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September 2005
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
ISSN 1071-1023
EISSN 1520-8567
Regular Articles
Protein binding on thermally grown silicon dioxide
Stephen C. Lee; Matthew T. Keener; Dharma R. Tokachichu; Bharat Bhushan; Phillip D. Barnes; Benjamin R. Cipriany; Min Gao; Leonard J. Brillson
J. Vac. Sci. Technol. B 23, 1856–1865 (2005)
https://doi.org/10.1116/1.2006127
Silicon carbide based dielectric composites in bilayer sidewall barrier for Cu∕porous ultralow- interconnects
J. Vac. Sci. Technol. B 23, 1866–1872 (2005)
https://doi.org/10.1116/1.2006129
Formation of vertical ridge structure in laser diodes for high power single mode operation
Soohaeng Cho; Sangbum Lee; Joonseok Kang; Byungjin Ma; Changyun Lee; Youngchul Shin; Bumjoon Kim; Donghoon Kang; Youngmin Kim; Yongjo Park
J. Vac. Sci. Technol. B 23, 1873–1876 (2005)
https://doi.org/10.1116/1.2006133
As-doped polysilicon emitters with interfacial oxides and correlation to bipolar device characteristics
J. Vac. Sci. Technol. B 23, 1877–1882 (2005)
https://doi.org/10.1116/1.2006134
Fabrication of identical sub-100 nm closely spaced parallel lines using electron beam lithography
J. Vac. Sci. Technol. B 23, 1887–1890 (2005)
https://doi.org/10.1116/1.2008267
Pt-coated InN nanorods for selective detection of hydrogen at room temperature
J. Vac. Sci. Technol. B 23, 1891–1894 (2005)
https://doi.org/10.1116/1.2008268
Electron beam lithography with negative Calixarene resists on dense materials: Taking advantage of proximity effects to increase pattern density
J. Vac. Sci. Technol. B 23, 1895–1900 (2005)
https://doi.org/10.1116/1.2008269
Effect of film thickness on the ferroelectric properties of thin films for nano-data storage applications
J. Vac. Sci. Technol. B 23, 1901–1904 (2005)
https://doi.org/10.1116/1.2008270
Epitaxial growth of on (001)Si inside nanoscale contact holes prepared by atomic force microscope tip-induced local oxidation of the thin layer
J. Vac. Sci. Technol. B 23, 1905–1908 (2005)
https://doi.org/10.1116/1.2000967
Temperature dependence of carrier dynamics for quantum dot infrared photodetectors
Chun-Yuan Huang; Tzu-Min Ou; Shu-Ting Chou; Cheng-Shuan Tsai; Meng-Chyi Wu; Shih-Yen Lin; Jim-Yong Chi
J. Vac. Sci. Technol. B 23, 1909–1912 (2005)
https://doi.org/10.1116/1.2008271
Towards a controlled patterning of 10 nm silicon gates in high density plasmas
J. Vac. Sci. Technol. B 23, 1913–1923 (2005)
https://doi.org/10.1116/1.2008272
Silver coplanar waveguides as the passive components of choice for microwave integrated circuits
J. Vac. Sci. Technol. B 23, 1924–1928 (2005)
https://doi.org/10.1116/1.2013311
Tunable all epitaxial semimetal-semiconductor Schottky diode system: ErAs on InAlGaAs
J. Vac. Sci. Technol. B 23, 1929–1935 (2005)
https://doi.org/10.1116/1.2013312
Investigations on the mechanism of silicon etching with chlorine-trifluoride
Arnim Höchst; Frank Fischer; Gunter Kirbach; Andrea Urban; Volker Becker; Mathias Irmscher; Holger Sailer; Dieter P. Kern
J. Vac. Sci. Technol. B 23, 1936–1942 (2005)
https://doi.org/10.1116/1.2013313
Study of hydrogen-sensing characteristics of a Pt-oxide-AlGaAs metal-oxide-semiconductor high electron mobility transistor
Chin-Chuan Cheng; Yan-Ying Tsai; Kun-Wei Lin; Huey-Ing Chen; Wei-Hsi Hsu; Ching-Wen Hong; Han-Lien Lin; Wen-Chau Liu
J. Vac. Sci. Technol. B 23, 1943–1947 (2005)
https://doi.org/10.1116/1.2013314
Field-emission characteristics of boron–carbon–nitride nanofilm
