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Volume 40, Issue 4

July 2022

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Cover Image

Cover Image

ISSN 2166-2746

EISSN 2166-2754

In this Issue

Letters
ARTICLES

Letters

Simplified CVD route to near-zero thickness silicon nitride films

Barry Arkles; Chad Brick; Jonathan Goff; Alain E. Kaloyeros

J. Vac. Sci. Technol. B 40, 040601 (2022) https://doi.org/10.1116/6.0001820

Abstract

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Device feasibility and performance improvement methodologies for thin film transistors using In-Ga-Sn-O channels prepared by atomic-layer deposition

Shin-Ho Noh; Hyo-Eun Kim; Young-Ha Kwon; Nak-Jin Seong; Kyu-Jeong Choi; Sung-Min Yoon

J. Vac. Sci. Technol. B 40, 040602 (2022) https://doi.org/10.1116/6.0001945

Abstract

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ARTICLES

Electronic and Optoelectronic Materials, Devices and Processing

Effects of iCVD organic passivation in oxide thin-film transistors under repetitive bending stress for electrical and mechanical stability

Taeseung Jung; Sanghun Jeon

J. Vac. Sci. Technol. B 40, 042201 (2022) https://doi.org/10.1116/6.0001800

Abstract

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Influence of the electron kinetics on Ar/NF₃ inductively coupled plasma

Dmitry Levko; Laxminarayan L. Raja

J. Vac. Sci. Technol. B 40, 042202 (2022) https://doi.org/10.1116/6.0001906

Abstract

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Study of simulations of double graded InGaN solar cell structures

Mirsaeid Sarollahi; Mohammad Zamani-Alavijeh; Rohith Allaparthi; Manal A. Aldawsari; Malak Refaei; Reem Alhelais; Md Helal Uddin Maruf; Yuriy I. Mazur; Morgan E. Ware

J. Vac. Sci. Technol. B 40, 042203 (2022) https://doi.org/10.1116/6.0001841

Abstract

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Enhanced optoelectronic properties of magnetron sputtered ITO/Ag/ITO multilayers by electro-annealing

Zemzem Uyanik; Fulya Turkoglu; Hasan Koseoglu; Merve Ekmekcioglu; Bengu Ata; Yasemin Demirhan; Mehtap Ozdemir; Gulnur Aygun; Lutfi Ozyuzer

J. Vac. Sci. Technol. B 40, 042204 (2022) https://doi.org/10.1116/6.0001868

Abstract

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Lithography

Overlay control solution for high aspect ratio etch process induced overlay error

Enze Ma; Libin Zhang; Yaobin Feng; Le Ma; Shixin Zhang; Yayi Wei

J. Vac. Sci. Technol. B 40, 042601 (2022) https://doi.org/10.1116/6.0001814

Abstract

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Stochastic defect removal coating for high-performance extreme ultraviolet lithography

Young Joo Choi; Ran Namgung; Jun Soo Kim; Dae Seok Song; Hyeon Park; Shin-hyo Bae; Min-Ki Chon; Min Soo Kim; Hyun-Ji Song; Hyun-Woo Kim; Suk Koo Hong

J. Vac. Sci. Technol. B 40, 042602 (2022) https://doi.org/10.1116/6.0001723

Abstract

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Theoretical research on suppression ratio of dynamic gas lock for extreme ultraviolet lithography contamination control

Jiazheng Sun; Kuibo Wang; Xiaobin Wu; Yan Luo; Jinbin Ding

J. Vac. Sci. Technol. B 40, 042603 (2022) https://doi.org/10.1116/6.0001852

Abstract

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Nanoscale Science and Technology

Investigation of Rb⁺ milling rates using an ultracold focused ion beam

S. Xu; Y. Li; E. J. D. Vredenbregt

J. Vac. Sci. Technol. B 40, 042801 (2022) https://doi.org/10.1116/6.0001838

Abstract

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On modeling the induced charge in density-functional calculations for field emitters

In Special Collection: Vacuum Nanoelectronics

S. M. Masur; C. J. Edgcombe; C. H. W. Barnes

J. Vac. Sci. Technol. B 40, 042802 (2022) https://doi.org/10.1116/6.0001886

Abstract

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Scanning anode field emission microscopy of a single Si emitter

Girish Rughoobur; Olusoji O. Ilori; Akintunde I. Akinwande

J. Vac. Sci. Technol. B 40, 042803 (2022) https://doi.org/10.1116/6.0001938

Abstract

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Influence of thermal contact resistance on the field emission characteristics of a carbon nanotube

Jonathan Ludwick; Nathaniel Hernandez; Geet Tripathi; Marc Cahay; Tyson Back; Kevin L. Jensen

J. Vac. Sci. Technol. B 40, 042804 (2022) https://doi.org/10.1116/6.0002001

Abstract

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MEMS and NEMS

Design and fabrication of a micro-opto-mechanical-systems accelerometer based on intensity modulation of light fabricated by a modified deep-reactive-ion-etching process using silicon-on-insulator wafer

Reza Gholamzadeh; Milad Gharooni; Hassan Salarieh; Javad Akbari

J. Vac. Sci. Technol. B 40, 043001 (2022) https://doi.org/10.1116/6.0001779

Abstract

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ZnO piezoelectric coatings used for the ultrasonic excitation of longitudinal-transverse waves and their application for smart bolts

