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May 2002
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
ISSN 1071-1023
EISSN 1520-8567
REGULAR ARTICLES
Morphological evolution and surface and interface structure of aluminum on polyimide
Xue-Feng Lin; David A. Grove; Lun-Cun Wei; Greg S. Strossman; Glenn Lefever-Button; Jeffrey R. Kingsley
J. Vac. Sci. Technol. B 20, 766–775 (2002)
https://doi.org/10.1116/1.1467658
Effect of polishing pretreatment on the fabrication of ordered nanopore arrays on aluminum foils by anodization
J. Vac. Sci. Technol. B 20, 776–782 (2002)
https://doi.org/10.1116/1.1467657
Scanning capacitance microscopy measurements using diamond-coated probes
J. Vac. Sci. Technol. B 20, 783–786 (2002)
https://doi.org/10.1116/1.1467660
Field electron emission device using silicon nanoprotrusions
J. Vac. Sci. Technol. B 20, 787–790 (2002)
https://doi.org/10.1116/1.1467661
Importance of fluorine surface diffusion for plasma etching of silicon
J. Vac. Sci. Technol. B 20, 791–796 (2002)
https://doi.org/10.1116/1.1469015
Advanced transfer system for spin coating film transfer and hot-pressing in planarization technology
J. Vac. Sci. Technol. B 20, 797–801 (2002)
https://doi.org/10.1116/1.1469014
Carbon nanotube films grown by laser-assisted chemical vapor deposition
J. Vac. Sci. Technol. B 20, 802–811 (2002)
https://doi.org/10.1116/1.1469013
Spatially selective single-grain silicon films induced by hydrogen plasma seeding
J. Vac. Sci. Technol. B 20, 818–821 (2002)
https://doi.org/10.1116/1.1469016
Characterization of methyl-doped silicon oxide film deposited using Flowfill™ chemical vapor deposition technology
J. Vac. Sci. Technol. B 20, 828–833 (2002)
https://doi.org/10.1116/1.1470510
Comparative study on alloy cluster formation in Co-Al and Co-Pt systems
J. Vac. Sci. Technol. B 20, 834–842 (2002)
https://doi.org/10.1116/1.1470518
Selective etching of Al/AlN structures for metallization of surface acoustic wave devices
J. Vac. Sci. Technol. B 20, 843–848 (2002)
https://doi.org/10.1116/1.1470511
Electron-beam double resist process to enhance bright field pattern resolution
J. Vac. Sci. Technol. B 20, 849–854 (2002)
https://doi.org/10.1116/1.1470517
Simulation and dielectric characterization of reactive dc magnetron cosputtered thin films
J. Vac. Sci. Technol. B 20, 855–861 (2002)
https://doi.org/10.1116/1.1470508
Silicon nanowires with sub 10 nm lateral dimensions: From atomic force microscope lithography based fabrication to electrical measurements
J. Vac. Sci. Technol. B 20, 862–870 (2002)
https://doi.org/10.1116/1.1470519
Thin-film resistor fabrication for InP technology applications
R. F. Kopf; R. Melendes; D. C. Jacobson; A. Tate; M. A. Melendes; R. R. Reyes; R. A. Hamm; Y. Yang; J. Frackoviak; N. G. Weimann; H. L. Maynard; C. T. Liu
J. Vac. Sci. Technol. B 20, 871–875 (2002)
https://doi.org/10.1116/1.1473179
Protection of structures during lateral oxidation using an amorphous InGaP layer
J. Vac. Sci. Technol. B 20, 876–879 (2002)
https://doi.org/10.1116/1.1473182
Thermal stability of multilayer structures improved by cavity formation
J. Vac. Sci. Technol. B 20, 880–884 (2002)
