is widely used. As shown in Fig. 2.4 , if there is a force P acting at the tip of the cantilever beam, the deflection of the beam is given as (2.14) δ = P L 3 / 3 E I where I = bh3/12...
Book Chapter
Series: AIPP Books, Methods
Published: March 2023
EISBN: 978-0-7354-2574-3
ISBN: 978-0-7354-2572-9
.... K. , Christian , J. M. , and Ho , C. K. , “ Compensation of gravity induced heliostat deflections for improved optical performance ,” J. Sol. Energy Eng., Trans. ASME 137 ( 2 ), 021016 ( 2015 ). 10.1115/1.4028938 Zeng , Z. , Ni , D. , and Xiao , G. , “ Real-time...
Book Chapter
Series: AIPP Books, Methods
Published: March 2023
10.1063/9780735425743_005
EISBN: 978-0-7354-2574-3
ISBN: 978-0-7354-2572-9
... deflection issues. Escobar-Toledo et al. (2014) concentrated on the change in position of the spot center along the horizontal and vertical axes. They did not, however, take into account the errors reflected in the spot shape variation. Sánchez-González et al. (2017) also investigated...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_006
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
... suited to measure both tensile and compressive stresses; these structures are chosen and fabricated on the wafer along with the device. The lancet tip's deflection direction indicates the nature of stress (tensile or compressive), and deflection magnitude reflects the stress value, which is simulated...
Book Chapter
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395_005
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
...). Capacitive (forms a variable capacitor by using diaphragm deflection resulting from pressure difference). Resonance (identifies changes in the resonance frequency of a plate/bridge, typically clamped at the edge, due to change in pressure). Piezoelectric (measures the change in the electrical charge...
Book
Series: AIPP Books, Principles
Published: March 2023
10.1063/9780735424395
EISBN: 978-0-7354-2439-5
ISBN: 978-0-7354-2436-4
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