A process for fabricating submicron lines using photolithography and vacuum evaporation is described. In this process, a photoresist layer is deposited and treated to obtain an undercut profile using chlorobenzene. The submicron line is then deposited by direct evaporation onto the photoresist edge. Lines as narrow as 0.06 μm and aspect ratios ranging from 5:1 to 30:1 have been demonstrated. The process offers several advantages such as simple processing, dimensional control, and a broad materials range.

This content is only available via PDF.
You do not currently have access to this content.