Yanghui Jiang; Jingyu Li; Guangming Jiao; Wensheng Li; Yan Liu; Chuan Wang; Binhong Xia; Binhua Wan; Jun Zhang; Vasiliy Pelenovich; Sheng Liu; Bing Yang

J. Vac. Sci. Technol. B 40, 043002 (2022) https://doi.org/10.1116/6.0001845

Abstract

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Microelectronic and Nanoelectronic Devices

Resistive switching of two-dimensional Ag₂S nanowire networks for neuromorphic applications

In Special Collection: Neuromorphic Materials, Devices, and Processing

Mahshid Hosseini; Nikolay Frick; Damien Guilbaud; Ming Gao; Thomas H. LaBean

J. Vac. Sci. Technol. B 40, 043201 (2022) https://doi.org/10.1116/6.0001867

Abstract

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CHORUS

Measurement and Characterization

Seesaw-type modulation of secondary electron emission characteristics of polytetrafluoroethylene-MgO composite coating

Yahui Cai; Dan Wang; Wen Zhang; Yongning He

J. Vac. Sci. Technol. B 40, 044001 (2022) https://doi.org/10.1116/6.0001921

Abstract

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Hollow cathode enhanced capacitively coupled plasmas in Ar/N₂/H₂ mixtures and implications for plasma enhanced ALD

In Special Collection: Plasma Processing for Advanced Microelectronics

David R. Boris; Michael J. Johnson; Charles R. Eddy, Jr.; Scott G. Walton

J. Vac. Sci. Technol. B 40, 044002 (2022) https://doi.org/10.1116/6.0001840

Abstract

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Vacuum Measurement and Technology

Integrated interferometry for in-process monitoring of critical dimension in vertical NAND flash memory dry etch

In Special Collection: Plasma Processing for Advanced Microelectronics

Se-Jin Oh

J. Vac. Sci. Technol. B 40, 044201 (2022) https://doi.org/10.1116/6.0001883

Abstract

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Design of the vacuum-centralized control system for the space plasma environment research facility based on the Experimental Physics and Industrial Control System

Chenggang Jin; Yongqi Zhang; Wenbin Ling; Xinglin Yang; Jiangnan Cheng; Li Feng; Jie Wan; Huan Wang; Yaowen Lu; Liyi Li; Peng E.

J. Vac. Sci. Technol. B 40, 044202 (2022) https://doi.org/10.1116/6.0001931

Abstract

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Outgassing rate testbed for in-operation analysis of powered and heated assemblies

Marvin Warner; Michael Elsen; Lisa Wörner; Claus Braxmaier; Jens Grosse

J. Vac. Sci. Technol. B 40, 044203 (2022) https://doi.org/10.1116/6.0001898

Abstract

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Letters

Simplified CVD route to near-zero thickness silicon nitride films

Device feasibility and performance improvement methodologies for thin film transistors using In-Ga-Sn-O channels prepared by atomic-layer deposition

ARTICLES

Electronic and Optoelectronic Materials, Devices and Processing

Effects of iCVD organic passivation in oxide thin-film transistors under repetitive bending stress for electrical and mechanical stability

Influence of the electron kinetics on Ar/NF₃ inductively coupled plasma

Study of simulations of double graded InGaN solar cell structures

Enhanced optoelectronic properties of magnetron sputtered ITO/Ag/ITO multilayers by electro-annealing

Lithography

Overlay control solution for high aspect ratio etch process induced overlay error

Stochastic defect removal coating for high-performance extreme ultraviolet lithography

Theoretical research on suppression ratio of dynamic gas lock for extreme ultraviolet lithography contamination control

Nanoscale Science and Technology

Investigation of Rb⁺ milling rates using an ultracold focused ion beam

On modeling the induced charge in density-functional calculations for field emitters

Scanning anode field emission microscopy of a single Si emitter

Influence of thermal contact resistance on the field emission characteristics of a carbon nanotube

MEMS and NEMS

Design and fabrication of a micro-opto-mechanical-systems accelerometer based on intensity modulation of light fabricated by a modified deep-reactive-ion-etching process using silicon-on-insulator wafer

ZnO piezoelectric coatings used for the ultrasonic excitation of longitudinal-transverse waves and their application for smart bolts

Microelectronic and Nanoelectronic Devices

Resistive switching of two-dimensional Ag₂S nanowire networks for neuromorphic applications

Measurement and Characterization

Seesaw-type modulation of secondary electron emission characteristics of polytetrafluoroethylene-MgO composite coating

Hollow cathode enhanced capacitively coupled plasmas in Ar/N₂/H₂ mixtures and implications for plasma enhanced ALD

Vacuum Measurement and Technology

Integrated interferometry for in-process monitoring of critical dimension in vertical NAND flash memory dry etch

Design of the vacuum-centralized control system for the space plasma environment research facility based on the Experimental Physics and Industrial Control System

Outgassing rate testbed for in-operation analysis of powered and heated assemblies

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Issues

Cover Image

Letters

ARTICLES

Electronic and Optoelectronic Materials, Devices and Processing

Lithography

Nanoscale Science and Technology

MEMS and NEMS

Microelectronic and Nanoelectronic Devices

Measurement and Characterization

Vacuum Measurement and Technology

RSS

Resources

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pubs.aip.org

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