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Issues
January 2010
ISSN 2166-2746
EISSN 2166-2754
In this Issue
Review Article
Low-dimensional oxide nanostructures on metals: Hybrid systems with novel properties
J. Vac. Sci. Technol. B 28, 1–16 (2010)
https://doi.org/10.1116/1.3268503
Regular Articles
Improvement of Ohmic contacts to using Mo refractory metal and surface preparation for 6.3 Å heterojunction bipolar transistors
J. Vac. Sci. Technol. B 28, 17–20 (2010)
https://doi.org/10.1116/1.3268134
Integration, gap formation, and sharpening of III-V heterostructure nanowires by selective etching
Christian Kallesøe; Kristian Mølhave; Kasper F. Larsen; Daniel Engstrøm; Torben M. Hansen; Peter Bøggild; Thomas Mårtensson; Magnus Borgström; Lars Samuelson
J. Vac. Sci. Technol. B 28, 21–26 (2010)
https://doi.org/10.1116/1.3268135
Effect of neutron irradiation on electrical and optical properties of InGaN/GaN light-emitting diodes
J. Vac. Sci. Technol. B 28, 27–29 (2010)
https://doi.org/10.1116/1.3268136
Step-width adjustment in fabrication of staircase structures
J. Vac. Sci. Technol. B 28, 30–35 (2010)
https://doi.org/10.1116/1.3269794
Fully automated hot embossing processes utilizing high resolution working stamps
T. Glinsner; T. Veres; G. Kreindl; E. Roy; K. Morton; T. Wieser; C. Thanner; D. Treiblmayr; R. Miller; P. Lindner
J. Vac. Sci. Technol. B 28, 36–41 (2010)
https://doi.org/10.1116/1.3269800
Graphoepitaxy of block copolymers using selectively removable templates
J. Vac. Sci. Technol. B 28, 42–44 (2010)
https://doi.org/10.1116/1.3271259
Effect of process related and haze defects on immersion lithography
J. Vac. Sci. Technol. B 28, 45–51 (2010)
https://doi.org/10.1116/1.3271332
Passivation of high electron mobility transistor using ozone treatment
C. F. Lo; C. Y. Chang; S. J. Pearton; I. I. Kravchenko; A. M. Dabiran; A. M. Wowchak; B. Cui; P. P. Chow; F. Ren
J. Vac. Sci. Technol. B 28, 52–55 (2010)
https://doi.org/10.1116/1.3271333
Advanced in situ pre-Ni silicide (Siconi) cleaning at to resolve defects in modules
J. Vac. Sci. Technol. B 28, 56–61 (2010)
https://doi.org/10.1116/1.3271334
Metastable structure and magnetism of Cr-doped AlN in AlN/TiN multilayers
J. Vac. Sci. Technol. B 28, 62–65 (2010)
https://doi.org/10.1116/1.3271335
Analysis and metrology with a focused helium ion beam
J. Vac. Sci. Technol. B 28, 73–77 (2010)
https://doi.org/10.1116/1.3271254
Direct thermal-UV nanoimprint of an iron-containing organometallic hybrid film
J. Vac. Sci. Technol. B 28, 78–81 (2010)
https://doi.org/10.1116/1.3271337
Sub- gap electrodes by soft UV nanoimprint lithography using polydimethylsiloxane mold without external pressure
J. Vac. Sci. Technol. B 28, 82–85 (2010)
https://doi.org/10.1116/1.3273535
Making high-fidelity imprint template by resist patterns over a flexible conductive polymer substrate
J. Vac. Sci. Technol. B 28, 86–89 (2010)
https://doi.org/10.1116/1.3273601
Spin-coatable resist for optical and electron beam lithographies
M. S. M. Saifullah; M. Z. R. Khan; David G. Hasko; Eunice S. P. Leong; Xue L. Neo; Eunice T. L. Goh; David Anderson; Geraint A. C. Jones; Mark E. Welland
J. Vac. Sci. Technol. B 28, 90–95 (2010)
https://doi.org/10.1116/1.3273536
active-matrix Spindt-type field emitter array image sensor with high-gain avalanche rushing amorphous photoconductor target
M. Nanba; Y. Takiguchi; Y. Honda; Y. Hirano; T. Watabe; N. Egami; K. Miya; K. Nakamura; M. Taniguchi; S. Itoh; A. Kobayashi
J. Vac. Sci. Technol. B 28, 96–103 (2010)
https://doi.org/10.1116/1.3272732
Roller-reversal imprint process for preparation of large-area microstructures
J. Vac. Sci. Technol. B 28, 104–109 (2010)
https://doi.org/10.1116/1.3272717
Microstructures and magnetic properties of amorphous films deposited by facing target magnetron-sputtering system with divergent magnetic field
