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Issues
January 2002
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
ISSN 1071-1023
EISSN 1520-8567
REGULAR ARTICLES
Barrier height enhancement in the Schottky diodes with anodization process
J. Vac. Sci. Technol. B 20, 10–13 (2002)
https://doi.org/10.1116/1.1426369
Power spectral densities: A multiple technique study of different Si wafer surfaces
J. Vac. Sci. Technol. B 20, 31–41 (2002)
https://doi.org/10.1116/1.1428267
Characterization of self-assembled alkanethiol monolayers using a low-current scanning tunneling microscope
J. Vac. Sci. Technol. B 20, 60–64 (2002)
https://doi.org/10.1116/1.1428266
I–V characteristics of thin-film gated photocathodes for electron-beam lithography
J. Vac. Sci. Technol. B 20, 65–70 (2002)
https://doi.org/10.1116/1.1428271
Stencil reticle cleaning using an Ar aerosol cleaning technique
J. Vac. Sci. Technol. B 20, 71–75 (2002)
https://doi.org/10.1116/1.1428270
Potential distribution and field intensity for a hyperboloidal probe in a uniform field
J. Vac. Sci. Technol. B 20, 76–80 (2002)
https://doi.org/10.1116/1.1428268
Practical approach for modeling extreme ultraviolet lithography mask defects
J. Vac. Sci. Technol. B 20, 81–86 (2002)
https://doi.org/10.1116/1.1428269
Ion beam proximity lithography on spherical substrates with continuously scanned, self-complementary masks
J. Vac. Sci. Technol. B 20, 87–89 (2002)
https://doi.org/10.1116/1.1428273
Improvement in partitioning method for electron beam lithography simulation
J. Vac. Sci. Technol. B 20, 90–94 (2002)
https://doi.org/10.1116/1.1428272
Nondestructive via in-hole profile characterization using atomic force microscopy metrology
J. Vac. Sci. Technol. B 20, 95–99 (2002)
https://doi.org/10.1116/1.1428280
Simulations of field emission from a semiconducting (10,0) carbon nanotube
J. Vac. Sci. Technol. B 20, 100–104 (2002)
https://doi.org/10.1116/1.1428275
Investigation of macroscopic uniformity during reactive ion etching of InP and its improvement by use of a guard ring
J. Vac. Sci. Technol. B 20, 105–108 (2002)
https://doi.org/10.1116/1.1428276
Properties of porous HSQ-based films capped by plasma enhanced chemical vapor deposition dielectric layers
J. Vac. Sci. Technol. B 20, 109–115 (2002)
https://doi.org/10.1116/1.1428274
Characterization of plasma-enhanced chemical vapor deposition carbon nanotubes by Auger electron spectroscopy
K. B. K. Teo; M. Chhowalla; G. A. J. Amaratunga; W. I. Milne; G. Pirio; P. Legagneux; F. Wyczisk; J. Olivier; D. Pribat
J. Vac. Sci. Technol. B 20, 116–121 (2002)
https://doi.org/10.1116/1.1428281
Field electron emission from carbon nanotubes grown by plasma-enhanced chemical vapor deposition
J. Vac. Sci. Technol. B 20, 122–127 (2002)
https://doi.org/10.1116/1.1430239
Deuterium and fluorine radical reaction kinetics on photoresist
J. Vac. Sci. Technol. B 20, 145–153 (2002)
https://doi.org/10.1116/1.1430242
In situ trench etching and releasing technique of high aspect ratio beams using magnetically enhanced reactive ion etching
J. Vac. Sci. Technol. B 20, 154–158 (2002)
https://doi.org/10.1116/1.1431961
Spectra characterization of silicon carbonitride thin films by reactive radio frequency sputtering
J. Vac. Sci. Technol. B 20, 159–163 (2002)
https://doi.org/10.1116/1.1431952
Thermal agglomeration of single-crystalline Si layer on buried in ultrahigh vacuum
J. Vac. Sci. Technol. B 20, 167–172 (2002)
https://doi.org/10.1116/1.1431956
Suppressing boron penetration and cobalt silicide agglomeration in deep submicron p-channel metal–oxide–semiconductor devices
J. Vac. Sci. Technol. B 20, 173–179 (2002)
https://doi.org/10.1116/1.1431960
Compact focusing system for ion and electron beams
J. Vac. Sci. Technol. B 20, 180–184 (2002)
https://doi.org/10.1116/1.1431951
Spatial distribution of reaction products in positive tone chemically amplified resists
J. Vac. Sci. Technol. B 20, 185–190 (2002)
https://doi.org/10.1116/1.1431954
Dry etching of amorphous-Si gates for deep sub-100 nm silicon-on-insulator complementary metal–oxide semiconductor
J. Vac. Sci. Technol. B 20, 191–196 (2002)
https://doi.org/10.1116/1.1431953
Etch depth control in bulk GaAs using patterning and real time spectroscopic ellipsometry
J. Vac. Sci. Technol. B 20, 197–202 (2002)