J. Vac. Sci. Technol. B 23, 1948–1951 (2005)
https://doi.org/10.1116/1.2006130
Study of diffusion and quality control for formation by oxide-mediated cobalt silicidation with Ti capping
J. Vac. Sci. Technol. B 23, 1952–1955 (2005)
https://doi.org/10.1116/1.2006132
Influence of the growth temperature on the atomic distribution of TEOS deposited films
J. Vac. Sci. Technol. B 23, 1956–1963 (2005)
https://doi.org/10.1116/1.2038047
Spindt tip composed of carbon nanotubes
Jong Hyun Moon; Sung Hoon Lim; Hyun Sik Yoon; Kyu Chang Park; Simon Kang; Craig Bae; Jung Jae Kim; Jin Jang
J. Vac. Sci. Technol. B 23, 1964–1969 (2005)
https://doi.org/10.1116/1.2037628
Electrical and optical characteristics of hydrogen-plasma treated ZnO nanoneedles
J. Vac. Sci. Technol. B 23, 1970–1974 (2005)
https://doi.org/10.1116/1.2037667
Density of electron-beam-induced amorphous carbon deposits
J. Vac. Sci. Technol. B 23, 1975–1979 (2005)
https://doi.org/10.1116/1.2037687
Surface-enhanced Raman spectroscopy of nanodiamond particles on silver
J. Vac. Sci. Technol. B 23, 1980–1983 (2005)
https://doi.org/10.1116/1.2041650
Chemically assisted ion beam etching of by argon and chlorine gases: Experimental and simulation investigations
A. Rhallabi; M. Gaillard; L. Elmonser; G. Marcos; Anne Talneau; F. Pommereau; Ph. Pagnod-Rossiaux; J. P. Landesman; N. Bouadma
J. Vac. Sci. Technol. B 23, 1984–1991 (2005)
https://doi.org/10.1116/1.2041653
Microelectromechanical device for lateral force calibration in the atomic force microscope: Lateral electrical nanobalance
J. Vac. Sci. Technol. B 23, 1992–1997 (2005)
https://doi.org/10.1116/1.2044809
Synthesis, characterization, and investigation of a conformationally immobile calix[6]arene as a negative electron beam resist
Gabriel H. Monreal; Sara J. Staggs; Michael T. Blanda; Wilhelmus J. Geerts; Heather C. Galloway; Gregory F. Spencer
J. Vac. Sci. Technol. B 23, 1998–2002 (2005)
https://doi.org/10.1116/1.2038027
In situ chemical sensing in metal organic chemical vapor deposition process for precision film thickness metrology and real-time advanced process control
Soon Cho; Daniel S. Janiak; Gary W. Rubloff; Michael E. Aumer; Darren B. Thomson; Deborah P. Partlow
J. Vac. Sci. Technol. B 23, 2007–2013 (2005)
https://doi.org/10.1116/1.2037707
Impurity redistribution due to recrystallization of preamorphized silicon
R. Duffy; V. C. Venezia; K. van der Tak; M. J. P. Hopstaken; G. C. J. Maas; F. Roozeboom; Y. Tamminga; T. Dao
J. Vac. Sci. Technol. B 23, 2021–2029 (2005)
https://doi.org/10.1116/1.2044813
Determination of Mg composition in alloy: Validity of Vegard’s law
J. Vac. Sci. Technol. B 23, 2030–2033 (2005)
https://doi.org/10.1116/1.2050653
Thermal stability of trimethylsilylated mesoporous silica thin films as the ultralow- dielectric for copper interconnects
J. Vac. Sci. Technol. B 23, 2034–2040 (2005)
https://doi.org/10.1116/1.2050656
Effect of mask thickness on the nanoscale sidewall roughness and optical scattering losses of deep-etched high mesa waveguides
J. Vac. Sci. Technol. B 23, 2041–2045 (2005)
https://doi.org/10.1116/1.2050659
Reactive ion etching of a 20 nanometers tungsten gate using a chemistry and hydrogen silsesquioxane hard mask resist
J. Vac. Sci. Technol. B 23, 2046–2050 (2005)
https://doi.org/10.1116/1.2050654
Nanopatterning of polyfluorene derivative using electron-beam lithography
Yusuke Doi; Akinori Saeki; Yoshiko Koizumi; Shu Seki; Kazumasa Okamoto; Takahiro Kozawa; Seiichi Tagawa
J. Vac. Sci. Technol. B 23, 2051–2055 (2005)
https://doi.org/10.1116/1.2050655
