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January 2009
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
ISSN 1071-1023
EISSN 1520-8567
Regular Articles
Thick membrane operated rf microelectromechanical system switch with low actuation voltage
J. Vac. Sci. Technol. B 27, 1–5 (2009)
https://doi.org/10.1116/1.3032916
Deprotection blur in extreme ultraviolet photoresists: Influence of base loading and post-exposure bake temperature
J. Vac. Sci. Technol. B 27, 6–10 (2009)
https://doi.org/10.1116/1.3032901
Thermal infrared detection using dipole antenna-coupled metal-oxide-metal diodes
J. Vac. Sci. Technol. B 27, 11–14 (2009)
https://doi.org/10.1116/1.3039684
Development of a vacuum packaged nanodiamond lateral field emission device
J. Vac. Sci. Technol. B 27, 15–18 (2009)
https://doi.org/10.1116/1.3039686
Duplication of nanoimprint templates by a novel SU-8//PMMA trilayer technique
J. Vac. Sci. Technol. B 27, 19–22 (2009)
https://doi.org/10.1116/1.3039687
A silicon-germanium W-structure photodiode for near-infrared detection
J. Vac. Sci. Technol. B 27, 23–27 (2009)
https://doi.org/10.1116/1.3039688
Dependence of etch rates of silicon substrates on the use of and plasmas in the deposition step of the Bosch process
J. Vac. Sci. Technol. B 27, 33–40 (2009)
https://doi.org/10.1116/1.3039690
Field-emission properties of carbon nanotubes grown using Cu–Cr catalysts
Zhejuan Zhang; Daniel H. C. Chua; Yang Gao; Yanping Zhang; Zhe Tang; Beng Kang Tay; Tao Feng; Zhuo Sun; Yiwei Chen
J. Vac. Sci. Technol. B 27, 41–46 (2009)
https://doi.org/10.1116/1.3039691
Detailed characterization of hydrogen silsesquioxane for e-beam applications in a dynamic random access memory pilot line environment
J. Vac. Sci. Technol. B 27, 47–51 (2009)
https://doi.org/10.1116/1.3039692
Some peculiarities of resist-profile simulation for positive-tone chemically amplified resists in electron-beam lithography
J. Vac. Sci. Technol. B 27, 52–57 (2009)
https://doi.org/10.1116/1.3043467
Absorber stack with transparent conductive oxide layer for extreme ultraviolet lithography
J. Vac. Sci. Technol. B 27, 58–60 (2009)
https://doi.org/10.1116/1.3043471
Fabrication of nanoscale bioarrays for the study of cytoskeletal protein binding interactions using nanoimprint lithography
J. Vac. Sci. Technol. B 27, 61–65 (2009)
https://doi.org/10.1116/1.3043472
Latest results from the SEMATECH Berkeley extreme ultraviolet microfield exposure tool
Patrick P. Naulleau; Christopher N. Anderson; Jerrin Chiu; Kim Dean; Paul Denham; Simi George; Kenneth A. Goldberg; Brian Hoef; Gideon Jones; Chawon Koh; Bruno La Fontaine; Andy Ma; Warren Montgomery; Dimitra Niakoula; Joo-on Park; Tom Wallow; Stefan Wurm
J. Vac. Sci. Technol. B 27, 66–70 (2009)
https://doi.org/10.1116/1.3043473
Study of interface degradation of Hf-silicate gate dielectrics during thermal nitridation process
J. Vac. Sci. Technol. B 27, 71–75 (2009)
https://doi.org/10.1116/1.3043536
Self-assembly solder process to form three-dimensional structures on silicon
J. Vac. Sci. Technol. B 27, 76–80 (2009)
https://doi.org/10.1116/1.3043538
superlattice films deposited on atomic-scale flattened sapphire substrates for dilute magnetic semiconductor applications
J. Vac. Sci. Technol. B 27, 81–84 (2009)
https://doi.org/10.1116/1.3049480
Forbidden pitch improvement using modified illumination in lithography
J. Vac. Sci. Technol. B 27, 85–91 (2009)
https://doi.org/10.1116/1.3054286
Plasma-surface interactions of advanced photoresists with discharges: Plasma parameter dependencies
S. Engelmann; R. L. Bruce; M. Sumiya; T. Kwon; R. Phaneuf; G. S. Oehrlein; C. Andes; D. Graves; D. Nest; E. A. Hudson
J. Vac. Sci. Technol. B 27, 92–106 (2009)
https://doi.org/10.1116/1.3054342
