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Impact of fast transient charging and ambient on mobility of WS2 field-effect transistor
Review Article: Tunneling-based graphene electronics: Methods and examples
Nitride etching with hydrofluorocarbons. I. Selective etching of nitride over silicon and oxide materials by gas discharge optimization and selective deposition of fluorocarbon polymer
Issues
September 2017
ISSN 2166-2746
EISSN 2166-2754
Letters
Impact of fast transient charging and ambient on mobility of WS2 field-effect transistor
J. Vac. Sci. Technol. B 35, 050601 (2017)
https://doi.org/10.1116/1.4989781
Anodic porous alumina with square holes through lattice conversion of naturally occurring ordered structures
J. Vac. Sci. Technol. B 35, 050602 (2017)
https://doi.org/10.1116/1.4999283
Review Articles
Review Article: Tunneling-based graphene electronics: Methods and examples
J. Vac. Sci. Technol. B 35, 050801 (2017)
https://doi.org/10.1116/1.4995380
Electronic & Optoelectronic Materials, Devices & Processing
Annealing of dry etch damage in metallized and bare (-201) Ga2O3
Jiancheng Yang; Fan Ren; Rohit Khanna; Kristen Bevlin; Dwarakanath Geerpuram; Li-Chun Tung; Jingyu Lin; Hongxing Jiang; Jonathan Lee; Elena Flitsiyan; Leonid Chernyak; S. J. Pearton; Akito Kuramata
J. Vac. Sci. Technol. B 35, 051201 (2017)
https://doi.org/10.1116/1.4986300
Analysis of strain induced carrier confinement with varying passivation thickness of the Al0.3Ga0.7N/GaN heterostructure with graded AlxGa1-xN buffer on Si (111) substrate
Syed Mukulika Dinara; Saptarsi Ghosh; Sanjay Kr. Jana; Shubhankar Majumdar; Dhrubes Biswas; Sekhar Bhattacharya
J. Vac. Sci. Technol. B 35, 051202 (2017)
https://doi.org/10.1116/1.4996735
Enhanced recrystallization and dopant activation of P+ ion-implanted super-thin Ge layers by RF hydrogen plasma treatment
Alexei N. Nazarov; Volodymyr O. Yukhymchuk; Yurii V. Gomeniuk; Sergiy B. Kryvyi; Pavel N. Okholin; Petro M. Lytvyn; Vasyl P. Kladko; Volodymyr S. Lysenko; Volodymyr I. Glotov; Illya E. Golentus; Enrico Napolitani; Ray Duffy
J. Vac. Sci. Technol. B 35, 051203 (2017)
https://doi.org/10.1116/1.4996139
Near-infrared laser annealing of Ge layers epitaxially grown on Si for high-performance photonic devices
J. Vac. Sci. Technol. B 35, 051206 (2017)
https://doi.org/10.1116/1.4995321
Effect of composition in Si1−xGex seed layer on the solid phase crystallization of ultrathin amorphous silicon layer
J. Vac. Sci. Technol. B 35, 051207 (2017)
https://doi.org/10.1116/1.4993801
Energy Conversion and Storage Devices
Lithography
Electron beam lithography using fixed beam moving stage
J. Vac. Sci. Technol. B 35, 051601 (2017)
https://doi.org/10.1116/1.4997018
Fabrication of tungsten Fresnel zone plates for hard x-rays using wet etching
J. Vac. Sci. Technol. B 35, 051602 (2017)
https://doi.org/10.1116/1.4999933
Proximity effect correction in electron-beam lithography based on computation of critical-development time with swarm intelligence
J. Vac. Sci. Technol. B 35, 051603 (2017)
https://doi.org/10.1116/1.5001686
Nanometer Science & Technology
Unexpected validity of Schottky's conjecture for two-stage field emitters: A response via Schwarz–Christoffel transformation
J. Vac. Sci. Technol. B 35, 051801 (2017)
https://doi.org/10.1116/1.4989428
In situ resistance measurements during physical vapor deposition of ultrathin metal films on Si(111) at room temperature
J. Vac. Sci. Technol. B 35, 051802 (2017)
https://doi.org/10.1116/1.5001669
Nitride etching with hydrofluorocarbons. I. Selective etching of nitride over silicon and oxide materials by gas discharge optimization and selective deposition of fluorocarbon polymer
Sebastian U. Engelmann; Robert L. Bruce; Eric A. Joseph; Nicholas C. M. Fuller; William S. Graham; Edmund M. Sikorski; Mahmoud Kohjasteh; Yu Zhu; Masahiro Nakamura; Azumi Ito; Hirokazu Matsumoto; Goh Matsuura; Takefumi Suzuki
J. Vac. Sci. Technol. B 35, 051803 (2017)
https://doi.org/10.1116/1.5003824
MEMS & NEMS
ScAlN etch mask for highly selective silicon etching
J. Vac. Sci. Technol. B 35, 052001 (2017)
https://doi.org/10.1116/1.4994841
Microelectronic & Nanoelectronic Devices
Fabrication and comparative study of DC and low frequency noise characterization of GaN/AlGaN based MOS-HEMT and HEMT
J. Vac. Sci. Technol. B 35, 052202 (2017)
https://doi.org/10.1116/1.4998937
Electrical analyses of GaN PIN diodes grown on patterned sapphire substrates
J. Vac. Sci. Technol. B 35, 052203 (2017)
https://doi.org/10.1116/1.4997900
Shop Notes
Minimizing open-loop piezoactuator nonlinearity artifacts in atomic force microscope measurements
J. Vac. Sci. Technol. B 35, 053201 (2017)
https://doi.org/10.1116/1.4994315
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Heating of photocathode via field emission and radiofrequency pulsed heating: Implication toward breakdown
Ryo Shinohara, Soumendu Bagchi, et al.