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Future of plasma etching for microelectronics: Challenges and opportunities
Science challenges and research opportunities for plasma applications in microelectronics
Effect of inductively coupled plasma etch on the interface barrier behavior of (001) β-Ga2O3 Schottky barrier diode
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Compositional dependence of direct transition energies in SixGe1−x−ySny alloys lattice-matched to Ge/GaAs
Development of aspect ratio trapping growth of GeSn on Si for midwave infrared applications
Honeycomb-shaped vertically aligned carbon nanotubes decorated with molybdenum trioxide as an electrochemical sensor for glucose
Issues
Letters
Millimeter-wave generation with a room-temperature nonlinear quantum cascade laser
In Special Collection:
Mid-Infrared Optoelectronic Materials and Devices
J. Vac. Sci. Technol. B 42, 040601 (2024)
https://doi.org/10.1116/6.0003536
Mitigation of electronic crosstalk interference in graphene transistor biosensors
Rahul Deshmukh; Alexander James Wright; Moeid Jamalzadeh; Hashem Hassan Nasralla; Elisa Riedo; Davood Shahrjerdi
J. Vac. Sci. Technol. B 42, 040602 (2024)
https://doi.org/10.1116/6.0003783
Roadmaps
Future of plasma etching for microelectronics: Challenges and opportunities
In Special Collection:
CHIPS: Future of Semiconductor Processing and Devices
Gottlieb S. Oehrlein; Stephan M. Brandstadter; Robert L. Bruce; Jane P. Chang; Jessica C. DeMott; Vincent M. Donnelly; Rémi Dussart; Andreas Fischer; Richard A. Gottscho; Satoshi Hamaguchi; Masanobu Honda; Masaru Hori; Kenji Ishikawa; Steven G. Jaloviar; Keren J. Kanarik; Kazuhiro Karahashi; Akiteru Ko; Hiten Kothari; Nobuyuki Kuboi; Mark J. Kushner; Thorsten Lill; Pingshan Luan; Ali Mesbah; Eric Miller; Shoubhanik Nath; Yoshinobu Ohya; Mitsuhiro Omura; Chanhoon Park; John Poulose; Shahid Rauf; Makoto Sekine; Taylor G. Smith; Nathan Stafford; Theo Standaert; Peter L. G. Ventzek
J. Vac. Sci. Technol. B 42, 041501 (2024)
https://doi.org/10.1116/6.0003579
ARTICLES
Electronic and Optoelectronic Materials, Devices and Processing
Electronic and optical properties of lithium-doped boron nitride nanoribbons using density functional theory
J. Vac. Sci. Technol. B 42, 042201 (2024)
https://doi.org/10.1116/6.0003635
Science challenges and research opportunities for plasma applications in microelectronics

In Special Collection:
CHIPS: Future of Semiconductor Processing and Devices
David B. Graves; Catherine B. Labelle; Mark J. Kushner; Eray S. Aydil; Vincent M. Donnelly; Jane P. Chang; Peter Mayer; Lawrence Overzet; Steven Shannon; Shahid Rauf; David N. Ruzic
J. Vac. Sci. Technol. B 42, 042202 (2024)
https://doi.org/10.1116/6.0003531
Use of plasma process diagnostic sensors for the monitoring of in situ dry cleaning of plasma enhanced chemical vapor deposition chamber
J. Vac. Sci. Technol. B 42, 042203 (2024)
https://doi.org/10.1116/6.0003288
Effect of inductively coupled plasma etch on the interface barrier behavior of (001) β-Ga2O3 Schottky barrier diode
J. Vac. Sci. Technol. B 42, 042204 (2024)
https://doi.org/10.1116/6.0003608
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
Haochen Zhao; Suho Park; Guangyang Lin; Yuying Zhang; Tuofu Zhama; Chandan Samanta; Lorry Chang; Xiaofeng Zhu; Xu Feng; Kevin O. Díaz-Aponte; Lin Cong; Yuping Zeng
J. Vac. Sci. Technol. B 42, 042205 (2024)
https://doi.org/10.1116/6.0003561
Compositional dependence of direct transition energies in SixGe1−x−ySny alloys lattice-matched to Ge/GaAs