J. Vac. Sci. Technol. B 28, 110–115 (2010)
https://doi.org/10.1116/1.3275959
Improvement in bias stability of amorphous- thin film transistors with passivation layers
J. Vac. Sci. Technol. B 28, 116–119 (2010)
https://doi.org/10.1116/1.3276774
Four beams surface plasmon interference nanoscale lithography for patterning of two-dimensional periodic features
J. Vac. Sci. Technol. B 28, 128–130 (2010)
https://doi.org/10.1116/1.3276702
Ultrahigh selective etching of films over films for silicon nitride gate spacer etching
J. Vac. Sci. Technol. B 28, 131–137 (2010)
https://doi.org/10.1116/1.3290752
Room-temperature capillary-imprint lithography for making micro-/nanostructures in large areas
J. Vac. Sci. Technol. B 28, 138–142 (2010)
https://doi.org/10.1116/1.3290753
Parameter study for silicon grass formation in Bosch process
J. Vac. Sci. Technol. B 28, 143–148 (2010)
https://doi.org/10.1116/1.3280131
Patterning of porous SiOCH using an organic mask: Comparison with a metallic masking strategy
M. Darnon; T. Chevolleau; T. David; J. Ducote; N. Posseme; R. Bouyssou; F. Bailly; D. Perret; O. Joubert
J. Vac. Sci. Technol. B 28, 149–156 (2010)
https://doi.org/10.1116/1.3276703
micropillar fabrication for small mode volume photon sources
J. Vac. Sci. Technol. B 28, 157–162 (2010)
https://doi.org/10.1116/1.3280163
Characterization and analysis of silicon on insulator fabricated by separation by implanted oxygen layer transfer
Xing Wei; Aimin Wu; Xiang Wang; Xianyuan Li; Fei Ye; Jie Chen; Meng Chen; Bo Zhang; Chenglu Li; Miao Zhang; Xi Wang
J. Vac. Sci. Technol. B 28, 163–168 (2010)
https://doi.org/10.1116/1.3290750
Stenciled conducting bismuth nanowires
J. Vac. Sci. Technol. B 28, 169–172 (2010)
https://doi.org/10.1116/1.3292630
Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low- films modified in downstream plasma
J. Vac. Sci. Technol. B 28, 173–179 (2010)
https://doi.org/10.1116/1.3293200
Surface topography and physicochemistry of silver containing titanium nitride nanocomposite coatings
J. Vac. Sci. Technol. B 28, 180–187 (2010)
https://doi.org/10.1116/1.3293232
Effects of silver deposition on light-driven zinc oxide photocatalyst
Shigeyuki Seki; Takumi Sekizawa; Koichi Haga; Tomoaki Sato; Mitsuhiro Takeda; Yoshiyuki Seki; Yutaka Sawada; Kunio Yubuta; Toetsu Shishido
J. Vac. Sci. Technol. B 28, 188–193 (2010)
https://doi.org/10.1116/1.3268133
Fabrication of large area ultrathin silicon membrane: Application for high efficiency extreme ultraviolet diffraction gratings
J. Vac. Sci. Technol. B 28, 194–197 (2010)
https://doi.org/10.1116/1.3290746
Magnetic soft x-ray imaging of vortex core dynamics
J. Vac. Sci. Technol. B 28, 198–201 (2010)
https://doi.org/10.1116/1.3275939
Scratch properties of nickel thin films using atomic force microscopy
J. Vac. Sci. Technol. B 28, 202–210 (2010)
https://doi.org/10.1116/1.3292944
Indium oxide thin film transistors fabricated by low-energetic ion bombardment technique at room temperature
J. Vac. Sci. Technol. B 28, 211–215 (2010)
https://doi.org/10.1116/1.3280130
Errata
International Workshop on Insight in Semiconductor Device Fabrication, Metrology, and Modeling (INSIGHT 2009)
Plenary Session
Simulation of junctions: Present and future challenges for technologies beyond 32 nm
J. Vac. Sci. Technol. B 28, C1A1–C1A6 (2010)
https://doi.org/10.1116/1.3231481
Advanced Anneals and Implant Technology
Deactivation of submelt laser annealed arsenic ultrashallow junctions in silicon during subsequent thermal treatment
Damiano Giubertoni; Giancarlo Pepponi; Mehmet Alper Sahiner; Stephen P. Kelty; Salvatore Gennaro; Massimo Bersani; Max Kah; Karen J. Kirkby; Roisin Doherty; Majeed A. Foad; F. Meirer; C. Streli; Joseph C. Woicik; Piero Pianetta
J. Vac. Sci. Technol. B 28, C1B1–C1B5 (2010)
https://doi.org/10.1116/1.3242637
1-D Metrology