Band bending and adsorption/desorption kinetics on N-polar GaN surfaces
J. Vac. Sci. Technol. B 27, 107–112 (2009)
https://doi.org/10.1116/1.3054345
Plasma reactor dry cleaning strategy after TaC, MoN, WSi, W, and WN etching processes
J. Vac. Sci. Technol. B 27, 113–121 (2009)
https://doi.org/10.1116/1.3058710
Transformation of polycrystalline tungsten to monocrystalline tungsten W(100) and its potential application in Schottky emitters
J. Vac. Sci. Technol. B 27, 122–125 (2009)
https://doi.org/10.1116/1.3058713
Interface dependent electrical properties of amorphous thin film transistors
J. Vac. Sci. Technol. B 27, 126–129 (2009)
https://doi.org/10.1116/1.3058717
Five-element circuit model using linear-regression method to correct the admittance measurement of metal-oxide-semiconductor capacitor
Chao-Ching Cheng; Chao-Hsin Chien; Guang-Li Luo; Jun-Cheng Liu; Yi-Cheng Chen; Yao-Feng Chang; Shin-Yuan Wang; Chi-Chung Kei; Chien-Nan Hsiao; Chun-Yen Chang
J. Vac. Sci. Technol. B 27, 130–133 (2009)
https://doi.org/10.1116/1.3058724
Metal nanowire fabrication by force microscopy lithography using amorphous arsenic sulfide resist layer
J. Vac. Sci. Technol. B 27, 134–138 (2009)
https://doi.org/10.1116/1.3058722
Synthesis, structural and magnetic properties of epitaxial thin films by molecular beam epitaxy
J. Vac. Sci. Technol. B 27, 148–151 (2009)
https://doi.org/10.1116/1.3054339
REBL: A novel approach to high speed maskless electron beam direct write lithography
Paul Petric; Chris Bevis; Allen Carroll; Henry Percy; Marek Zywno; Keith Standiford; Alan Brodie; Noah Bareket; Luca Grella
J. Vac. Sci. Technol. B 27, 161–166 (2009)
https://doi.org/10.1116/1.3054281
Computational and experimental studies of phase separation in mixtures
J. Vac. Sci. Technol. B 27, 169–179 (2009)
https://doi.org/10.1116/1.3072516
Stable tungsten disilicide contacts for surface and thin film resistivity measurements
J. Vac. Sci. Technol. B 27, 180–183 (2009)
https://doi.org/10.1116/1.3071851
DNA directed assembly of nanoparticle linear structure for nanophotonics
J. Vac. Sci. Technol. B 27, 184–187 (2009)
https://doi.org/10.1116/1.3072515
Two-step resist-development process of hydrogen silsesquioxane for high-density electron-beam nanopatterning
J. Vac. Sci. Technol. B 27, 188–192 (2009)
https://doi.org/10.1116/1.3049482
Brief Reports and Comments
Errata
Erratum: “Thermal conductivity of B–C–N and BN nanotubes” [J. Vac. Sci. Technol. B 23, 1883 (2005)]
J. Vac. Sci. Technol. B 27, 199 (2009)
https://doi.org/10.1116/1.3058746
PAPERS FROM THE 15TH WORKSHOP ON DIELECTRICS IN MICROELECTRONICS
Alternative high- dielectrics for semiconductor applications
S. Van Elshocht; C. Adelmann; S. Clima; G. Pourtois; T. Conard; A. Delabie; A. Franquet; P. Lehnen; J. Meersschaut; N. Menou; M. Popovici; O. Richard; T. Schram; X. P. Wang; A. Hardy; D. Dewulf; M. K. Van Bael; P. Lehnen; T. Blomberg; D. Pierreux; J. Swerts; J. W. Maes; D. J. Wouters; S. De Gendt; J. A. Kittl
J. Vac. Sci. Technol. B 27, 209–213 (2009)
https://doi.org/10.1116/1.3025855
metal-oxide-semiconductor high electron mobility transistor with insulating films grown by metal organic chemical vapor deposition using Ar and carrier gases
K. Čičo; J. Kuzmík; J. Liday; K. Hušeková; G. Pozzovivo; J.-F. Carlin; N. Grandjean; D. Pogany; P. Vogrinčič; K. Fröhlich
J. Vac. Sci. Technol. B 27, 218–222 (2009)
https://doi.org/10.1116/1.3021034
Ammonia-free deposition of silicon nitride films using pulsed-plasma chemical vapor deposition under near atmospheric pressure
J. Vac. Sci. Technol. B 27, 223–225 (2009)
https://doi.org/10.1116/1.3021039
Behavior of zirconium oxide films processed from novel monocyclopentadienyl precursors by atomic layer deposition
J. Vac. Sci. Technol. B 27, 226–229 (2009)