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
J. Vac. Sci. Technol. B 42, 042206 (2024)
https://doi.org/10.1116/6.0003737
X-ray photoelectron spectroscopy surface oxidation study of remote plasma-enhanced chemical vapor deposition-grown Ge1−xSnx/Si alloys
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
Kevin Choe; Jeremy Hunter; Christopher Sutphin; Daniel Felker; Bruce Claflin; Gordon Grzybowski; Christina Dugan
J. Vac. Sci. Technol. B 42, 042207 (2024)
https://doi.org/10.1116/6.0003688
Roughness-generation mechanism of Ru etching using Cl2/O2-based plasma for advanced interconnect
Miyako Matsui; Yohei Ishii; Lucas Kovatch; Kathryn Maier; Masaya Imai; Makoto Miura; Kenichi Kuwahara
J. Vac. Sci. Technol. B 42, 042208 (2024)
https://doi.org/10.1116/6.0003736
Desorption model of volatile Ru species induced by partial chlorination on Ru(0001) under an O2/Cl2-based plasma process
J. Vac. Sci. Technol. B 42, 042209 (2024)
https://doi.org/10.1116/6.0003706
Magneto-transport study on Sn-rich Sn1−xGex thin films enabled by CdTe buffer layer
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
Rabindra Basnet; Dinesh Upreti; Tyler T. McCarthy; Zheng Ju; Allison M. McMinn; M. M. Sharma; Yong-Hang Zhang; Jin Hu
J. Vac. Sci. Technol. B 42, 042210 (2024)
https://doi.org/10.1116/6.0003564
Transition from the regime of thermionic emission to the space-charge limited current regime under strong Shottky effects
J. Vac. Sci. Technol. B 42, 042212 (2024)
https://doi.org/10.1116/6.0003700
GaAs/GeSn/Ge n–i–p diodes and light emitting diodes formed via grafting
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
Jie Zhou; Haibo Wang; Po Rei Huang; Shengqiang Xu; Yang Liu; Jiarui Gong; Jianping Shen; Daniel Vicent; Samuel Haessly; Alireza Abrand; Parsian K. Mohseni; Munho Kim; Shui-Qing Yu; Guo-En Chang; Xiao Gong; Zhenqiang Ma
J. Vac. Sci. Technol. B 42, 042213 (2024)
https://doi.org/10.1116/6.0003619
Lithography
Lithography mask thermal and stress effect for the machine overlay compensation
J. Vac. Sci. Technol. B 42, 042601 (2024)
https://doi.org/10.1116/6.0003693
Patterning functional oxides: Some failures and solutions in fabricating a Hall bar
Lishai Shoham; Brajagopal Das; Amit Shacham; Maria Baskin; Orna Ternyak; Jörg Schöpf; Eran Lipp; Lior Kornblum
J. Vac. Sci. Technol. B 42, 042602 (2024)
https://doi.org/10.1116/6.0003713
Soft and hard trimming of imprint resist masks to fabricate silicon nanodisk arrays with different edge roughness
J. Vac. Sci. Technol. B 42, 042603 (2024)
https://doi.org/10.1116/6.0003779
Nanoscale Science and Technology
Comparative study on variable axis lens systems based on tapered deflectors
J. Vac. Sci. Technol. B 42, 042801 (2024)
https://doi.org/10.1116/6.0003605
Development of aspect ratio trapping growth of GeSn on Si for midwave infrared applications
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
Hryhorii Stanchu; Grey Abernathy; Joshua Grant; Fernando M. de Oliveira; Yuriy I. Mazur; Jifeng Liu; Wei Du; Baohua Li; Gregory J. Salamo; Shui-Qing Yu
J. Vac. Sci. Technol. B 42, 042802 (2024)
https://doi.org/10.1116/6.0003734
Enhanced contact resistance reduction in MoS2 transistors via ultrathin LiPON electrode interface doping
Ting Pan; Yonghuang Wu; Run Shi; Haowen Liu; Ruoyu Tong; Ruixuan Peng; Bochen Zhao; Kai Liu; Yuegang Zhang
J. Vac. Sci. Technol. B 42, 042803 (2024)
https://doi.org/10.1116/5.0215419
MEMS and NEMS
Microelectronic and Nanoelectronic Devices
Thermally stable radio frequency power and noise behaviors of AlGaN/GaN high electron mobility transistor without voltage-blocking buffer layer design