Nondestructive extraction of junction depths of active doping profiles from photomodulated optical reflectance offset curves
Janusz Bogdanowicz; Fabian Dortu; Trudo Clarysse; Wilfried Vandervorst; Erik Rosseel; Ngoc Duy Nguyen; Derrick Shaughnessy; Alex Salnik; Lena Nicolaides
J. Vac. Sci. Technol. B 28, C1C1–C1C7 (2010)
https://doi.org/10.1116/1.3269737
Photoreflectance characterization of ultrashallow junction activation in millisecond annealing
J. Vac. Sci. Technol. B 28, C1C15–C1C20 (2010)
https://doi.org/10.1116/1.3253327
Study of submelt laser induced junction nonuniformities using Therma-Probe
Erik Rosseel; Janusz Bogdanowicz; Trudo Clarysse; Wilfried Vandervorst; Claude Ortolland; Thomas Hoffmann; Alex Salnik; Lena Nicolaides; Sang-Hyun Han; Dirch H. Petersen; Rong Lin; Ole Hansen
J. Vac. Sci. Technol. B 28, C1C21–C1C26 (2010)
https://doi.org/10.1116/1.3237150
Review of electrical characterization of ultra-shallow junctions with micro four-point probes
Dirch H. Petersen; Ole Hansen; Torben M. Hansen; Peter Bøggild; Rong Lin; Daniel Kjær; Peter F. Nielsen; Trudo Clarysse; Wilfried Vandervorst; Erik Rosseel; Nick S. Bennett; Nick E. B. Cowern
J. Vac. Sci. Technol. B 28, C1C27–C1C33 (2010)
https://doi.org/10.1116/1.3224898
Sensitivity study of micro four-point probe measurements on small samples
J. Vac. Sci. Technol. B 28, C1C34–C1C40 (2010)
https://doi.org/10.1116/1.3224889
Electrical characterization of InGaAs ultra-shallow junctions
Dirch H. Petersen; Ole Hansen; Peter Bøggild; Rong Lin; Peter F. Nielsen; Dennis Lin; Christoph Adelmann; Alireza Alian; Clement Merckling; Julien Penaud; Guy Brammertz; Jozefien Goossens; Wilfried Vandervorst; Trudo Clarysse
J. Vac. Sci. Technol. B 28, C1C41–C1C47 (2010)
https://doi.org/10.1116/1.3231492
Advanced secondary ion mass spectroscopy quantification in the first few nanometer of B, P, and As ultrashallow implants
J. Vac. Sci. Technol. B 28, C1C48–C1C53 (2010)
https://doi.org/10.1116/1.3225588
Shallow As dose measurements of patterned wafers with secondary ion mass spectrometry and low energy electron induced x-ray emission spectroscopy
H.-U. Ehrke; N. Loibl; M. P. Moret; F. Horréard; J. Choi; C. Hombourger; V. Paret; R. Benbalagh; N. Morel; M. Schuhmacher
J. Vac. Sci. Technol. B 28, C1C54–C1C58 (2010)
https://doi.org/10.1116/1.3253352
Grazing incidence x-ray fluorescence and secondary ion mass spectrometry combined approach for the characterization of ultrashallow arsenic distribution in silicon
G. Pepponi; D. Giubertoni; M. Bersani; F. Meirer; D. Ingerle; G. Steinhauser; C. Streli; P. Hoenicke; B. Beckhoff
J. Vac. Sci. Technol. B 28, C1C59–C1C64 (2010)
https://doi.org/10.1116/1.3292647
High resolution medium energy ion scattering analysis for the quantitative depth profiling of ultrathin high- layers
M. A. Reading; J. A. van den Berg; P. C. Zalm; D. G. Armour; P. Bailey; T. C. Q. Noakes; A. Parisini; T. Conard; S. De Gendt
J. Vac. Sci. Technol. B 28, C1C65–C1C70 (2010)
https://doi.org/10.1116/1.3248264
Application of the Storing Matter technique to the analysis of semiconductor materials
J. Vac. Sci. Technol. B 28, C1C71–C1C76 (2010)
https://doi.org/10.1116/1.3271256
Comparative study of native oxide impacts on low energy doping processes
J. Vac. Sci. Technol. B 28, C1C77–C1C83 (2010)
https://doi.org/10.1116/1.3184522
Photovoltage versus microprobe sheet resistance measurements on ultrashallow structures
Trudo Clarysse; Alain Moussa; Brigitte Parmentier; Janusz Bogdanowicz; Wilfried Vandervorst; Hugo Bender; Markus Pfeffer; Martin Schellenberger; Peter F. Nielsen; Sune Thorsteinsson; Rong Lin; Dirch Petersen
J. Vac. Sci. Technol. B 28, C1C8–C1C14 (2010)
https://doi.org/10.1116/1.3292637
Ultralow energy boron implants in silicon characterization by nonoxidizing secondary ion mass spectrometry analysis and soft x-ray grazing incidence x-ray fluorescence techniques