pixel magnetic focus field emitter array image sensor with high-gain avalanche rushing amorphous photoconductor target
N. Egami; M. Nanba; Y. Takiguchi; K. Miyakawa; T. Watabe; S. Okazaki; K. Osada; Y. Obara; M. Tanaka; S. Itoh
J. Vac. Sci. Technol. B 23, 2056–2062 (2005)
https://doi.org/10.1116/1.2050658
Highly anisotropic gate electrode patterning in neutral beam etching using gas chemistry
J. Vac. Sci. Technol. B 23, 2063–2068 (2005)
https://doi.org/10.1116/1.2050660
Effects of ambient gases on the direct growth of nanowires by a simple heating method
J. Vac. Sci. Technol. B 23, 2069–2072 (2005)
https://doi.org/10.1116/1.2050667
Profile evolution of masked features undergoing -inductively coupled plasma etching for use in silicon nanoimprint templates
J. Vac. Sci. Technol. B 23, 2073–2077 (2005)
https://doi.org/10.1116/1.2050669
Prevention of Cu degradation using in situ plasma treatment in a dual-damascene process
Shingo Tomohisa; Kazunori Yoshikawa; Kazumasa Yonekura; Shigenori Sakamori; Nobuo Fujiwara; Kazunori Tsujimoto; Kyusaku Nishioka; Hiroshi Kobayashi; Tatsuo Oomori
J. Vac. Sci. Technol. B 23, 2084–2088 (2005)
https://doi.org/10.1116/1.2050671
Effect of solid electrolyte films on electrochemical properties of thin film cathodes with different rapid-thermal annealing conditions
J. Vac. Sci. Technol. B 23, 2089–2094 (2005)
https://doi.org/10.1116/1.2052711
Conformability and optical reflectance of film sputtered on the Si vertical sidewalls
J. Vac. Sci. Technol. B 23, 2095–2101 (2005)
https://doi.org/10.1116/1.2052712
Simultaneous elastic and electromechanical imaging by scanning probe microscopy: Theory and applications to ferroelectric and biological materials
J. Shin; B. J. Rodriguez; A. P. Baddorf; T. Thundat; E. Karapetian; M. Kachanov; A. Gruverman; S. V. Kalinin
J. Vac. Sci. Technol. B 23, 2102–2108 (2005)
https://doi.org/10.1116/1.2052714
Effects of substrate temperature on the growth of InGaAs compositionally graded buffers and on quantum well structures grown above them
J. Vac. Sci. Technol. B 23, 2109–2113 (2005)
https://doi.org/10.1116/1.2052727
Physical properties of nanostructures grown by oblique angle deposition
J. Vac. Sci. Technol. B 23, 2114–2121 (2005)
https://doi.org/10.1116/1.2052747
Presence of nanosize Au dots on the formation of ohmic contact for the Ni–Au base film to -GaN
J. Vac. Sci. Technol. B 23, 2127–2131 (2005)
https://doi.org/10.1116/1.2041651
Time dependence of wet oxidized distributed Bragg reflectors
J. Vac. Sci. Technol. B 23, 2137–2140 (2005)
https://doi.org/10.1116/1.2050657
Synthesis and characterization of one-dimensional nanorods
J. Vac. Sci. Technol. B 23, 2141–2145 (2005)
https://doi.org/10.1116/1.2050668
Influence of thermal budget on phosphosilicate glass prepared by high-density plasma chemical-vapor deposition
J. Vac. Sci. Technol. B 23, 2146–2150 (2005)
https://doi.org/10.1116/1.2050670
Influence of process variables on electron beam chemical vapor deposition of platinum
J. Vac. Sci. Technol. B 23, 2151–2159 (2005)
https://doi.org/10.1116/1.2050672
Fundamental study of the removal mechanisms of nano-sized particles using brush scrubber cleaning
K. Xu; R. Vos; G. Vereecke; G. Doumen; W. Fyen; P. W. Mertens; M. M. Heyns; C. Vinckier; J. Fransaer; F. Kovacs
J. Vac. Sci. Technol. B 23, 2160–2175 (2005)
https://doi.org/10.1116/1.2052713
Errata
Papers from the 6th AVS International Conference on Microelectronics and Interfaces
Fabrication and characterization of semiconductor circular ring lasers