https://doi.org/10.1116/1.3071844
Effect of annealing and electrical properties of high- thin films grown by atomic layer deposition using carboxylic acids as oxygen source
J. Vac. Sci. Technol. B 27, 230–235 (2009)
https://doi.org/10.1116/1.3058743
Study of metal oxide-semiconductor capacitors with rf magnetron sputtering and gate dielectric layer
J. Vac. Sci. Technol. B 27, 236–245 (2009)
https://doi.org/10.1116/1.3043537
Metal-oxide-semiconductor devices on -type Ge with and as gate dielectric and the effect of postmetallization anneal
J. Vac. Sci. Technol. B 27, 246–248 (2009)
https://doi.org/10.1116/1.3043533
Gd silicate: A high- dielectric compatible with high temperature annealing
H. D. B. Gottlob; A. Stefani; M. Schmidt; M. C. Lemme; H. Kurz; I. Z. Mitrovic; M. Werner; W. M. Davey; S. Hall; P. R. Chalker; K. Cherkaoui; P. K. Hurley; J. Piscator; O. Engström; S. B. Newcomb
J. Vac. Sci. Technol. B 27, 249–252 (2009)
https://doi.org/10.1116/1.3025904
Optimization of the AlON buffer layer for stacks
J. Vac. Sci. Technol. B 27, 253–257 (2009)
https://doi.org/10.1116/1.3025905
Complementary metal oxide semiconductor integration of epitaxial
M. C. Lemme; H. D. B. Gottlob; T. J. Echtermeyer; M. Schmidt; H. Kurz; R. Endres; U. Schwalke; M. Czernohorkky; D. Tetzlaff; H. J. Osten
J. Vac. Sci. Technol. B 27, 258–261 (2009)
https://doi.org/10.1116/1.3054350
Structure dependence of epitaxial on oxygen pressure during growth
J. Vac. Sci. Technol. B 27, 262–265 (2009)
https://doi.org/10.1116/1.3021028
Epitaxial growth of high- rutile films on electrodes
J. Vac. Sci. Technol. B 27, 266–270 (2009)
https://doi.org/10.1116/1.3021030
On the band gaps and electronic structure of thin single crystalline praseodymium oxide layers on Si(111)
J. Vac. Sci. Technol. B 27, 271–276 (2009)
https://doi.org/10.1116/1.3021047
Influence of the electrode material on metal-insulator-metal capacitors
J. Vac. Sci. Technol. B 27, 286–289 (2009)
https://doi.org/10.1116/1.3071843
Effective work function engineering by lanthanide ion implantation of metal-oxide semiconductor gate stacks
J. Vac. Sci. Technol. B 27, 290–293 (2009)
https://doi.org/10.1116/1.3021043
interface formation in atomic layer deposition films: An in situ investigation
J. Vac. Sci. Technol. B 27, 300–304 (2009)
https://doi.org/10.1116/1.3021023
Structure and defects of epitaxial Si(111) layers on support systems
J. Vac. Sci. Technol. B 27, 305–309 (2009)
https://doi.org/10.1116/1.3043540
Identification of interfacial defects in high- gate stack films by spectroscopic ellipsometry
J. Vac. Sci. Technol. B 27, 310–312 (2009)
https://doi.org/10.1116/1.3021045
Electron paramagnetic resonance characterization of defects in and powders and films
J. Vac. Sci. Technol. B 27, 317–320 (2009)
https://doi.org/10.1116/1.3025882
Trap related dielectric absorption of HfSiO films in metal-insulator-semiconductor structures
J. Vac. Sci. Technol. B 27, 321–324 (2009)
https://doi.org/10.1116/1.3043532
Hafnium oxide thin films: Effect of growth parameters on oxygen and hafnium vacancies
J. Vac. Sci. Technol. B 27, 325–328 (2009)
https://doi.org/10.1116/1.3043474
Spatial distribution of electrically active defects in dual-layer gate dielectric -type metal oxide semiconductor field effect transistors
J. Vac. Sci. Technol. B 27, 329–332 (2009)
https://doi.org/10.1116/1.3025824
Frequency dispersion and dielectric relaxation of
J. Vac. Sci. Technol. B 27, 333–337 (2009)
https://doi.org/10.1116/1.3043535
Analytical modeling of tunneling current through stacks in metal oxide semiconductor structures
J. Vac. Sci. Technol. B 27, 338–345 (2009)
https://doi.org/10.1116/1.3043539
Leakage current effects on plots of high- metal-oxide-semiconductor capacitors