Damiano Giubertoni; Erica Iacob; P. Hoenicke; B. Beckhoff; Giancarlo Pepponi; Salvatore Gennaro; Massimo Bersani
J. Vac. Sci. Technol. B 28, C1C84–C1C89 (2010)
https://doi.org/10.1116/1.3292638
2D Metrology
Quantitative dopant profiling of junction in light-emitting diode using off-axis electron holography
J. Vac. Sci. Technol. B 28, C1D11–C1D14 (2010)
https://doi.org/10.1116/1.3244575
Electron holography for analysis of deep submicron devices: Present status and challenges
Nobuyuki Ikarashi; Akio Toda; Kazuya Uejima; Koichi Yako; Toyoji Yamamoto; Masami Hane; Hiroshi Sato
J. Vac. Sci. Technol. B 28, C1D5–C1D10 (2010)
https://doi.org/10.1116/1.3207964
3D Metrology with Atom Probe
Dopant measurements in semiconductors with atom probe tomography
J. Vac. Sci. Technol. B 28, C1E1–C1E4 (2010)
https://doi.org/10.1116/1.3242422
Defects, Dopant Diffusion and Deactivation
Effect of - and -type dopants on patterned amorphous regrowth
J. Vac. Sci. Technol. B 28, C1F1–C1F5 (2010)
https://doi.org/10.1116/1.3207953
Modeling and Simulation
Fluorine clustering and diffusion in silicon: Ab initio calculations and kinetic Monte Carlo model
J. Vac. Sci. Technol. B 28, C1G1–C1G6 (2010)
https://doi.org/10.1116/1.3253328
Detailed simulation study of embedded SiGe and Si:C source/drain stressors in nanoscaled silicon on insulator metal oxide semiconductor field effect transistors
Stefan Flachowsky; Ralf Illgen; Tom Herrmann; Wilfried Klix; Roland Stenzel; Ina Ostermay; Andreas Naumann; Andy Wei; Jan Höntschel; Manfred Horstmann
J. Vac. Sci. Technol. B 28, C1G12–C1G17 (2010)
https://doi.org/10.1116/1.3258631
Kinetic lattice Monte Carlo simulations of interdiffusion in strained silicon germanium alloys
J. Vac. Sci. Technol. B 28, C1G18–C1G23 (2010)
https://doi.org/10.1116/1.3294704
Simulation of asymmetric doped high performance silicon on insulator metal oxide semiconductor field effect transistors for very large scale integrated complementary metal oxide semiconductor technologies
Tom Herrmann; Stefan Flachowsky; Ralf Illgen; Wilfried Klix; Roland Stenzel; Jan Höntschel; Thomas Feudel; Manfred Horstmann
J. Vac. Sci. Technol. B 28, C1G7–C1G11 (2010)
https://doi.org/10.1116/1.3292643
Metrology, Simulation and Integration of Non-Planar Devices
Exploring doping options and variability of trigate transistors using atomistic process and device simulations
J. Vac. Sci. Technol. B 28, C1H1–C1H4 (2010)
https://doi.org/10.1116/1.3248263
Experimental studies of dose retention and activation in fin field-effect-transistor-based structures
Jay Mody; Ray Duffy; Pierre Eyben; Jozefien Goossens; Alain Moussa; Wouter Polspoel; Bart Berghmans; M. J. H. van Dal; B. J. Pawlak; M. Kaiser; R. G. R. Weemaes; Wilfried Vandervorst
J. Vac. Sci. Technol. B 28, C1H5–C1H13 (2010)
https://doi.org/10.1116/1.3269755
Silicides and Source/Drain Engineering
Interaction of NiSi with dopants for metallic source/drain applications
J. Vac. Sci. Technol. B 28, C1I1–C1I11 (2010)
https://doi.org/10.1116/1.3248267
Effect of source/drain-extension dopant species on device performance of embedded SiGe strained -metal oxide semiconductor field effect transistors using millisecond annealing
Ralf Illgen; Stefan Flachowsky; Tom Herrmann; Wilfried Klix; Roland Stenzel; Thomas Feudel; Jan Höntschel; Manfred Horstmann
J. Vac. Sci. Technol. B 28, C1I12–C1I16 (2010)
https://doi.org/10.1116/1.3244578
Preface
Letters
Chloride ion detection by InN gated high electron mobility transistors
Byung-Hwan Chu; Hon-Way Lin; Shangjr Gwo; Yu-Lin Wang; S. J. Pearton; J. W. Johnson; P. Rajagopal; J. C. Roberts; E. L. Piner; K. J. Linthicuni; Fan Ren
J. Vac. Sci. Technol. B 28, L5–L8 (2010)
https://doi.org/10.1116/1.3271253
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Self-aligned fabrication of vertical, fin-based structures
Joshua Perozek, Tomás Palacios