https://doi.org/10.1116/1.1431958
Low turn-on voltage Mo-polycide field emitter arrays applied to field emission flat panel display
J. Vac. Sci. Technol. B 20, 203–208 (2002)
https://doi.org/10.1116/1.1431959
Alloy layer disorder in strained-layer InAs/GaInSb/AlSb superlattices with infrared laser applications
J. Vac. Sci. Technol. B 20, 209–215 (2002)
https://doi.org/10.1116/1.1432967
Optical transitions in piezoelectrically polarized GaInN/GaN quantum wells
J. Vac. Sci. Technol. B 20, 216–218 (2002)
https://doi.org/10.1116/1.1432966
Spectroscopic characterization of acid generation and concentration and free volume evolution in chemically amplified resists
J. Vac. Sci. Technol. B 20, 219–225 (2002)
https://doi.org/10.1116/1.1432969
Ultrahigh vacuum scanning probe investigations of metal induced void formation in
J. Vac. Sci. Technol. B 20, 226–229 (2002)
https://doi.org/10.1116/1.1432968
Activation of group III combinations in silicon and modifications introduced by nitrogen
J. Vac. Sci. Technol. B 20, 230–237 (2002)
https://doi.org/10.1116/1.1432970
Field emission from chemical vapor deposition diamond surface with graphitic patches
J. Vac. Sci. Technol. B 20, 238–242 (2002)
https://doi.org/10.1116/1.1434972
High direct energy band gaps determination in coherently grown on InP
J. Vac. Sci. Technol. B 20, 243–245 (2002)
https://doi.org/10.1116/1.1434974
Heavy ion projection beam system for material modification at high ion energy
J. Vac. Sci. Technol. B 20, 246–249 (2002)
https://doi.org/10.1116/1.1434975
Strontium silicide termination and silicate epitaxy on (001) Si
J. Vac. Sci. Technol. B 20, 257–262 (2002)
https://doi.org/10.1116/1.1434968
Effects of deposition temperature on the conduction mechanisms and reliability of radio frequency sputtered thin films
J. Vac. Sci. Technol. B 20, 263–270 (2002)
https://doi.org/10.1116/1.1434971
Modified design for fabrication of metal based single electron transistors
J. Vac. Sci. Technol. B 20, 271–273 (2002)
https://doi.org/10.1116/1.1434969
Effects of photowashing treatment on electrical properties of a GaAs metal–semiconductor field-effect transistor
J. Vac. Sci. Technol. B 20, 274–277 (2002)
https://doi.org/10.1116/1.1434970
Electron field emission from hydrogen-free amorphous carbon-coated ZnO tip array
J. Vac. Sci. Technol. B 20, 278–281 (2002)
https://doi.org/10.1116/1.1445166
Dissociation of molecules during molecular beam epitaxy of GaAsP on and GaAs substrates
J. Vac. Sci. Technol. B 20, 282–285 (2002)
https://doi.org/10.1116/1.1445290
Comparative evaluation of protective coatings and focused ion beam chemical vapor deposition processes
J. Vac. Sci. Technol. B 20, 286–290 (2002)
https://doi.org/10.1116/1.1445165
Photoluminescence of GaSb self-assembled quantum dot layers grown by metalorganic chemical vapor deposition
J. Vac. Sci. Technol. B 20, 291–294 (2002)
https://doi.org/10.1116/1.1445167
Accuracy evaluation of the point diffraction interferometer for extreme ultraviolet lithography aspheric mirror
J. Vac. Sci. Technol. B 20, 295–300 (2002)
https://doi.org/10.1116/1.1445161
-based dry etching of high Q InP microdisks
J. Vac. Sci. Technol. B 20, 301–305 (2002)
https://doi.org/10.1116/1.1445164
Mechanical system construction for the EX-11 electron beam mask writer: A solution for 100 nm wafer lithography
J. Vac. Sci. Technol. B 20, 311–315 (2002)
https://doi.org/10.1116/1.1446452
Investigation of breakdown characteristic of a novel plasma display panel discharge cell with rotationally symmetric structure
J. Vac. Sci. Technol. B 20, 321–325 (2002)
https://doi.org/10.1116/1.1447248
Microscopic characterization of electron field emission
J. Vac. Sci. Technol. B 20, 326–337 (2002)
https://doi.org/10.1116/1.1447241
Measuring optical image aberrations with pattern and probe based targets
J. Vac. Sci. Technol. B 20, 338–343 (2002)
https://doi.org/10.1116/1.1447251
Effects of multilayer mask roughness on extreme ultraviolet lithography
J. Vac. Sci. Technol. B 20, 344–349 (2002)
https://doi.org/10.1116/1.1447252
Detection of chamber conditioning by plasmas in an inductively coupled plasma reactor
J. Vac. Sci. Technol. B 20, 353–363 (2002)
https://doi.org/10.1116/1.1447246
Microfabrication of silicon tip structures for multiple-probe scanning tunneling microscopy
J. Vac. Sci. Technol. B 20, 364–369 (2002)