J. Vac. Sci. Technol. B 23, 2180–2183 (2005)
https://doi.org/10.1116/1.2009772
Three-dimensional thin-film-transistor silicon-oxide-nitride-oxide-silicon memory cell formed on large grain sized polysilicon films using nuclei induced solid phase crystallization
S. Gu; S. V. Dunton; A. J. Walker; S. Nallamothu; E. H. Chen; M. Mahajani; S. B. Herner; V. L. Eckert; S. Hu; M. Konevecki; C. Petti; S. Radigan; U. Raghuram; M. A. Vyvoda
J. Vac. Sci. Technol. B 23, 2184–2188 (2005)
https://doi.org/10.1116/1.2055327
Modified three terminal charge pumping technique applied to vertical transistor structures
L. J. Passmore; K. Sarpatwari; S. A. Suliman; O. O. Awadelkarim; R. Ridley; G. Dolny; J. Michalowicz; C. -T. Wu
J. Vac. Sci. Technol. B 23, 2189–2193 (2005)
https://doi.org/10.1116/1.2040449
Influence of oxide hard mask on profiles of sub-100 nm Si and SiGe gates
Denis Shamiryan; Vasile Paraschiv; Sabrina Locorotondo; Stephan Beckx; Werner Boullart; Serge Vanhaelemeersch
J. Vac. Sci. Technol. B 23, 2194–2197 (2005)
https://doi.org/10.1116/1.2019386
Minimizing plasma damage and in situ sealing of ultralow- dielectric films by using oxygen free fluorocarbon plasmas
J. Vac. Sci. Technol. B 23, 2198–2202 (2005)
https://doi.org/10.1116/1.1961910
Modeling of radial uniformity at a wafer interface in a 2f-CCP for etching
J. Vac. Sci. Technol. B 23, 2212–2217 (2005)
https://doi.org/10.1116/1.2040447
Modeling of the influence of dielectric target on interface sheath characteristics in a radio-frequency magnetron sputtering
J. Vac. Sci. Technol. B 23, 2218–2221 (2005)
https://doi.org/10.1116/1.2009771
Reduction of the initial defect density and improvement of the reliability of Cu/low- structures by a methylating treatment
J. Vac. Sci. Technol. B 23, 2222–2225 (2005)
https://doi.org/10.1116/1.1953708
Control of sidewall slope in silicon vias using plasma etching in a conventional reactive ion etching tool
J. Vac. Sci. Technol. B 23, 2226–2231 (2005)
https://doi.org/10.1116/1.2041654
Pressure dependent Parylene-N pore sealant penetration in porous low- dielectrics
J. Vac. Sci. Technol. B 23, 2232–2235 (2005)
https://doi.org/10.1116/1.2040427
Removal of chemical–mechanical polishing-induced damage layer in single crystal by inductively coupled plasma etching
J. Vac. Sci. Technol. B 23, 2236–2239 (2005)
https://doi.org/10.1116/1.1938971
Silicon interface trap characterization with elastic metal gate metrology
J. Vac. Sci. Technol. B 23, 2240–2243 (2005)
https://doi.org/10.1116/1.2009769
X-ray reflectometry and x-ray fluorescence monitoring of the atomic layer deposition process for high- gate dielectrics
P. Y. Hung; Carolyn Gondran; Amiya Ghatak-Roy; Shinichi Terada; Ben Bunday; Henry Yeung; Alain Diebold
J. Vac. Sci. Technol. B 23, 2244–2248 (2005)
https://doi.org/10.1116/1.2009774
Simultaneous optical measurement of Ge content and carbon doping in strained epitaxial SiGe films
J. Vac. Sci. Technol. B 23, 2249–2253 (2005)
https://doi.org/10.1116/1.2009775
Letters
-T-shaped--gate high electron mobility transistors
Yoshimi Yamashita; Akira Endoh; Keiji Ikeda; Kohki Hikosaka; Takashi Mimura; Masataka Higashiwaki; Toshiaki Matsui; Satoshi Hiyamizu
J. Vac. Sci. Technol. B 23, L13–L15 (2005)
https://doi.org/10.1116/1.2013315
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Science challenges and research opportunities for plasma applications in microelectronics
David B. Graves, Catherine B. Labelle, et al.
Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications
A. S. Stodolna, T. W. Mechielsen, et al.