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Detailed Calculations of the Number of Distinct Sites Visited in Random Walk on Several Two-Dimensional Substrate Lattices
J. Vac. Sci. Technol. 8, 700–707 (1971)
https://doi.org/10.1116/1.1315380
Saturation Density of Stable Clusters in Thin Solid Films: Random-Walk Corrections
J. Vac. Sci. Technol. 8, 708–713 (1971)
https://doi.org/10.1116/1.1315381
Design and Construction of Small Conductances ( Torr⋅liter/sec) for Ultrahigh-Vacuum Applications
J. Vac. Sci. Technol. 8, 752–753 (1971)
https://doi.org/10.1116/1.1315389
Development Related to Rotatrode Melting as Applied to Production Practice
J. Vac. Sci. Technol. 8, VM13 (1971)
https://doi.org/10.1116/1.1315395
Selected Properties of Beryllium-Base Alloys Consolidated by Vacuum-Arc Melting
J. Vac. Sci. Technol. 8, VM23–VM28 (1971)
https://doi.org/10.1116/1.1315398
A Technique for Evaluating Titanium Alloys by Melting, Processing, and Testing Miniature Ingots
J. Vac. Sci. Technol. 8, VM29–VM32 (1971)
https://doi.org/10.1116/1.1315399
Effect of Reduced Pressure Induction Melting on Short Transverse Properties of 7075 Aluminum
J. Vac. Sci. Technol. 8, VM40 (1971)
https://doi.org/10.1116/1.1315404
The Reactivity of Vanadium and Some Vanadium Alloys with Low-Pressure Oxygen and Nitrogen
J. Vac. Sci. Technol. 8, VM41–VM47 (1971)
https://doi.org/10.1116/1.1315405
Influence of Vacuum Environment on the Composition, Structure, and Mechanical Behavior of the Tantalum Tungsten Hafnium Alloy T-111
J. Vac. Sci. Technol. 8, VM58–VM63 (1971)
https://doi.org/10.1116/1.1315407
Sulfur—Its Effects, Removal, or Modification in Vacuum Melting
J. Vac. Sci. Technol. 8, VM64 (1971)
https://doi.org/10.1116/1.1315410
Model for Calculating the Deposit Temperature in High-Rate Physical-Vapor-Deposition Process
J. Vac. Sci. Technol. 8, VM73–VM78 (1971)
https://doi.org/10.1116/1.1315413
Investigation of Factors Affecting the Composition of an Alloy Coating Deposited by Sputtering
J. Vac. Sci. Technol. 8, VM79 (1971)
https://doi.org/10.1116/1.1315414
Effect of Deposition Temperature on Condensed Phases in Sputtered Ni–Cr Thick Films
J. Vac. Sci. Technol. 8, VM80–VM85 (1971)
https://doi.org/10.1116/1.1315415
Temperature and Thickness Distribution on the Substrate during High-Rate Physical Vapor Deposition of Materials
J. Vac. Sci. Technol. 8, VM85–VM94 (1971)
https://doi.org/10.1116/1.1315416
Investigation of Hot-Filament and Hollow-Cathode Electron-Beam Techniques for Ion Plating
J. Vac. Sci. Technol. 8, VM99–VM104 (1971)
https://doi.org/10.1116/1.1315418