Grain boundary diffusion of K in polycrystalline Au films has been studied by the Auger surface accumulation method. A novel diffusant source which is clean, controlled, and localized was used. The Au film was deposited on a KCl substrate and an electron beam was sent through the Au film. K was then generated by electron impact dissociation of KCl. The value of the diffusion constant obtained is (K′δ/δ′)Db = (1.6±1.1)×10−13 cm2 s−1.

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