https://doi.org/10.1116/1.1447242
Membrane mask magnification correction: Alternate technique
J. Vac. Sci. Technol. B 20, 370–372 (2002)
https://doi.org/10.1116/1.1447244
BRIEF REPORTS AND COMMENTS
Ballistic electron emission microscopy of “on-surface” self-assembled InAs dots and wetting layers
J. Vac. Sci. Technol. B 20, 373–378 (2002)
https://doi.org/10.1116/1.1430241
Deep level centers in silicon introduced by high-energy He irradiation and subsequent annealing
J. Vac. Sci. Technol. B 20, 379–381 (2002)
https://doi.org/10.1116/1.1430244
Physical understanding of moisture induced degradation of nanoporous aluminum oxide thin films
J. Vac. Sci. Technol. B 20, 382–385 (2002)
https://doi.org/10.1116/1.1430243
Fabrication of mesoscopic superconducting Nb wires using conventional electron-beam lithographic techniques
J. Vac. Sci. Technol. B 20, 386–388 (2002)
https://doi.org/10.1116/1.1445168
RAPID COMMUNICATIONS
Template-directed vapor–liquid–solid growth of silicon nanowires
J. Vac. Sci. Technol. B 20, 389–392 (2002)
https://doi.org/10.1116/1.1430240
Lateral force on fluoroalkylsilane self-assembled monolayers dependent on molecular ordering
J. Vac. Sci. Technol. B 20, 393–395 (2002)
https://doi.org/10.1116/1.1431955
Lower sheet/contact resistance in shallower junction obtained by F+B mixed implant
J. Vac. Sci. Technol. B 20, 396–399 (2002)
https://doi.org/10.1116/1.1447247
Electrical characteristics of ultrathin prepared by wet oxidation of an ultrathin Zr-metal layer
J. Vac. Sci. Technol. B 20, 400–403 (2002)
https://doi.org/10.1116/1.1447245
PAPERS FROM THE SIXTH INTERNATIONAL WORKSHOP ON FABRICATION, CHARACTERIZATION, AND MODELING OF ULTRA-SHALLOW DOPING PROFILES IN SEMICONDUCTORS
Two-dimensional effects on ultralow energy B implants in Si
J. Vac. Sci. Technol. B 20, 414–418 (2002)
https://doi.org/10.1116/1.1424277
Defect engineering: An approach on ultrashallow junction in silicon
J. Vac. Sci. Technol. B 20, 419–421 (2002)
https://doi.org/10.1116/1.1424283
Study of reverse annealing behaviors of ultrashallow junction formed using solid phase epitaxial annealing
J. Vac. Sci. Technol. B 20, 422–426 (2002)
https://doi.org/10.1116/1.1424279
Room-temperature evolution of vacancy-type damage created by 2 keV implantation of Si
J. Vac. Sci. Technol. B 20, 427–430 (2002)
https://doi.org/10.1116/1.1447249
Nondestructive analysis of ultrashallow junction implant damage by combined technology of thermal wave and spectroscopic methods
J. Vac. Sci. Technol. B 20, 431–435 (2002)
https://doi.org/10.1116/1.1446453
Quantitative determination of dopant dose in shallow implants using the low energy x-ray emission spectroscopy technique
J. Vac. Sci. Technol. B 20, 436–440 (2002)
https://doi.org/10.1116/1.1424282
Quantitative analysis of nitrogen in oxynitrides on silicon by secondary ion mass spectrometry?
J. Vac. Sci. Technol. B 20, 441–447 (2002)
https://doi.org/10.1116/1.1447250
Backside sputter depth profiling of phosphorus diffusion from a polysilicon source
J. Vac. Sci. Technol. B 20, 448–450 (2002)
https://doi.org/10.1116/1.1424281
Spreading resistance roadmap towards and beyond the 70 nm technology node
J. Vac. Sci. Technol. B 20, 451–458 (2002)
https://doi.org/10.1116/1.1446455
Impact of probe penetration on the electrical characterization of sub-50 nm profiles
J. Vac. Sci. Technol. B 20, 459–466 (2002)
https://doi.org/10.1116/1.1432965
Scanning spreading resistance microscopy and spectroscopy for routine and quantitative two-dimensional carrier profiling
J. Vac. Sci. Technol. B 20, 471–478 (2002)
https://doi.org/10.1116/1.1424280
Capacitance sensor with sub-zeptofarad F) sensitivity for scanning capacitance microscopy
J. Vac. Sci. Technol. B 20, 479–482 (2002)
https://doi.org/10.1116/1.1424278
Characterization of ultrashallow dopant profiles using spreading resistance profiling
J. Vac. Sci. Technol. B 20, 483–487 (2002)
https://doi.org/10.1116/1.1426370
Product wafer monitoring of ultrashallow channel implants with an elastic metal gate
J. Vac. Sci. Technol. B 20, 488–491 (2002)
https://doi.org/10.1116/1.1424284
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Heating of photocathode via field emission and radiofrequency pulsed heating: Implication toward breakdown
Ryo Shinohara, Soumendu Bagchi, et al.