Chong-Rong Huang; Hsien-Chin Chiu; Hsuan-Ling Kao; Hsiang-Chun Wang; Shinn-Yn Lin; Chih-Tien Chen; Kuo-Jen Chang
J. Vac. Sci. Technol. B 42, 043201 (2024)
https://doi.org/10.1116/6.0003551
5.0 μm emitting interband cascade lasers with superlattice and bulk AlGaAsSb claddings
In Special Collection:
Mid-Infrared Optoelectronic Materials and Devices
J. Vac. Sci. Technol. B 42, 043202 (2024)
https://doi.org/10.1116/6.0003584
Cu1−xAlx films as alternatives to copper for advanced interconnect metallization
In Special Collection:
CHIPS: Future of Semiconductor Processing and Devices
Jean-Philippe Soulié; Kiroubanand Sankaran; Geoffrey Pourtois; Johan Swerts; Zsolt Tőkei; Christoph Adelmann
J. Vac. Sci. Technol. B 42, 043203 (2024)
https://doi.org/10.1116/6.0003634
Organic Electronic and Optoelectronic Devices
Carbonized polyvinylidene difluoride films irradiated by variable-energy Ar+: Tunable morphology and resistive sensing
In Special Collection:
Physics and Chemistry of Surfaces and Interfaces
Islam F. Nuriahmetov; Ilya A. Zavidovskiy; Abdusame A. Khaidarov; Natalya F. Savchenko; Andrey A. Tatarintsev; Viacheslav V. Dremov; Oleg A. Streletskiy
J. Vac. Sci. Technol. B 42, 043401 (2024)
https://doi.org/10.1116/6.0003657
Magnetic Devices and Spintronics
Performance enhancement in spin transfer torque magnetic random access memory through in situ cap layer optimization
J. Vac. Sci. Technol. B 42, 043801 (2024)
https://doi.org/10.1116/6.0003661
Measurement and Characterization
Comparison of GeSn alloy films prepared by ion implantation and remote plasma-enhanced chemical vapor deposition methods
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
X. Huang; S. Q. Lim; T. Ratcliff; L. A. Smillie; G. J. Grzybowski; B. B. Claflin; J. M. Warrender; J. S. Williams
J. Vac. Sci. Technol. B 42, 044001 (2024)
https://doi.org/10.1116/6.0003668
In situ mass spectrometric investigation to probe GeSn growth dynamics and mechanisms in the chemical vapor deposition processes
In Special Collection:
Developing SiGeSn Technology: Materials and Devices
Joshua M. Grant; Enbo Yang; Narges Masoumi; Alexander Golden; Joe Margetis; Andrew Chizmeshya; Wei Du; Shui-Qing Yu
J. Vac. Sci. Technol. B 42, 044002 (2024)
https://doi.org/10.1116/6.0003566
Emission enhancement of GaN field emitter arrays in an N2 environment
J. Vac. Sci. Technol. B 42, 044004 (2024)
https://doi.org/10.1116/6.0003704
Honeycomb-shaped vertically aligned carbon nanotubes decorated with molybdenum trioxide as an electrochemical sensor for glucose
J. Vac. Sci. Technol. B 42, 044005 (2024)
https://doi.org/10.1116/6.0003677
Vacuum Measurement and Technology
Upgrading of the modified Knudsen equation and its verification for calculating the gas flow rate through cylindrical tubes
J. Vac. Sci. Technol. B 42, 044201 (2024)
https://doi.org/10.1116/6.0003581
Numerical analysis of high vacuum packaging efficiency for narrow structured devices
J. Vac. Sci. Technol. B 42, 044202 (2024)
https://doi.org/10.1116/6.0003641
Research on the improvement of the adhesion strength of the Cu films deposited on the Al2O3 films
J. Vac. Sci. Technol. B 42, 044203 (2024)
https://doi.org/10.1116/6.0003649
Characteristics of a hybrid radio frequency capacitively and inductively coupled plasma using hydrogen gas
J. Vac. Sci. Technol. B 42, 044204 (2024)
https://doi.org/10.1116/5.0213602
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Heating of photocathode via field emission and radiofrequency pulsed heating: Implication toward breakdown
Ryo Shinohara, Soumendu Bagchi, et al.