Yueguang Deng, Ph.D., is Associate Professor at Beijing Institute of Technology School of Aerospace Engineering, Beijing, China. His award-winning research focuses on the interdisciplinary areas of liquid metal, chip cooling, and industrial thermal management, and promotes the development of the theory and technology in room temperature liquid metal thermal management methods. He is the author of more than 20 peer-reviewed journal articles and the winner of the Best Paper Award from the American Society of Mechanical Engineers (ASME) Journal of Electronic Packaging for his contribution on liquid metal cooling technology (2010–2011).

Jing Liu, Ph.D., is a Professor in the Department of Biomedical Engineering at the Tsinghua University School of Medicine, Beijing, China. He is the pioneer of fundamental discoveries in liquid metal chip cooling, printed electronics, and transformable soft machines, which have resulted in the development of game-changing technologies. He is the author of more than 500 peer-reviewed journal articles and 16 popular books and holds more than 200 patents. He is a winner of the William Begell Medal.