https://doi.org/10.1116/1.1475681
Inverse electronic scattering from shifted projections within the Fresnel-Kirchhoff formalism
J. Vac. Sci. Technol. B 20, 885–890 (2002)
https://doi.org/10.1116/1.1473180
Development of a data-driven dynamic model for a plasma etching reactor
J. Vac. Sci. Technol. B 20, 891–901 (2002)
https://doi.org/10.1116/1.1475986
Deep etch of GaP using high-density plasma for light-emitting diode applications
J. Vac. Sci. Technol. B 20, 902–908 (2002)
https://doi.org/10.1116/1.1475983
Highly cross-linked polysilane as antireflective coating for deep ultraviolet lithography to improve durability during etching
Yasuhiko Sato; Eishi Shiobara; Yasunobu Onishi; Sawako Yoshikawa; Yoshihiko Nakano; Shuzi Hayase; Yoshitaka Hamada
J. Vac. Sci. Technol. B 20, 909–913 (2002)
https://doi.org/10.1116/1.1475987
Ion-graphy implanter with stencil mask
T. Nishihashi; K. Kashimoto; J. Fujiyama; Y. Sakurada; T. Shibata; K. Suguro; K. Sugihara; K. Okumura; T. Gotou; S. Saji; M. Tsunoda
J. Vac. Sci. Technol. B 20, 914–917 (2002)
https://doi.org/10.1116/1.1475982
Influence of resist components on image blur in a patterned positive-tone chemically amplified photoresist
J. Vac. Sci. Technol. B 20, 924–931 (2002)
https://doi.org/10.1116/1.1475985
Fabrication of micrometer and nanometer scale structures in silica sol-gel films using electron beam writing methods
J. Vac. Sci. Technol. B 20, 932–935 (2002)
https://doi.org/10.1116/1.1476095
Ion implantation effects on the structure and nanomechanical properties of vapor deposited cubic boron nitride films
J. Vac. Sci. Technol. B 20, 936–939 (2002)
https://doi.org/10.1116/1.1475988
Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion ability
J. Vac. Sci. Technol. B 20, 940–945 (2002)
https://doi.org/10.1116/1.1477422
Molecular dynamics simulation of sputter trench-filling morphology in damascene process
J. Vac. Sci. Technol. B 20, 946–955 (2002)
https://doi.org/10.1116/1.1477423
Patterning pentacene organic thin film transistors
J. Vac. Sci. Technol. B 20, 956–959 (2002)
https://doi.org/10.1116/1.1477427
Controlled tuning of periodic morphologies on vicinal surfaces
J. Vac. Sci. Technol. B 20, 960–963 (2002)
https://doi.org/10.1116/1.1477426
Photoluminescence characteristics of GaInNAs quantum wells annealed at high temperature
J. Vac. Sci. Technol. B 20, 964–968 (2002)
https://doi.org/10.1116/1.1477425
Room temperature magnetism in produced by both ion implantation and molecular-beam epitaxy
M. E. Overberg; B. P. Gila; G. T. Thaler; C. R. Abernathy; S. J. Pearton; N. A. Theodoropoulou; K. T. McCarthy; S. B. Arnason; A. F. Hebard; S. N. G. Chu; R. G. Wilson; J. M. Zavada; Y. D. Park
J. Vac. Sci. Technol. B 20, 969–973 (2002)
https://doi.org/10.1116/1.1477424
Characterization by medium energy ion scattering of damage and dopant profiles produced by ultrashallow B and As implants into Si at different temperatures
J. A. Van den Berg; D. G. Armour; S. Zhang; S. Whelan; H. Ohno; T.-S. Wang; A. G. Cullis; E. H. J. Collart; R. D. Goldberg; P. Bailey; T. C. Q. Noakes
J. Vac. Sci. Technol. B 20, 974–983 (2002)
https://doi.org/10.1116/1.1477420