Y. Lu; S. Hall; L. Z. Tan; I. Z. Mitrovic; W. M. Davey; B. Raeissi; O. Engström; K. Cherkaoui; S. Monaghan; P. K. Hurley; H. D. B. Gottlob; M. C. Lemme
J. Vac. Sci. Technol. B 27, 352–355 (2009)
https://doi.org/10.1116/1.3025910
Comparison of standard macroscopic and conductive atomic force microscopy leakage measurements on gate removed high- capacitors
J. Vac. Sci. Technol. B 27, 356–359 (2009)
https://doi.org/10.1116/1.3071845
Correlation of microscopic and macroscopic electrical characteristics of high- thin films using tunneling atomic force microscopy
W. Weinreich; L. Wilde; P. Kücher; M. Lemberger; V. Yanev; M. Rommel; A. J. Bauer; E. Erben; J. Heitmann; U. Schröder; L. Oberbeck
J. Vac. Sci. Technol. B 27, 364–368 (2009)
https://doi.org/10.1116/1.3058725
Electrical characteristics of metal-ferroelectric -insulator -semiconductor capacitors and field-effect transistors
J. Vac. Sci. Technol. B 27, 369–372 (2009)
https://doi.org/10.1116/1.3058727
Electrical properties of amorphous barium titanate films sputter deposited under hydrogen containing atmosphere
J. Vac. Sci. Technol. B 27, 373–377 (2009)
https://doi.org/10.1116/1.3025902
Physicochemical and electrical characterizations of atomic layer deposition grown on TiN and Pt for metal-insulator-metal application
J. Vac. Sci. Technol. B 27, 378–383 (2009)
https://doi.org/10.1116/1.3021036
Impact of a barrier on metal-oxide-semiconductor capacitor electrical properties
L. Becerra; C. Merckling; M. El-Kazzi; N. Baboux; B. Vilquin; G. Saint-Girons; C. Plossu; G. Hollinger
J. Vac. Sci. Technol. B 27, 384–388 (2009)
https://doi.org/10.1116/1.3065437
Different mechanism to explain the noise in - and -SOI-MOS transistors fabricated on (110) and (100) silicon-oriented wafers
J. Vac. Sci. Technol. B 27, 394–401 (2009)
https://doi.org/10.1116/1.3054280
Low frequency noise analysis in gate oxide fully depleted silicon on insulator transistors
J. Vac. Sci. Technol. B 27, 402–405 (2009)
https://doi.org/10.1116/1.3072518
Radiation damage on dielectrics: Single event effects
J. Vac. Sci. Technol. B 27, 406–410 (2009)
https://doi.org/10.1116/1.3054271
High- materials and their response to gamma ray radiation
J. Vac. Sci. Technol. B 27, 411–415 (2009)
https://doi.org/10.1116/1.3071848
Irradiation effect on dielectric properties of hafnium and gadolinium oxide gate dielectrics
J. Vac. Sci. Technol. B 27, 416–420 (2009)
https://doi.org/10.1116/1.3021040
Implanted and irradiated structure electrical properties at the nanoscale
J. Vac. Sci. Technol. B 27, 421–425 (2009)
https://doi.org/10.1116/1.3043475
Stress-induced leakage current and random telegraph signal
Akinobu Teramoto; Yuki Kumagai; Kenichi Abe; Takafumi Fujisawa; Shunichi Watabe; Tomoyuki Suwa; Naoto Miyamoto; Shigetoshi Sugawa; Tadahiro Ohmi
J. Vac. Sci. Technol. B 27, 435–438 (2009)
https://doi.org/10.1116/1.3054269
Breakdown and degradation of ultrathin Hf-based gate oxide films
J. Vac. Sci. Technol. B 27, 443–447 (2009)
https://doi.org/10.1116/1.3025822
Impact of progressive oxide soft breakdown on metal oxide semiconductor parameters: Experiment and modeling
J. Vac. Sci. Technol. B 27, 448–452 (2009)
https://doi.org/10.1116/1.3065414
Progressive degradation of and gate stack triple gate SOI nFinFETs subjected to electrical stress
J. Vac. Sci. Technol. B 27, 453–458 (2009)
https://doi.org/10.1116/1.3025883
Investigation of Bias-Temperature Instability in work-function-tuned high-/metal-gate stacks
J. Vac. Sci. Technol. B 27, 459–462 (2009)
https://doi.org/10.1116/1.3054352
Impact of nitridation on recoverable and permanent negative bias temperature instability degradation in high-/metal-gate -type metal oxide semiconductor field effect transistors