Specular ion current measurements as a quantitative, real-time probe of GaAs(001) epitaxial growth
J. Vac. Sci. Technol. B 20, 984–991 (2002)
https://doi.org/10.1116/1.1477421
Cluster-ion implantation: An approach to fabricate ultrashallow junctions in silicon
Xinming Lu; Lin Shao; Xuemei Wang; Jiarui Liu; Wei-Kan Chu; Joe Bennett; Larry Larson; Peiching Ling
J. Vac. Sci. Technol. B 20, 992–994 (2002)
https://doi.org/10.1116/1.1479361
Nanophase films deposited from a high-rate, nanoparticle beam
J. Vac. Sci. Technol. B 20, 995–999 (2002)
https://doi.org/10.1116/1.1481749
Effects of the polymer residues on via contact resistance after reactive ion etching
J. Vac. Sci. Technol. B 20, 1000–1007 (2002)
https://doi.org/10.1116/1.1479364
1.3 μm InAsP multiquantum well laser diodes with the n-type modulation-doped InAsP/InP/InGaP active region
J. Vac. Sci. Technol. B 20, 1013–1018 (2002)
https://doi.org/10.1116/1.1481750
Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits
J. Vac. Sci. Technol. B 20, 1019–1025 (2002)
https://doi.org/10.1116/1.1479362
Modeling and simulation of atomic layer deposition at the feature scale
J. Vac. Sci. Technol. B 20, 1031–1043 (2002)
https://doi.org/10.1116/1.1481754
Reduced pressure chemical vapor deposition of and heterostructures
J. Vac. Sci. Technol. B 20, 1048–1054 (2002)
https://doi.org/10.1116/1.1481755
Etching of polysilicon in inductively coupled and HBr discharges. I. Experimental characterization of polysilicon profiles
J. Vac. Sci. Technol. B 20, 1055–1063 (2002)
https://doi.org/10.1116/1.1481866
Etching of polysilicon in inductively coupled and HBr discharges. III. Photoresist mask faceting, sidewall deposition, and microtrenching
J. Vac. Sci. Technol. B 20, 1077–1083 (2002)
https://doi.org/10.1116/1.1481868
Etching of polysilicon in inductively coupled and HBr discharges. IV. Calculation of feature charging in profile evolution
J. Vac. Sci. Technol. B 20, 1084–1095 (2002)
https://doi.org/10.1116/1.1481869
Study of InGaP/GaAs/InGaAs high-barrier gate and heterostructure-channel field-effect transistors
J. Vac. Sci. Technol. B 20, 1096–1101 (2002)
https://doi.org/10.1116/1.1481862
Growth and evolution of ZnCdSe quantum dots
C. X. Shan; X. W. Fan; J. Y. Zhang; Z. Z. Zhang; B. S. Li; Y. M. Lu; Y. C. Liu; D. Z. Shen; X. G. Kong; X. H. Wang
J. Vac. Sci. Technol. B 20, 1102–1106 (2002)
https://doi.org/10.1116/1.1481870
Selective wet etching of AlGaAs in solutions: Application to vertical taper structures in integrated optoelectronic devices
J. Vac. Sci. Technol. B 20, 1107–1110 (2002)
https://doi.org/10.1116/1.1481861
Effects of the underlayer substrates on copper chemical vapor deposition
J. Vac. Sci. Technol. B 20, 1111–1117 (2002)
https://doi.org/10.1116/1.1481863
Sub-50 nm nanopatterning of metallic layers by green pulsed laser combined with atomic force microscopy
J. Vac. Sci. Technol. B 20, 1118–1125 (2002)
https://doi.org/10.1116/1.1481865
Electron trapping in noncrystalline remote plasma deposited Hf-aluminate alloys for gate dielectric applications
J. Vac. Sci. Technol. B 20, 1126–1131 (2002)
https://doi.org/10.1116/1.1481872
BRIEF REPORTS AND COMMENTS
Evidence of storing and erasing of electrons in a nanocrystalline-Si based memory device at 77 K
J. Vac. Sci. Technol. B 20, 1135–1138 (2002)
https://doi.org/10.1116/1.1481871
RAPID COMMUNICATIONS
Investigation of polymethylmethacrylate resist residues using photoelectron microscopy
J. Vac. Sci. Technol. B 20, 1139–1142 (2002)
https://doi.org/10.1116/1.1470509
Ultrathin nitrided-nanolaminate for metal–oxide–semiconductor gate dielectric applications
J. Vac. Sci. Technol. B 20, 1143–1145 (2002)
https://doi.org/10.1116/1.1481864
PAPERS FROM THE 20TH NORTH AMERICAN CONFERENCE ON MOLECULAR BEAM EPITAXY
DILUTE NITRIDES
Optical characterization of strained InGaAsN/GaAs multiple quantum wells
J. Vac. Sci. Technol. B 20, 1154–1157 (2002)
https://doi.org/10.1116/1.1481752
Molecular beam epitaxy growth of GaAsN layers with high luminescence efficiency
A. R. Kovsh; J. S. Wang; L. Wei; R. S. Shiao; J. Y. Chi; B. V. Volovik; A. F. Tsatsul’nikov; V. M. Ustinov
J. Vac. Sci. Technol. B 20, 1158–1162 (2002)
https://doi.org/10.1116/1.1473176
Growth and characterization of quantum wells with barriers by plasma-assisted molecular beam epitaxy
J. Vac. Sci. Technol. B 20, 1167–1169 (2002)
https://doi.org/10.1116/1.1477202
Substrate preparation and low-temperature boron doped silicon growth on wafer-scale charge-coupled devices by molecular beam epitaxy
J. Vac. Sci. Technol. B 20, 1170–1173 (2002)
https://doi.org/10.1116/1.1477200
ANTIMONIDES
Structural and transport characterization of AlSb/InAs quantum-well structures grown by molecular-beam epitaxy with two growth interruptions
J. Vac. Sci. Technol. B 20, 1174–1177 (2002)
https://doi.org/10.1116/1.1468658
Atomistics of III–V semiconductor surfaces: Role of group V pressure
J. Vac. Sci. Technol. B 20, 1178–1181 (2002)
https://doi.org/10.1116/1.1461371
NANOSTRUCTURES
Low-bias, high-temperature performance of a normal-incidence InAs/GaAs vertical quantum-dot infrared photodetector with a current-blocking barrier
J. Vac. Sci. Technol. B 20, 1185–1187 (2002)
https://doi.org/10.1116/1.1461370
Tailoring mid- and long-wavelength dual response of InAs quantum-dot infrared photodetectors using capping layers
J. Vac. Sci. Technol. B 20, 1188–1191 (2002)
https://doi.org/10.1116/1.1463695
Trench-type InGaAs quantum-wire field effect transistor with negative differential conductance fabricated by hydrogen-assisted molecular beam epitaxy
J. Vac. Sci. Technol. B 20, 1192–1195 (2002)
https://doi.org/10.1116/1.1456519
METAMORPHIC AND COMPLIANT GROWTH
High quality GaAs grown on Si-on-insulator compliant substrates
J. Vac. Sci. Technol. B 20, 1196–1199 (2002)
https://doi.org/10.1116/1.1481753
Molecular-beam epitaxy production of large-diameter metamorphic high electron mobility transistor and heterojunction bipolar transistor wafers
O. Baklenov; D. Lubyshev; Y. Wu; X.-M. Fang; J. M. Fastenau; L. Leung; F. J. Towner; A. B. Cornfeld; W. K. Liu
J. Vac. Sci. Technol. B 20, 1200–1204 (2002)
https://doi.org/10.1116/1.1481751
Interfacial roughness and carrier scattering due to misfit dislocations in structures
M. Naidenkova; M. S. Goorsky; R. Sandhu; R. Hsing; M. Wojtowicz; T. P. Chin; T. R. Block; D. C. Streit
J. Vac. Sci. Technol. B 20, 1205–1208 (2002)