M. Aoulaiche; B. Kaczer; Ph. J. Roussel; R. O’Connor; M. Houssa; S. De Gendt; H. E. Maes; G. Groeseneken
J. Vac. Sci. Technol. B 27, 463–467 (2009)
https://doi.org/10.1116/1.3058740
Hot carrier degradation in fin shaped field effect transistor with different substrate orientations
Chadwin D. Young; Ji-Woon Yang; Kenneth Matthews; Sagar Suthram; Muhammad Mustafa Hussain; Gennadi Bersuker; Casey Smith; Rusty Harris; Rino Choi; Byoung Hun Lee; Hsing-Huang Tseng
J. Vac. Sci. Technol. B 27, 468–471 (2009)
https://doi.org/10.1116/1.3072919
interfacial layer as the origin of the breakdown of high- dielectrics stacks
J. Vac. Sci. Technol. B 27, 472–475 (2009)
https://doi.org/10.1116/1.3077185
stack with enhanced reliability
M. Lisiansky; A. Fenigstein; A. Heiman; Y. Raskin; Y. Roizin; L. Bartholomew; J. Owyang; A. Gladkikh; R. Brener; I. Geppert; E. Lyakin; B. Meyler; Y. Shnieder; S. Yofis; M. Eizenberg
J. Vac. Sci. Technol. B 27, 476–481 (2009)
https://doi.org/10.1116/1.3025821
Suppression of parasitic electron injection in silicon-oxide-nitride-oxide-silicon-type memory cells using high- capping layers
J. Vac. Sci. Technol. B 27, 482–485 (2009)
https://doi.org/10.1116/1.3021020
Contact etch stop layer: A key factor for single polysilicon flash memory data retention
J. Vac. Sci. Technol. B 27, 486–489 (2009)
https://doi.org/10.1116/1.3071846
On the impact of silicon nitride technology on charge trap NAND memories
A. Sebastiani; C. Scozzari; A. Mauri; A. Modelli; G. Albini; R. Piagge; P. Bacciaglia; A. Del Vitto; M. Alessandri; A. Grossi; P. Tessariol; G. Ghidini
J. Vac. Sci. Technol. B 27, 490–493 (2009)
https://doi.org/10.1116/1.3025836
Application of plasma enhanced chemical vapor deposition silicon oxynitride layers in nonvolatile semiconductor memory devices
J. Vac. Sci. Technol. B 27, 494–497 (2009)
https://doi.org/10.1116/1.3054353
Interface states formation in a localized charge trapping nonvolatile memory device
J. Vac. Sci. Technol. B 27, 508–511 (2009)
https://doi.org/10.1116/1.3025891
Peculiar characteristics of nanocrystal memory cells programming window
J. Vac. Sci. Technol. B 27, 512–516 (2009)
https://doi.org/10.1116/1.3025854
Low- dielectrics for trench isolation in nanoscaled complementary metal oxide semiconductor imagers
J. Vac. Sci. Technol. B 27, 517–520 (2009)
https://doi.org/10.1116/1.3074346
Improved characterization of Fourier transform infrared spectra analysis for post-etched ultra-low- SiOCH dielectric using chemometric methods
Thomas Oszinda; Volkhard Beyer; Matthias Schaller; Daniel Fischer; Christin Bartsch; Stefan E. Schulz
J. Vac. Sci. Technol. B 27, 521–526 (2009)
https://doi.org/10.1116/1.3043466
Study on the characteristics of toluene-tetraethoxysilane hybrid plasma-polymer thin films
J. Vac. Sci. Technol. B 27, 527–530 (2009)
https://doi.org/10.1116/1.3025820
Photoluminescence from high-pressure-annealed silicon dioxide
J. Vac. Sci. Technol. B 27, 531–534 (2009)
https://doi.org/10.1116/1.3025838
Light emission and photoluminescence from high- dielectrics containing Ge nanocrystals
J. Vac. Sci. Technol. B 27, 535–537 (2009)
https://doi.org/10.1116/1.3025844
Gas sensing materials based on thin films
J. Vac. Sci. Technol. B 27, 538–541 (2009)
https://doi.org/10.1116/1.3021050
Mechanical properties of anodic aluminum oxide for microelectromechanical system applications
J. Vac. Sci. Technol. B 27, 542–546 (2009)
https://doi.org/10.1116/1.3025906
Initial oxidation of Si(110) as studied by real-time synchrotron-radiation x-ray photomission spectroscopy
J. Vac. Sci. Technol. B 27, 547–550 (2009)
https://doi.org/10.1116/1.3021032
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Exploring SiC CVD growth parameters compatible with remote epitaxy
Daniel J. Pennachio, Jenifer R. Hajzus, et al.