https://doi.org/10.1116/1.1477201
High-frequency metamorphic photodiodes and high-electron mobility transistor transimpedance amplifiers: Candidates for fiber-optic communications
J. Vac. Sci. Technol. B 20, 1209–1212 (2002)
https://doi.org/10.1116/1.1470516
InAs-based bipolar transistors grown by molecular beam epitaxy
J. Vac. Sci. Technol. B 20, 1213–1216 (2002)
https://doi.org/10.1116/1.1459461
WIDEGAP NITRIDES
Investigation of Si doping and impurity incorporation dependence on the polarity of GaN by molecular beam epitaxy
J. Vac. Sci. Technol. B 20, 1217–1220 (2002)
https://doi.org/10.1116/1.1463723
Role of low-temperature (200 °C) nitridation in the growth of GaN by plasma-assisted molecular-beam epitaxy
J. Vac. Sci. Technol. B 20, 1221–1228 (2002)
https://doi.org/10.1116/1.1470514
GROWTH AND CHARACTERIZATION
High reflectivity and crack-free AlGaN/AlN ultraviolet distributed Bragg reflectors
J. Vac. Sci. Technol. B 20, 1229–1233 (2002)
https://doi.org/10.1116/1.1482070
Surface and interface characterization of GaN/AlGaN high electron mobility transistor structures by x-ray and atomic force microscopy
J. Vac. Sci. Technol. B 20, 1234–1237 (2002)
https://doi.org/10.1116/1.1481874
Photoreflectance spectroscopy of AlGaAs/GaAs heterostructures with a two-dimensional electron gas system
V. H. Méndez-Garcı́a; L. Zamora; A. Lastras-Martinez; N. Saucedo; R. Peña; A. Guillén; Z. Rivera; M. Meléndez; M. López; F. Hernández; J. Huerta
J. Vac. Sci. Technol. B 20, 1238–1242 (2002)
https://doi.org/10.1116/1.1459460
Intraband and interband photocurrent spectroscopy and induced dipole moments of InAs/GaAs(001) quantum dots in photodetector structures
J. Vac. Sci. Technol. B 20, 1243–1246 (2002)
https://doi.org/10.1116/1.1463721
Dislocation structure and relaxation kinetics in InGaAs/GaAs heteroepitaxy
J. Vac. Sci. Technol. B 20, 1247–1250 (2002)
https://doi.org/10.1116/1.1463722
Kinetics of the heteroepitaxial growth of Ge on Si(001)
J. Vac. Sci. Technol. B 20, 1251–1258 (2002)
https://doi.org/10.1116/1.1473177
Vertical ordering in multilayers of self-assembled Ge/Si(001) quantum dots
J. Vac. Sci. Technol. B 20, 1259–1265 (2002)
https://doi.org/10.1116/1.1456522
Growth and characterization of ferromagnetic epilayers on (001) ZnSe
J. Vac. Sci. Technol. B 20, 1266–1269 (2002)
https://doi.org/10.1116/1.1456523
High characteristic temperature K) of stacked InGaAs quantum wire lasers grown on (775)B GaAs substrates by molecular beam epitaxy
J. Vac. Sci. Technol. B 20, 1270–1273 (2002)
https://doi.org/10.1116/1.1456520
NOVEL MATERIALS/II-VI
Single-crystal GaN/Gd2O3/GaN heterostructure
M. Hong; J. Kwo; S. N. G. Chu; J. P. Mannaerts; A. R. Kortan; H. M. Ng; A. Y. Cho; K. A. Anselm; C. M. Lee; J. I. Chyi
J. Vac. Sci. Technol. B 20, 1274–1277 (2002)
https://doi.org/10.1116/1.1473178
Molecular-beam epitaxy growth and properties of alloys for optoelectronic devices
J. Vac. Sci. Technol. B 20, 1278–1281 (2002)
https://doi.org/10.1116/1.1470515
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Heating of photocathode via field emission and radiofrequency pulsed heating: Implication toward breakdown
Ryo Shinohara, Soumendu Bagchi, et al.